JPS556499A - Forming method of highly adhesive silver thin film - Google Patents
Forming method of highly adhesive silver thin filmInfo
- Publication number
- JPS556499A JPS556499A JP8495579A JP8495579A JPS556499A JP S556499 A JPS556499 A JP S556499A JP 8495579 A JP8495579 A JP 8495579A JP 8495579 A JP8495579 A JP 8495579A JP S556499 A JPS556499 A JP S556499A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- concentration
- cathode
- bath
- complex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To improve the adhesiveness of silver thin film by specifying the complex compound forming constant and concentration with silver of complex forming agents of silver other than thiocyanic acid in a bath, silver ion concentration, inter- electrode voltage and cathode current density.
CONSTITUTION: The object to be plated composed of metals of baser ionization tendency than silver are put as cathode in the plating bath of 1×106 to 1×1015 at 25°C in the complex compound forming constant with silver other than thiocyanic acid, 10-2mol/l or over in concentration of the complex forming agent of silver (except thiocyanic acid) and 10-5 to 10-2mol/l in concentration of silver ions. DC voltage of maximum 2V is applied between this cathode and anode and electroplating is accomplished at cathode current densities 10-1 to 102mA/dm2. In this way, the substituting plating film is slowly formed at low current densities by lowering the silver concentration in the bath and allowing such complex forming agents (NH3, S2O3 --, etc.) in which silver stably exists to exist in large volume. Thick deposition plating of silver on this plating film may be readily performed.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8495579A JPS556499A (en) | 1979-07-06 | 1979-07-06 | Forming method of highly adhesive silver thin film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8495579A JPS556499A (en) | 1979-07-06 | 1979-07-06 | Forming method of highly adhesive silver thin film |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7989177A Division JPS5415431A (en) | 1977-07-06 | 1977-07-06 | Method of forming highly adehsive thin silver film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS556499A true JPS556499A (en) | 1980-01-17 |
Family
ID=13845048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8495579A Pending JPS556499A (en) | 1979-07-06 | 1979-07-06 | Forming method of highly adhesive silver thin film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS556499A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60231523A (en) * | 1984-03-29 | 1985-11-18 | Hitachi Cable Ltd | Inside surface treatment of metallic pipe material |
-
1979
- 1979-07-06 JP JP8495579A patent/JPS556499A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60231523A (en) * | 1984-03-29 | 1985-11-18 | Hitachi Cable Ltd | Inside surface treatment of metallic pipe material |
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