JPS56119792A - Electroplating method - Google Patents

Electroplating method

Info

Publication number
JPS56119792A
JPS56119792A JP2316280A JP2316280A JPS56119792A JP S56119792 A JPS56119792 A JP S56119792A JP 2316280 A JP2316280 A JP 2316280A JP 2316280 A JP2316280 A JP 2316280A JP S56119792 A JPS56119792 A JP S56119792A
Authority
JP
Japan
Prior art keywords
cathode
plating
disposed
shielding plate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2316280A
Other languages
Japanese (ja)
Other versions
JPS604278B2 (en
Inventor
Yoshio Natori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2316280A priority Critical patent/JPS604278B2/en
Publication of JPS56119792A publication Critical patent/JPS56119792A/en
Publication of JPS604278B2 publication Critical patent/JPS604278B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices

Abstract

PURPOSE: To apply taper plating accurately to the surface to be plated by changing the shaded part while flowing part of cathode current to a conductive shielding plate during electroplating work.
CONSTITUTION: Anode A is disposed to one end of a plating tank, and the cathode B of the object to be plated is disposed to the other end via a cathode jig C. Further, a conductive shielding plate D is disposed in proximity to the cathode B. This shielding plate D and the cathode B are connected by means of a coated copper wire B, and part of cathode current is flowed to the plate D. During plating, this plate D is moved in arbitary directins such as vertically or laterally in parallel to the plane of the cathode B. Desired taper plating is applied accurately by this method.
COPYRIGHT: (C)1981,JPO&Japio
JP2316280A 1980-02-26 1980-02-26 electroplating method Expired JPS604278B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2316280A JPS604278B2 (en) 1980-02-26 1980-02-26 electroplating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2316280A JPS604278B2 (en) 1980-02-26 1980-02-26 electroplating method

Publications (2)

Publication Number Publication Date
JPS56119792A true JPS56119792A (en) 1981-09-19
JPS604278B2 JPS604278B2 (en) 1985-02-02

Family

ID=12102907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2316280A Expired JPS604278B2 (en) 1980-02-26 1980-02-26 electroplating method

Country Status (1)

Country Link
JP (1) JPS604278B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784972A (en) * 1984-08-18 1988-11-15 Matsushita Electric Industrial Co. Ltd. Method of joining beam leads with projections to device electrodes
JPH03146691A (en) * 1989-05-02 1991-06-21 Yamamoto Tokin Kogyosho:Kk Plating method for forming satin surface and lustrous surface in the same stage
WO2000022194A2 (en) * 1998-10-15 2000-04-20 Central Research Laboratories Limited Method of, and apparatus for, electro-plating a structure
EP2045370A1 (en) * 2007-10-02 2009-04-08 Siemens Aktiengesellschaft Method for electrochemical removal of a metal coating

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110328624B (en) * 2019-07-26 2020-07-31 郑州磨料磨具磨削研究所有限公司 Deposition fixture for special-shaped electroplating grinding wheel and using method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784972A (en) * 1984-08-18 1988-11-15 Matsushita Electric Industrial Co. Ltd. Method of joining beam leads with projections to device electrodes
JPH03146691A (en) * 1989-05-02 1991-06-21 Yamamoto Tokin Kogyosho:Kk Plating method for forming satin surface and lustrous surface in the same stage
WO2000022194A2 (en) * 1998-10-15 2000-04-20 Central Research Laboratories Limited Method of, and apparatus for, electro-plating a structure
WO2000022194A3 (en) * 1998-10-15 2000-10-19 Central Research Lab Ltd Method of, and apparatus for, electro-plating a structure
EP2045370A1 (en) * 2007-10-02 2009-04-08 Siemens Aktiengesellschaft Method for electrochemical removal of a metal coating

Also Published As

Publication number Publication date
JPS604278B2 (en) 1985-02-02

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