JPS5767187A - Manufacture of cu-sn composite material - Google Patents

Manufacture of cu-sn composite material

Info

Publication number
JPS5767187A
JPS5767187A JP14263680A JP14263680A JPS5767187A JP S5767187 A JPS5767187 A JP S5767187A JP 14263680 A JP14263680 A JP 14263680A JP 14263680 A JP14263680 A JP 14263680A JP S5767187 A JPS5767187 A JP S5767187A
Authority
JP
Japan
Prior art keywords
alloy
composite material
plating
manufacture
mat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14263680A
Other languages
Japanese (ja)
Other versions
JPS582598B2 (en
Inventor
Hitoshi Kato
Shoji Shiga
Tadashi Naruse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP14263680A priority Critical patent/JPS582598B2/en
Publication of JPS5767187A publication Critical patent/JPS5767187A/en
Publication of JPS582598B2 publication Critical patent/JPS582598B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To enhance the external brightness, corrosion resistance, etc. of a Cu-Sn composite material by coating Cu or a Cu alloy with Sn or an Sn alloy by mat and smooth plating and by rolling the resulting material.
CONSTITUTION: Cu or a Cu alloy for parts of an electric or electronic apparatus is cleaned by degreasing, pickling, washing, etc., and it is undercoated with Cu by plating as required. This material is coated with a mat and smooth film of Sn or an alloy of Sn and Pb, Zn, etc. having fine crystal structure by plating with an Sn or Sn alloy plating soln. contg. no brightener to manufacture a Cu-Sn composite material. By rolling this composite material at 2W30% reduction ratio, pinholes existing in the plated film disappear, and electric corrosion due to pinholes is prevented to enhance the corrosion resistance. Superior external brightness, adhesion, bendability, whisker preventiveness, etc. are also provided.
COPYRIGHT: (C)1982,JPO&Japio
JP14263680A 1980-10-13 1980-10-13 Manufacturing method of Cu-Sn composite material Expired JPS582598B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14263680A JPS582598B2 (en) 1980-10-13 1980-10-13 Manufacturing method of Cu-Sn composite material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14263680A JPS582598B2 (en) 1980-10-13 1980-10-13 Manufacturing method of Cu-Sn composite material

Publications (2)

Publication Number Publication Date
JPS5767187A true JPS5767187A (en) 1982-04-23
JPS582598B2 JPS582598B2 (en) 1983-01-17

Family

ID=15319952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14263680A Expired JPS582598B2 (en) 1980-10-13 1980-10-13 Manufacturing method of Cu-Sn composite material

Country Status (1)

Country Link
JP (1) JPS582598B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260839A (en) * 1985-09-09 1987-03-17 Hitachi Cable Ltd Alloy for surface treatment
US4935312A (en) * 1987-06-25 1990-06-19 Nippon Mining Co., Ltd. Film carrier having tin and indium plated layers
EP0913494A2 (en) * 1997-10-31 1999-05-06 STOLBERGER METALLWERKE GMBH & CO. KG Process for producing an electrically conductive metallic strip
US6818322B2 (en) 2001-02-22 2004-11-16 Nippon Steel Corporation Surface treated steel sheet with less environmental impact for electronic components, excellent in solder wettability, a rust-proof property and a whisker-proof property
JP2004339605A (en) * 2003-05-12 2004-12-02 Rohm & Haas Electronic Materials Llc Improved tin-plating method
JP2009263699A (en) * 2008-04-23 2009-11-12 Toyota Motor Corp METHOD OF MANUFACTURING PLATED BASE MATERIAL HAVING Sn PLATED LAYER
US9834848B2 (en) 2014-06-25 2017-12-05 Nisshin Steel Co., Ltd. Sn-plated stainless steel sheet

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260839A (en) * 1985-09-09 1987-03-17 Hitachi Cable Ltd Alloy for surface treatment
US4935312A (en) * 1987-06-25 1990-06-19 Nippon Mining Co., Ltd. Film carrier having tin and indium plated layers
EP0913494A2 (en) * 1997-10-31 1999-05-06 STOLBERGER METALLWERKE GMBH & CO. KG Process for producing an electrically conductive metallic strip
US6205643B1 (en) * 1997-10-31 2001-03-27 Stolberger Metallwerke Gmbh & Co. Kg Method for manufacturing an electrically conductive metallic strip
EP0913494A3 (en) * 1997-10-31 2002-05-29 STOLBERGER METALLWERKE GMBH & CO. KG Process for producing an electrically conductive metallic strip
US6818322B2 (en) 2001-02-22 2004-11-16 Nippon Steel Corporation Surface treated steel sheet with less environmental impact for electronic components, excellent in solder wettability, a rust-proof property and a whisker-proof property
JP2004339605A (en) * 2003-05-12 2004-12-02 Rohm & Haas Electronic Materials Llc Improved tin-plating method
JP4603812B2 (en) * 2003-05-12 2010-12-22 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Improved tin plating method
JP2009263699A (en) * 2008-04-23 2009-11-12 Toyota Motor Corp METHOD OF MANUFACTURING PLATED BASE MATERIAL HAVING Sn PLATED LAYER
US9834848B2 (en) 2014-06-25 2017-12-05 Nisshin Steel Co., Ltd. Sn-plated stainless steel sheet

Also Published As

Publication number Publication date
JPS582598B2 (en) 1983-01-17

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