JPS54149335A - Silver plating method for lead frame - Google Patents
Silver plating method for lead frameInfo
- Publication number
- JPS54149335A JPS54149335A JP5790578A JP5790578A JPS54149335A JP S54149335 A JPS54149335 A JP S54149335A JP 5790578 A JP5790578 A JP 5790578A JP 5790578 A JP5790578 A JP 5790578A JP S54149335 A JPS54149335 A JP S54149335A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- plated
- mat
- frame
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title abstract 13
- 229910052709 silver Inorganic materials 0.000 title abstract 13
- 239000004332 silver Substances 0.000 title abstract 13
- 238000007747 plating Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- 229910001316 Ag alloy Inorganic materials 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005238 degreasing Methods 0.000 abstract 1
- 238000005868 electrolysis reaction Methods 0.000 abstract 1
- 238000005554 pickling Methods 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To enhance the adherence of mat silver plating without lowering the corrosion resistance, solderability and bondability by plating the surface of a lead frame with bright silver followed by mat silver plating.
CONSTITUTION: The surface of a lead frame is cleaned and activated by degreasing and pickling, optionally ground-plated with copper or Ni by a usual method, and plated with silver or silver alloy by striking. The frame thus pretreated is plated with bright silver and further plated with mat silver. At this time, it is required to plate bright silver to above 2 μ in thickness. Otherwise, the frame is similarly plated with bright silver to above 2.5μ in thickness and optionally plated with mat silver in a silver plating soln. contg. no brightener. Reverse electrolysis is then carried out using the plated frame as an anode to elute the silver plated layer to 0.5W2μ in thickness, forming a mat silver plated surface.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5790578A JPS54149335A (en) | 1978-05-16 | 1978-05-16 | Silver plating method for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5790578A JPS54149335A (en) | 1978-05-16 | 1978-05-16 | Silver plating method for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54149335A true JPS54149335A (en) | 1979-11-22 |
Family
ID=13068995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5790578A Pending JPS54149335A (en) | 1978-05-16 | 1978-05-16 | Silver plating method for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54149335A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020143307A (en) * | 2019-03-04 | 2020-09-10 | Ｄｏｗａメタルテック株式会社 | Silver plated material, and method of producing the same |
-
1978
- 1978-05-16 JP JP5790578A patent/JPS54149335A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020143307A (en) * | 2019-03-04 | 2020-09-10 | Ｄｏｗａメタルテック株式会社 | Silver plated material, and method of producing the same |
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