JPS54149335A - Silver plating method for lead frame - Google Patents

Silver plating method for lead frame

Info

Publication number
JPS54149335A
JPS54149335A JP5790578A JP5790578A JPS54149335A JP S54149335 A JPS54149335 A JP S54149335A JP 5790578 A JP5790578 A JP 5790578A JP 5790578 A JP5790578 A JP 5790578A JP S54149335 A JPS54149335 A JP S54149335A
Authority
JP
Japan
Prior art keywords
silver
plated
mat
frame
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5790578A
Other languages
Japanese (ja)
Inventor
Shoji Shiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Original Assignee
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUKAWA KINZOKU KOGYO KK, Furukawa Metals Co Ltd, Furukawa Electric Co Ltd filed Critical FURUKAWA KINZOKU KOGYO KK
Priority to JP5790578A priority Critical patent/JPS54149335A/en
Publication of JPS54149335A publication Critical patent/JPS54149335A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To enhance the adherence of mat silver plating without lowering the corrosion resistance, solderability and bondability by plating the surface of a lead frame with bright silver followed by mat silver plating.
CONSTITUTION: The surface of a lead frame is cleaned and activated by degreasing and pickling, optionally ground-plated with copper or Ni by a usual method, and plated with silver or silver alloy by striking. The frame thus pretreated is plated with bright silver and further plated with mat silver. At this time, it is required to plate bright silver to above 2 μ in thickness. Otherwise, the frame is similarly plated with bright silver to above 2.5μ in thickness and optionally plated with mat silver in a silver plating soln. contg. no brightener. Reverse electrolysis is then carried out using the plated frame as an anode to elute the silver plated layer to 0.5W2μ in thickness, forming a mat silver plated surface.
COPYRIGHT: (C)1979,JPO&Japio
JP5790578A 1978-05-16 1978-05-16 Silver plating method for lead frame Pending JPS54149335A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5790578A JPS54149335A (en) 1978-05-16 1978-05-16 Silver plating method for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5790578A JPS54149335A (en) 1978-05-16 1978-05-16 Silver plating method for lead frame

Publications (1)

Publication Number Publication Date
JPS54149335A true JPS54149335A (en) 1979-11-22

Family

ID=13068995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5790578A Pending JPS54149335A (en) 1978-05-16 1978-05-16 Silver plating method for lead frame

Country Status (1)

Country Link
JP (1) JPS54149335A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020143307A (en) * 2019-03-04 2020-09-10 Dowaメタルテック株式会社 Silver plated material, and method of producing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020143307A (en) * 2019-03-04 2020-09-10 Dowaメタルテック株式会社 Silver plated material, and method of producing the same

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