EP0913494A3 - Process for producing an electrically conductive metallic strip - Google Patents
Process for producing an electrically conductive metallic strip Download PDFInfo
- Publication number
- EP0913494A3 EP0913494A3 EP98120208A EP98120208A EP0913494A3 EP 0913494 A3 EP0913494 A3 EP 0913494A3 EP 98120208 A EP98120208 A EP 98120208A EP 98120208 A EP98120208 A EP 98120208A EP 0913494 A3 EP0913494 A3 EP 0913494A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- thickness
- producing
- strip
- electrically conductive
- conductive metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49982—Coating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
- Metal Rolling (AREA)
- Contacts (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Die Erfindung betrifft ein Verfahren zur Herstellung eines elektrisch leitfähigen metallischen Bands zur Fertigung von Steckkontaktelementen. Hierbei wird zunächst ein Ausgangsband (2) aus Kupfer oder einer Kupferlegierung, welches eine gegenüber seiner Enddicke (DE) größere Anfangsdicke (DA) aufweist, verzinnt. Anschließend erfolgt eine walzende Verformung des verzinnten Ausgangsbands (2) mit einer Reduzierung der Banddicke (D1) bis zu einer Fertigungsdicke (D2) unter gleichzeitiger Reduzierung der Dicke des Ausgangsbands (2). The invention relates to a method for producing an electrically conductive metallic tape for producing plug contact elements. Here, an initial strip (2) made of copper or a copper alloy, which has a larger initial thickness (D A ) than its final thickness (D E ), is tinned. This is followed by a rolling deformation of the tinned starting strip (2) with a reduction in the strip thickness (D 1 ) to a production thickness (D 2 ) with a simultaneous reduction in the thickness of the starting strip (2).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19748306 | 1997-10-31 | ||
DE19748306A DE19748306A1 (en) | 1997-10-31 | 1997-10-31 | Process for producing an electrically conductive metallic tape |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0913494A2 EP0913494A2 (en) | 1999-05-06 |
EP0913494A3 true EP0913494A3 (en) | 2002-05-29 |
Family
ID=7847311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98120208A Withdrawn EP0913494A3 (en) | 1997-10-31 | 1998-10-24 | Process for producing an electrically conductive metallic strip |
Country Status (5)
Country | Link |
---|---|
US (1) | US6205643B1 (en) |
EP (1) | EP0913494A3 (en) |
JP (1) | JPH11162612A (en) |
KR (1) | KR19990036624A (en) |
DE (1) | DE19748306A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005013103A1 (en) * | 2005-03-18 | 2006-09-28 | Sms Demag Ag | Controlled thickness reduction in hot-dip coated hot rolled steel strip and equipment used in this case |
JP4828884B2 (en) * | 2005-07-26 | 2011-11-30 | 株式会社東芝 | Printed circuit wiring board and electronic device |
KR100793644B1 (en) * | 2007-05-02 | 2008-01-10 | (주)알오호일 | Method of manufacturing thin metal strip |
CN103258582A (en) * | 2013-06-05 | 2013-08-21 | 无锡市斯威克科技有限公司 | Tin-plated copper belt with identification mark |
CN115805236A (en) * | 2023-02-09 | 2023-03-17 | 西安稀有金属材料研究院有限公司 | Process for preparing kovar alloy/AgCu alloy composite foil strip |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5767187A (en) * | 1980-10-13 | 1982-04-23 | Furukawa Electric Co Ltd:The | Manufacture of cu-sn composite material |
JPS62149899A (en) * | 1985-09-17 | 1987-07-03 | Kobe Steel Ltd | Production of terminal and connector made of tinned copper alloy |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60145342A (en) * | 1984-01-05 | 1985-07-31 | Mitsubishi Electric Corp | Alloy having concentration gradient in composition |
JPS61147861A (en) * | 1984-12-18 | 1986-07-05 | Nippon Mining Co Ltd | Production of cu-sn plated material |
JPH08957B2 (en) * | 1987-04-21 | 1996-01-10 | 日鉱金属株式会社 | Method for producing copper alloy having excellent heat-resistant peeling property with tin or tin alloy |
JP2587258B2 (en) * | 1987-12-16 | 1997-03-05 | 日鉱金属株式会社 | Method for producing reflow tin or tin alloy plated material using copper or copper alloy as base material |
JPH0426789A (en) * | 1990-05-22 | 1992-01-29 | Furukawa Electric Co Ltd:The | Production of reflow soldering material |
-
1997
- 1997-10-31 DE DE19748306A patent/DE19748306A1/en not_active Withdrawn
-
1998
- 1998-08-06 JP JP10223215A patent/JPH11162612A/en not_active Withdrawn
- 1998-09-10 KR KR1019980037290A patent/KR19990036624A/en not_active Application Discontinuation
- 1998-10-24 EP EP98120208A patent/EP0913494A3/en not_active Withdrawn
- 1998-10-30 US US09/183,226 patent/US6205643B1/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5767187A (en) * | 1980-10-13 | 1982-04-23 | Furukawa Electric Co Ltd:The | Manufacture of cu-sn composite material |
JPS62149899A (en) * | 1985-09-17 | 1987-07-03 | Kobe Steel Ltd | Production of terminal and connector made of tinned copper alloy |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 006, no. 143 (C - 117) 3 August 1982 (1982-08-03) * |
PATENT ABSTRACTS OF JAPAN vol. 011, no. 381 (C - 464) 12 December 1987 (1987-12-12) * |
Also Published As
Publication number | Publication date |
---|---|
JPH11162612A (en) | 1999-06-18 |
DE19748306A1 (en) | 1999-05-06 |
US6205643B1 (en) | 2001-03-27 |
KR19990036624A (en) | 1999-05-25 |
EP0913494A2 (en) | 1999-05-06 |
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