JPS57177988A - Manufacture of silver plated copper material - Google Patents
Manufacture of silver plated copper materialInfo
- Publication number
- JPS57177988A JPS57177988A JP6218881A JP6218881A JPS57177988A JP S57177988 A JPS57177988 A JP S57177988A JP 6218881 A JP6218881 A JP 6218881A JP 6218881 A JP6218881 A JP 6218881A JP S57177988 A JPS57177988 A JP S57177988A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- manufacture
- silver
- plated copper
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To manufacture a silver plated copper material with superior corrosion resistance, electrical connectivity and solderability by plating the surface of copper with silver or a silver alloy, cathodically treating the plated copper in a soln. contg. sexivalent Cr, and rolling or drawing it.
CONSTITUTION: A Cu or Cu alloy material is dipped in a sulfuric acid soln. to activate the surface, and it is plated with Ag, an Ag-Sb alloy or the like. The plated material is then immersed in an aqueous soln. contg. sexivalent Cr ions such as an aqueous soln. of Na2CrO4 or Na2Cr2O7, electrolyzed as a cathode, and worked by rolling, drawing or other method. Thus, the corrosion resistance, electrical connectivity and solderability of the Cu or Cu alloy material plated with Ag, Ag-Sb or the like are enhanced.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6218881A JPS57177988A (en) | 1981-04-24 | 1981-04-24 | Manufacture of silver plated copper material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6218881A JPS57177988A (en) | 1981-04-24 | 1981-04-24 | Manufacture of silver plated copper material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57177988A true JPS57177988A (en) | 1982-11-01 |
JPS6320317B2 JPS6320317B2 (en) | 1988-04-27 |
Family
ID=13192908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6218881A Granted JPS57177988A (en) | 1981-04-24 | 1981-04-24 | Manufacture of silver plated copper material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57177988A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2253097A (en) * | 1991-01-31 | 1992-08-26 | Otter Controls Ltd | Electrical contacts. |
JP2012504705A (en) * | 2008-10-02 | 2012-02-23 | マクダーミッド インコーポレーテッド | Method to improve surface solderability |
-
1981
- 1981-04-24 JP JP6218881A patent/JPS57177988A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2253097A (en) * | 1991-01-31 | 1992-08-26 | Otter Controls Ltd | Electrical contacts. |
GB2253097B (en) * | 1991-01-31 | 1995-01-18 | Otter Controls Ltd | Improvements relating to conductors for electrical connection applications |
AU659436B2 (en) * | 1991-01-31 | 1995-05-18 | Otter Controls Limited | Improvements relating to conductors for electrical connection applications |
JP2012504705A (en) * | 2008-10-02 | 2012-02-23 | マクダーミッド インコーポレーテッド | Method to improve surface solderability |
Also Published As
Publication number | Publication date |
---|---|
JPS6320317B2 (en) | 1988-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES516541A0 (en) | "A METHOD TO MANUFACTURE A LEAD ANODE FOR ELECTROLYTIC EXTRACTION OF METALS". | |
BE893883Q (en) | PROCESS FOR STRIPPING COPPER OR COPPER ALLOY SURFACES | |
DE1922598A1 (en) | Object made from a metal substrate on which a nickel-tin alloy is deposited, and a method for its manufacture | |
JPS57177988A (en) | Manufacture of silver plated copper material | |
JPS5493639A (en) | Plating method | |
DE59481T1 (en) | DEVICE FOR HIGH-SPEED ELECTROPLATING. | |
JPS6447894A (en) | Double-ply plated steel sheet for soldering | |
JPS56150199A (en) | Preparation of tin plated steel plate with excellent corrosion resistance of processed part | |
JPS55107795A (en) | Gold tin alloy electroplating bath and plating method | |
JPS5690993A (en) | Electrolytic refining of copper | |
JPS57152490A (en) | Surface treatment of copper foil | |
KR860001221A (en) | Metal Plating Method of Stainless Steel | |
JPS56119792A (en) | Electroplating method | |
JPS57114695A (en) | Production of zinc plated steeel plate of superior blackening resistance and intergranular corrosion resistance | |
JPS57140884A (en) | Plating method for silver | |
JPS5741390A (en) | Cathode for electrolysis | |
JPS56146900A (en) | Production of electric alloy plated steel sheet | |
JPS54141346A (en) | Silver-copper alloy plating method | |
JPS5739190A (en) | Preparation of solder plated or tin plated wire | |
JPS54152636A (en) | Surface treating method for gold-plated surface | |
JPS55131188A (en) | Electrode and manufacture thereof | |
JPS5747877A (en) | Oxidation treatment of copper or copper alloy | |
JPS5554589A (en) | Plating method of electronic parts which prevent production of zinc whisker | |
JPS5794599A (en) | Silver plated film and electroplating method | |
JPS54149335A (en) | Silver plating method for lead frame |