JPS57177988A - Manufacture of silver plated copper material - Google Patents

Manufacture of silver plated copper material

Info

Publication number
JPS57177988A
JPS57177988A JP6218881A JP6218881A JPS57177988A JP S57177988 A JPS57177988 A JP S57177988A JP 6218881 A JP6218881 A JP 6218881A JP 6218881 A JP6218881 A JP 6218881A JP S57177988 A JPS57177988 A JP S57177988A
Authority
JP
Japan
Prior art keywords
plated
manufacture
silver
plated copper
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6218881A
Other languages
Japanese (ja)
Other versions
JPS6320317B2 (en
Inventor
Satoshi Suzuki
Shoji Shiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP6218881A priority Critical patent/JPS57177988A/en
Publication of JPS57177988A publication Critical patent/JPS57177988A/en
Publication of JPS6320317B2 publication Critical patent/JPS6320317B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To manufacture a silver plated copper material with superior corrosion resistance, electrical connectivity and solderability by plating the surface of copper with silver or a silver alloy, cathodically treating the plated copper in a soln. contg. sexivalent Cr, and rolling or drawing it.
CONSTITUTION: A Cu or Cu alloy material is dipped in a sulfuric acid soln. to activate the surface, and it is plated with Ag, an Ag-Sb alloy or the like. The plated material is then immersed in an aqueous soln. contg. sexivalent Cr ions such as an aqueous soln. of Na2CrO4 or Na2Cr2O7, electrolyzed as a cathode, and worked by rolling, drawing or other method. Thus, the corrosion resistance, electrical connectivity and solderability of the Cu or Cu alloy material plated with Ag, Ag-Sb or the like are enhanced.
COPYRIGHT: (C)1982,JPO&Japio
JP6218881A 1981-04-24 1981-04-24 Manufacture of silver plated copper material Granted JPS57177988A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6218881A JPS57177988A (en) 1981-04-24 1981-04-24 Manufacture of silver plated copper material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6218881A JPS57177988A (en) 1981-04-24 1981-04-24 Manufacture of silver plated copper material

Publications (2)

Publication Number Publication Date
JPS57177988A true JPS57177988A (en) 1982-11-01
JPS6320317B2 JPS6320317B2 (en) 1988-04-27

Family

ID=13192908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6218881A Granted JPS57177988A (en) 1981-04-24 1981-04-24 Manufacture of silver plated copper material

Country Status (1)

Country Link
JP (1) JPS57177988A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2253097A (en) * 1991-01-31 1992-08-26 Otter Controls Ltd Electrical contacts.
JP2012504705A (en) * 2008-10-02 2012-02-23 マクダーミッド インコーポレーテッド Method to improve surface solderability

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2253097A (en) * 1991-01-31 1992-08-26 Otter Controls Ltd Electrical contacts.
GB2253097B (en) * 1991-01-31 1995-01-18 Otter Controls Ltd Improvements relating to conductors for electrical connection applications
AU659436B2 (en) * 1991-01-31 1995-05-18 Otter Controls Limited Improvements relating to conductors for electrical connection applications
JP2012504705A (en) * 2008-10-02 2012-02-23 マクダーミッド インコーポレーテッド Method to improve surface solderability

Also Published As

Publication number Publication date
JPS6320317B2 (en) 1988-04-27

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