JPS556499A - Forming method of highly adhesive silver thin film - Google Patents

Forming method of highly adhesive silver thin film

Info

Publication number
JPS556499A
JPS556499A JP8495579A JP8495579A JPS556499A JP S556499 A JPS556499 A JP S556499A JP 8495579 A JP8495579 A JP 8495579A JP 8495579 A JP8495579 A JP 8495579A JP S556499 A JPS556499 A JP S556499A
Authority
JP
Japan
Prior art keywords
silver
concentration
cathode
bath
complex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8495579A
Other languages
Japanese (ja)
Inventor
Yoshihiro Suzuki
Mitsuru Ura
Hiroshi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8495579A priority Critical patent/JPS556499A/en
Publication of JPS556499A publication Critical patent/JPS556499A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To improve the adhesiveness of silver thin film by specifying the complex compound forming constant and concentration with silver of complex forming agents of silver other than thiocyanic acid in a bath, silver ion concentration, inter- electrode voltage and cathode current density.
CONSTITUTION: The object to be plated composed of metals of baser ionization tendency than silver are put as cathode in the plating bath of 1×106 to 1×1015 at 25°C in the complex compound forming constant with silver other than thiocyanic acid, 10-2mol/l or over in concentration of the complex forming agent of silver (except thiocyanic acid) and 10-5 to 10-2mol/l in concentration of silver ions. DC voltage of maximum 2V is applied between this cathode and anode and electroplating is accomplished at cathode current densities 10-1 to 102mA/dm2. In this way, the substituting plating film is slowly formed at low current densities by lowering the silver concentration in the bath and allowing such complex forming agents (NH3, S2O3 --, etc.) in which silver stably exists to exist in large volume. Thick deposition plating of silver on this plating film may be readily performed.
COPYRIGHT: (C)1980,JPO&Japio
JP8495579A 1979-07-06 1979-07-06 Forming method of highly adhesive silver thin film Pending JPS556499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8495579A JPS556499A (en) 1979-07-06 1979-07-06 Forming method of highly adhesive silver thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8495579A JPS556499A (en) 1979-07-06 1979-07-06 Forming method of highly adhesive silver thin film

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP7989177A Division JPS5415431A (en) 1977-07-06 1977-07-06 Method of forming highly adehsive thin silver film

Publications (1)

Publication Number Publication Date
JPS556499A true JPS556499A (en) 1980-01-17

Family

ID=13845048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8495579A Pending JPS556499A (en) 1979-07-06 1979-07-06 Forming method of highly adhesive silver thin film

Country Status (1)

Country Link
JP (1) JPS556499A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60231523A (en) * 1984-03-29 1985-11-18 Hitachi Cable Ltd Inside surface treatment of metallic pipe material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60231523A (en) * 1984-03-29 1985-11-18 Hitachi Cable Ltd Inside surface treatment of metallic pipe material

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