JPS5623297A - Partial plating method - Google Patents

Partial plating method

Info

Publication number
JPS5623297A
JPS5623297A JP9757679A JP9757679A JPS5623297A JP S5623297 A JPS5623297 A JP S5623297A JP 9757679 A JP9757679 A JP 9757679A JP 9757679 A JP9757679 A JP 9757679A JP S5623297 A JPS5623297 A JP S5623297A
Authority
JP
Japan
Prior art keywords
plated
electrode
portions
plating
partial plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9757679A
Other languages
Japanese (ja)
Inventor
Hisao Kitahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP9757679A priority Critical patent/JPS5623297A/en
Publication of JPS5623297A publication Critical patent/JPS5623297A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To perform micro-partial plating with good workability by placing a nonmetallic conductor, a material to be plated and an electrode of a desired plating shape in electrolyte and performing electrolysis, with the electrode as anode and the material to be plated as cathode.
CONSTITUTION: A nonmetallic conductor 1, a material 2 to be plated and an electrode 3 assuming a desired plating shape are disposed in electrolyte and electrolysis is performed with the electrode 3 as anode and the material 2 to be plated as cathode, whereby partial plating is accomplished on the material 2 to be plated. However, in the case of gold plating or the like, electrolytically replaced deposition occurs on the portions other than the desired plating portions. Because of this, the portions of the matrial to be plated other than the portions opposing to the electrode end are sometimes coated with a nonconductor.
COPYRIGHT: (C)1981,JPO&Japio
JP9757679A 1979-07-31 1979-07-31 Partial plating method Pending JPS5623297A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9757679A JPS5623297A (en) 1979-07-31 1979-07-31 Partial plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9757679A JPS5623297A (en) 1979-07-31 1979-07-31 Partial plating method

Publications (1)

Publication Number Publication Date
JPS5623297A true JPS5623297A (en) 1981-03-05

Family

ID=14196058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9757679A Pending JPS5623297A (en) 1979-07-31 1979-07-31 Partial plating method

Country Status (1)

Country Link
JP (1) JPS5623297A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59194490A (en) * 1983-04-18 1984-11-05 松下電器産業株式会社 Method of producing printed board
JPS6240733A (en) * 1985-08-15 1987-02-21 Ascii Corp Ic cartridge

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59194490A (en) * 1983-04-18 1984-11-05 松下電器産業株式会社 Method of producing printed board
JPS6240733A (en) * 1985-08-15 1987-02-21 Ascii Corp Ic cartridge
JPH0328078B2 (en) * 1985-08-15 1991-04-17 Ascii Corp

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