JPS57140884A - Plating method for silver - Google Patents

Plating method for silver

Info

Publication number
JPS57140884A
JPS57140884A JP2577881A JP2577881A JPS57140884A JP S57140884 A JPS57140884 A JP S57140884A JP 2577881 A JP2577881 A JP 2577881A JP 2577881 A JP2577881 A JP 2577881A JP S57140884 A JPS57140884 A JP S57140884A
Authority
JP
Japan
Prior art keywords
plating
plated
density
alloy
effect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2577881A
Other languages
Japanese (ja)
Other versions
JPS5836064B2 (en
Inventor
Akira Otsuka
Kazuo Kanehiro
Nobuo Ogasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2577881A priority Critical patent/JPS5836064B2/en
Publication of JPS57140884A publication Critical patent/JPS57140884A/en
Publication of JPS5836064B2 publication Critical patent/JPS5836064B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To enhance the adhesion of an Ag plated film by controlling and changing the current density of electric current for plating when an Fe-Ni alloy is plated with Ag.
CONSTITUTION: The surface of an Fe-Ni alloy contg. 42% Ni is degreased, washed with an aqueous hydrochloric acid soln., and electroplated with Ag in an Ag plating soln. At this time, plating is first carried out at a higher current density of electric current for plating to produce the same effect as strinking has, the density is then reduced to form a dense plated layer, and finally the density is increased again to form a plated layer in the necessary thickness. Thus, an Ag plated film having superior adhesion and an effect as if it was Ag plated film having superior adhesion and an effect as if it was formed by striking is obtd. on the Fe-Ni alloy as a substrate.
COPYRIGHT: (C)1982,JPO&Japio
JP2577881A 1981-02-23 1981-02-23 Silver plating method Expired JPS5836064B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2577881A JPS5836064B2 (en) 1981-02-23 1981-02-23 Silver plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2577881A JPS5836064B2 (en) 1981-02-23 1981-02-23 Silver plating method

Publications (2)

Publication Number Publication Date
JPS57140884A true JPS57140884A (en) 1982-08-31
JPS5836064B2 JPS5836064B2 (en) 1983-08-06

Family

ID=12175294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2577881A Expired JPS5836064B2 (en) 1981-02-23 1981-02-23 Silver plating method

Country Status (1)

Country Link
JP (1) JPS5836064B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846114A (en) * 1995-06-22 1996-02-16 Yamaha Corp Semiconductor device and its manufacture
JP2007254855A (en) * 2006-03-24 2007-10-04 Dowa Holdings Co Ltd Silver plated metal member for electronic component and method for manufacturing the same
JP2008088493A (en) * 2006-09-29 2008-04-17 Dowa Holdings Co Ltd Silver plated metallic member and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846114A (en) * 1995-06-22 1996-02-16 Yamaha Corp Semiconductor device and its manufacture
JP2007254855A (en) * 2006-03-24 2007-10-04 Dowa Holdings Co Ltd Silver plated metal member for electronic component and method for manufacturing the same
JP2008088493A (en) * 2006-09-29 2008-04-17 Dowa Holdings Co Ltd Silver plated metallic member and method of manufacturing the same

Also Published As

Publication number Publication date
JPS5836064B2 (en) 1983-08-06

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