JPS5741395A - Electroplating method - Google Patents

Electroplating method

Info

Publication number
JPS5741395A
JPS5741395A JP11728380A JP11728380A JPS5741395A JP S5741395 A JPS5741395 A JP S5741395A JP 11728380 A JP11728380 A JP 11728380A JP 11728380 A JP11728380 A JP 11728380A JP S5741395 A JPS5741395 A JP S5741395A
Authority
JP
Japan
Prior art keywords
objects
rings
members
cathode
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11728380A
Other languages
Japanese (ja)
Other versions
JPS5839240B2 (en
Inventor
Teruo Kono
Yuji Mukai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON KOUKAN TSUGITE KK
JFE Pipe Fitting Mfg Co Ltd
Nippon Kokan Keishiyu KK
Original Assignee
NIPPON KOUKAN TSUGITE KK
Nippon Kokan Pipe Fitting Mfg Co Ltd
Nippon Kokan Keishiyu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON KOUKAN TSUGITE KK, Nippon Kokan Pipe Fitting Mfg Co Ltd, Nippon Kokan Keishiyu KK filed Critical NIPPON KOUKAN TSUGITE KK
Priority to JP11728380A priority Critical patent/JPS5839240B2/en
Publication of JPS5741395A publication Critical patent/JPS5741395A/en
Publication of JPS5839240B2 publication Critical patent/JPS5839240B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To apply perfect protecting coating over the entire surface of a pallet placed with objects to be treated and perform good electroplating treatment by abutting contact members connected to cathode members on said objects and carrying out plating treatment in the state that cathode electric conduction circuits are held formed.
CONSTITUTION: Holding rings 10 are inserted onto the anode bars 3 disposed in a plating cell 7, and contact members 5 consisting of electric conducting metallic materials are mounted in one piece to the rings 10. The rings 10 as well as between the rings and cathode members 4 are connected by lead wires 13, 14, and the members 5 are abutted on objects 1 to be treated, thereby forming cathode electric conduction circuits 6. In this state, electric current is flowed from the bars 3 to the objects 1, whereby plating treatment is carried out. According to this method, the cut-out parts for electricity conduction on the convering part of a pallet 8 for placement of the objects 1 are not necessary, and the loss of plating soln. occuring in the peeling of the coating layer is prevented.
COPYRIGHT: (C)1982,JPO&Japio
JP11728380A 1980-08-25 1980-08-25 Electroplating method Expired JPS5839240B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11728380A JPS5839240B2 (en) 1980-08-25 1980-08-25 Electroplating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11728380A JPS5839240B2 (en) 1980-08-25 1980-08-25 Electroplating method

Publications (2)

Publication Number Publication Date
JPS5741395A true JPS5741395A (en) 1982-03-08
JPS5839240B2 JPS5839240B2 (en) 1983-08-29

Family

ID=14707905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11728380A Expired JPS5839240B2 (en) 1980-08-25 1980-08-25 Electroplating method

Country Status (1)

Country Link
JP (1) JPS5839240B2 (en)

Also Published As

Publication number Publication date
JPS5839240B2 (en) 1983-08-29

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