JPS5760091A - Copper-tin alloy plating bath - Google Patents

Copper-tin alloy plating bath

Info

Publication number
JPS5760091A
JPS5760091A JP13562580A JP13562580A JPS5760091A JP S5760091 A JPS5760091 A JP S5760091A JP 13562580 A JP13562580 A JP 13562580A JP 13562580 A JP13562580 A JP 13562580A JP S5760091 A JPS5760091 A JP S5760091A
Authority
JP
Japan
Prior art keywords
alloy plating
plating bath
copper
glycol
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13562580A
Other languages
Japanese (ja)
Inventor
Kenichi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP13562580A priority Critical patent/JPS5760091A/en
Publication of JPS5760091A publication Critical patent/JPS5760091A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To obtain a Cu-Sn alloy plating bath giving bright Cu-Sn alloy plating by adding a glycol compound and Rochelle salt to a Cu-Sn alloy plating bath contg. copper cyanide and tin pyrophosphate.
CONSTITUTION: By adding 5W30g/l glycol compound and 20W100g/l Rochelle salt to said Cu-Sn alloy plating bath, a novel Cu-Sn alloy plating bath contg. copper cyanide and time pyrophosphate is obtd. As said glycol compound ethylene glycol, trimethylene glycol or a polymer thereof is used. this plating bath is adjusted to 7.5W10pH and used at 55W75°C. An insoluble anode or a Cu-Sn alloy anode is used. The bath is applicable in a wide current density range and has superior stability, so it gives uniform and bright Cu-Sn alloy plating.
COPYRIGHT: (C)1982,JPO&Japio
JP13562580A 1980-09-29 1980-09-29 Copper-tin alloy plating bath Pending JPS5760091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13562580A JPS5760091A (en) 1980-09-29 1980-09-29 Copper-tin alloy plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13562580A JPS5760091A (en) 1980-09-29 1980-09-29 Copper-tin alloy plating bath

Publications (1)

Publication Number Publication Date
JPS5760091A true JPS5760091A (en) 1982-04-10

Family

ID=15156173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13562580A Pending JPS5760091A (en) 1980-09-29 1980-09-29 Copper-tin alloy plating bath

Country Status (1)

Country Link
JP (1) JPS5760091A (en)

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