JPS54141346A - Silver-copper alloy plating method - Google Patents

Silver-copper alloy plating method

Info

Publication number
JPS54141346A
JPS54141346A JP5054378A JP5054378A JPS54141346A JP S54141346 A JPS54141346 A JP S54141346A JP 5054378 A JP5054378 A JP 5054378A JP 5054378 A JP5054378 A JP 5054378A JP S54141346 A JPS54141346 A JP S54141346A
Authority
JP
Japan
Prior art keywords
silver
plating
soln
copper
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5054378A
Other languages
Japanese (ja)
Inventor
Masuo Tanno
Takashi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5054378A priority Critical patent/JPS54141346A/en
Publication of JPS54141346A publication Critical patent/JPS54141346A/en
Pending legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Manufacture And Refinement Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To form a silver-copper alloy film with superior smoothness and sulfurization resistance without any environmental pollution problem by carrying out periodic reverse electrolysis using an electrolytic soln. contg. a silver salt, a copper salt, an iodide and polyethylene glycol in silver-copper alloy plating.
CONSTITUTION: A plating soln. is prepared as follows: KI is dissolved in distilled water, and a silver salt such as silver nitrate is added to form a complex. To the soln. are further added CuI, citric acid and a commercially available antioxidant, and finally added 0.1W10 g/l of polyethylene glycol as a brightener. A desirable plating bath compsn. and plating conditions are shown by the list. A silver anode plate and a material to be plated are dipped in the above plating soln., and periodic reverse electrolysis (normal/reverse= 3/1W10/1 and reverse time below 2 sec) is carried out to form a silver-copper monophase alloy film with superior flatness and sulfurization resistance suitable for use as contact points for various electronic parts. This method prevents environmental pollution due to cyanogen ion in effluent.
COPYRIGHT: (C)1979,JPO&Japio
JP5054378A 1978-04-26 1978-04-26 Silver-copper alloy plating method Pending JPS54141346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5054378A JPS54141346A (en) 1978-04-26 1978-04-26 Silver-copper alloy plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5054378A JPS54141346A (en) 1978-04-26 1978-04-26 Silver-copper alloy plating method

Publications (1)

Publication Number Publication Date
JPS54141346A true JPS54141346A (en) 1979-11-02

Family

ID=12861920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5054378A Pending JPS54141346A (en) 1978-04-26 1978-04-26 Silver-copper alloy plating method

Country Status (1)

Country Link
JP (1) JPS54141346A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07252684A (en) * 1994-02-05 1995-10-03 W C Heraeus Gmbh Silver-tin alloy plating deposition bath
CN110396705A (en) * 2019-08-07 2019-11-01 中国科学院合肥物质科学研究院 The method of the porous silver of electrodeposited nanocrystalline

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07252684A (en) * 1994-02-05 1995-10-03 W C Heraeus Gmbh Silver-tin alloy plating deposition bath
CN110396705A (en) * 2019-08-07 2019-11-01 中国科学院合肥物质科学研究院 The method of the porous silver of electrodeposited nanocrystalline

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