JPS5747877A - Oxidation treatment of copper or copper alloy - Google Patents

Oxidation treatment of copper or copper alloy

Info

Publication number
JPS5747877A
JPS5747877A JP12157080A JP12157080A JPS5747877A JP S5747877 A JPS5747877 A JP S5747877A JP 12157080 A JP12157080 A JP 12157080A JP 12157080 A JP12157080 A JP 12157080A JP S5747877 A JPS5747877 A JP S5747877A
Authority
JP
Japan
Prior art keywords
copper
copper alloy
contg
oxide film
sulfuric acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12157080A
Other languages
Japanese (ja)
Inventor
Seiju Maejima
Takao Suzuki
Koichi Saruwatari
Moriaki Kojima
Masataka Mochizuki
Kazuo Isawa
Masashi Ida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP12157080A priority Critical patent/JPS5747877A/en
Publication of JPS5747877A publication Critical patent/JPS5747877A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

PURPOSE: To form a dense cupric oxide film with superior adhesion on the surface of coppr or copper alloy by immersing the copper or copper alloy in a mixed aqueous soln. contg. a prescribed amount of hydrogen peroxide and sulfuric acid.
CONSTITUTION: Pretreated copper or copper alloy is immersed in a mixed aqueous soln. contg. 5W50vol% hydrogen peroxide and 0.1W2wt% sulfuric acid at ≤60°C for 30secW10min. A copper oxide film obtd. by this method has high voltage dielectric breakdown strength, superior corrosion resistance and high adhesion to the base metal.
COPYRIGHT: (C)1982,JPO&Japio
JP12157080A 1980-09-02 1980-09-02 Oxidation treatment of copper or copper alloy Pending JPS5747877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12157080A JPS5747877A (en) 1980-09-02 1980-09-02 Oxidation treatment of copper or copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12157080A JPS5747877A (en) 1980-09-02 1980-09-02 Oxidation treatment of copper or copper alloy

Publications (1)

Publication Number Publication Date
JPS5747877A true JPS5747877A (en) 1982-03-18

Family

ID=14814497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12157080A Pending JPS5747877A (en) 1980-09-02 1980-09-02 Oxidation treatment of copper or copper alloy

Country Status (1)

Country Link
JP (1) JPS5747877A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61221378A (en) * 1985-03-27 1986-10-01 Toho Gas Kk Method for preventing dissolution of copper
JP2001064780A (en) * 1999-07-09 2001-03-13 Samsung Electro Mech Co Ltd Chemical film composition and formation of chemical film using the composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61221378A (en) * 1985-03-27 1986-10-01 Toho Gas Kk Method for preventing dissolution of copper
JPH0570714B2 (en) * 1985-03-27 1993-10-05 Toho Gas Kk
JP2001064780A (en) * 1999-07-09 2001-03-13 Samsung Electro Mech Co Ltd Chemical film composition and formation of chemical film using the composition

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