GB1368318A - Tin-lead electroplating baths - Google Patents

Tin-lead electroplating baths

Info

Publication number
GB1368318A
GB1368318A GB4925671A GB4925671A GB1368318A GB 1368318 A GB1368318 A GB 1368318A GB 4925671 A GB4925671 A GB 4925671A GB 4925671 A GB4925671 A GB 4925671A GB 1368318 A GB1368318 A GB 1368318A
Authority
GB
United Kingdom
Prior art keywords
bath
lead
tin
acid
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4925671A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KENVERT INT CORP
Original Assignee
KENVERT INT CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26769076&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=GB1368318(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by KENVERT INT CORP filed Critical KENVERT INT CORP
Publication of GB1368318A publication Critical patent/GB1368318A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/34—Electroplating: Baths therefor from solutions of lead
    • C25D3/36—Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1368318 Electro-deposition of lead, tin and alloys thereof KENVERT INTERNATIONAL CORP 22 Oct 1971 [22 Oct 1970 6 July 1971] 49256/71 Heading C7B Lead, tin or an alloy of tin and lead is electrodeposited from a bath having a pH of less than 3 and containing stannous and/or lead ions, fluoborate, fluosilicate and/or a sulphanate e.g. phenolsulphanate and either a) an alkoxylated fatty acid alkylolamide surface active agent or b) a mixture of a nonionic polyalkoxylated surface active agent and a brightener component comprising at leat 4g/l lower aliphatic aldehyde and at least 0À25 g/l of an aromatic aldehyde. The bath may also include a carbonyl brightener; a chelating agent, e.g. citric acid, malic acid, or amino poly acetic acid (e.g. EDTA, ETPA, nitrilotriacetic acid); an organic solvent, e.g. alcohol or glycol ether; and may be saturated with boric acid, e.g. by suspending a bag of boric acid in the bath. The bath may be continuously filtered during use. When depositing Pb/Su alloy the anodes may be Pb/Sn alloy; or separate anodes of Pb and Sn may be provided, the current distribution between the different anodes controlling the content of the deposited alloy. The substrate coated may be copper, nickel, iron or steel; and may be passed through the bath at speeds > 150 ft/min.
GB4925671A 1970-10-22 1971-11-22 Tin-lead electroplating baths Expired GB1368318A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8322970A 1970-10-22 1970-10-22
US16010971A 1971-07-06 1971-07-06

Publications (1)

Publication Number Publication Date
GB1368318A true GB1368318A (en) 1974-09-25

Family

ID=26769076

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4925671A Expired GB1368318A (en) 1970-10-22 1971-11-22 Tin-lead electroplating baths

Country Status (8)

Country Link
US (2) US3785939A (en)
AU (1) AU458608B2 (en)
CA (1) CA972704A (en)
DE (1) DE2152785C2 (en)
FR (1) FR2111779B1 (en)
GB (1) GB1368318A (en)
MY (1) MY7500186A (en)
SE (1) SE392132B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0180804A1 (en) * 1984-11-07 1986-05-14 Dr.Ing. Max Schlötter GmbH & Co. KG Process for maintaining the solderability of lead-tin coatings, and plated holes printed circuit board

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3749649A (en) * 1971-12-16 1973-07-31 M & T Chemicals Inc Bright tin-lead alloy plating
US3926749A (en) * 1971-12-20 1975-12-16 M & T Chemicals Inc Tin-lead alloy plating
GB1469547A (en) * 1973-06-28 1977-04-06 Minnesota Mining & Mfg Tin/lead electr-plating baths
US3875029A (en) * 1974-02-19 1975-04-01 R O Hull & Company Inc Plating bath for electrodeposition of bright tin and tin-lead alloy
US4053372A (en) * 1975-10-09 1977-10-11 Amp Incorporated Tin-lead acidic plating bath
CA1077430A (en) * 1975-11-28 1980-05-13 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4067781A (en) * 1977-01-10 1978-01-10 Rapids Felix R Method for electroplating
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
GB2013241B (en) * 1977-11-16 1982-03-24 Dipsol Chem Electroplating bath for depositing tin or tin alloy with brightness
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (en) * 1981-09-08 1983-03-09 Occidental Chem Co ELECTROPLETING FOR PROVISION OF TIN LEAD ALLOYS ON DIFFERENT SUBSTRACTS
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4765871A (en) * 1981-12-28 1988-08-23 The Boeing Company Zinc-nickel electroplated article and method for producing the same
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4640746A (en) * 1984-10-11 1987-02-03 Learonal, Inc. Bath and process for plating tin/lead alloys on composite substrates
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4681670A (en) * 1985-09-11 1987-07-21 Learonal, Inc. Bath and process for plating tin-lead alloys
EP0652306B1 (en) * 1987-12-10 2000-09-27 LeaRonal, Inc. Tin, lead or tin/lead alloy electrolytes for high-speed electroplating
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
US4844780A (en) * 1988-02-17 1989-07-04 Maclee Chemical Company, Inc. Brightener and aqueous plating bath for tin and/or lead
US4849059A (en) * 1988-09-13 1989-07-18 Macdermid, Incorporated Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
AU2927392A (en) * 1991-11-01 1993-06-07 National-Standard Company Age resistant solder coatings
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5346607A (en) * 1992-09-30 1994-09-13 Weirton Steel Corporation Electrolytic tinplating and product
DE4422756C1 (en) * 1994-06-29 1995-04-20 Goldschmidt Ag Th Self-regulating, acid electrolyte for dip tinning of aluminium alloys
US5560813A (en) * 1994-09-09 1996-10-01 National Science Council Solder electroplating solution containing gelatin
US8974386B2 (en) 1998-04-30 2015-03-10 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US20080076997A1 (en) * 1998-04-30 2008-03-27 Abbott Diabetes Care, Inc. Analyte monitoring device and methods of use
US8346337B2 (en) 1998-04-30 2013-01-01 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US6949816B2 (en) 2003-04-21 2005-09-27 Motorola, Inc. Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same
US8688188B2 (en) 1998-04-30 2014-04-01 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8465425B2 (en) 1998-04-30 2013-06-18 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US9066695B2 (en) * 1998-04-30 2015-06-30 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US6175752B1 (en) * 1998-04-30 2001-01-16 Therasense, Inc. Analyte monitoring device and methods of use
US8480580B2 (en) 1998-04-30 2013-07-09 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US6560471B1 (en) * 2001-01-02 2003-05-06 Therasense, Inc. Analyte monitoring device and methods of use
US6582582B2 (en) 2001-03-09 2003-06-24 Donald Becking Electroplating composition and process
AU2002309528A1 (en) * 2001-04-02 2002-10-15 Therasense, Inc. Blood glucose tracking apparatus and methods
US6562221B2 (en) 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
JP2004002970A (en) * 2002-03-05 2004-01-08 Shipley Co Llc Restriction of tin loss caused by oxidation in tin or tin alloy electroplating solution
US7273540B2 (en) * 2002-07-25 2007-09-25 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
EP1578262A4 (en) 2002-12-31 2007-12-05 Therasense Inc Continuous glucose monitoring system and methods of use
US20080064937A1 (en) * 2006-06-07 2008-03-13 Abbott Diabetes Care, Inc. Analyte monitoring system and method
JP5622360B2 (en) * 2009-01-16 2014-11-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Electrotin plating solution and electrotin plating method
US8834958B2 (en) 2011-07-08 2014-09-16 The United States Of America As Represented By The Secretary Of The Army Process of making negative electrode

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2460252A (en) * 1946-02-09 1949-01-25 Harshaw Chem Corp Lead-tin alloy plating
BE508197A (en) * 1951-01-12
US2773819A (en) * 1954-01-13 1956-12-11 Harshaw Chem Corp Electrodeposition of lead
AT252681B (en) * 1963-08-28 1967-03-10 Max Schloetter Fa Dr Ing Galvanic baths for the electrolytic deposition of bright to shiny tin layers
NL124247C (en) * 1963-08-28
NL128321C (en) * 1965-02-13
GB1151460A (en) * 1967-10-09 1969-05-07 Motohiko Kanai Improvements in and relating to the Electroplating of Tin-Lead Alloy
US3661730A (en) * 1969-09-22 1972-05-09 Kazuo Nishihara Process for the formation of a super-bright solder coating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0180804A1 (en) * 1984-11-07 1986-05-14 Dr.Ing. Max Schlötter GmbH & Co. KG Process for maintaining the solderability of lead-tin coatings, and plated holes printed circuit board

Also Published As

Publication number Publication date
AU458608B2 (en) 1975-03-06
AU3484271A (en) 1973-05-03
CA972704A (en) 1975-08-12
DE2152785A1 (en) 1972-05-04
SE392132B (en) 1977-03-14
DE2152785C2 (en) 1982-07-01
MY7500186A (en) 1975-12-31
FR2111779A1 (en) 1972-06-09
US3769182A (en) 1973-10-30
US3785939A (en) 1974-01-15
FR2111779B1 (en) 1975-02-07

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee