JPS5785987A - Plating method for lead-indium alloy - Google Patents

Plating method for lead-indium alloy

Info

Publication number
JPS5785987A
JPS5785987A JP16023280A JP16023280A JPS5785987A JP S5785987 A JPS5785987 A JP S5785987A JP 16023280 A JP16023280 A JP 16023280A JP 16023280 A JP16023280 A JP 16023280A JP S5785987 A JPS5785987 A JP S5785987A
Authority
JP
Japan
Prior art keywords
alloy plating
lead
plating method
concn
borofluoride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16023280A
Other languages
Japanese (ja)
Other versions
JPS604917B2 (en
Inventor
Kisaku Nakamura
Akio Hori
Norio Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP16023280A priority Critical patent/JPS604917B2/en
Publication of JPS5785987A publication Critical patent/JPS5785987A/en
Publication of JPS604917B2 publication Critical patent/JPS604917B2/en
Expired legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To form Pb-In alloy plating utilizable effectively for forming solder of a semiconductor device on a substance to be plated by using a borofluoride alloy plating bath regulated to a prescribed value or above of In ion concn. and a specified strongly acidic range of pH.
CONSTITUTION: A Pb-In borofluoride alloy plating bath is regulated to ≥80% In ion concn. and 1.0W1.8pH, and Pb and In are simultaneously precipitated on a substance to be plated. As a result, even if a single electrode is used as an anode, a Pb-In alloy film having 0.5W <100% In concn. can be precipitated and formed at a practicable current density such as 1W3A/dm2.
COPYRIGHT: (C)1982,JPO&Japio
JP16023280A 1980-11-14 1980-11-14 Plating method for lead-indium alloy Expired JPS604917B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16023280A JPS604917B2 (en) 1980-11-14 1980-11-14 Plating method for lead-indium alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16023280A JPS604917B2 (en) 1980-11-14 1980-11-14 Plating method for lead-indium alloy

Publications (2)

Publication Number Publication Date
JPS5785987A true JPS5785987A (en) 1982-05-28
JPS604917B2 JPS604917B2 (en) 1985-02-07

Family

ID=15710557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16023280A Expired JPS604917B2 (en) 1980-11-14 1980-11-14 Plating method for lead-indium alloy

Country Status (1)

Country Link
JP (1) JPS604917B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04305499A (en) * 1991-04-02 1992-10-28 Aoi Kokuban Seisakusho:Kk Wiper for board inscribed on surface
US8460533B2 (en) 2006-12-15 2013-06-11 Rohm And Haas Electronic Materials Llc Indium compositions
US8491773B2 (en) 2008-04-22 2013-07-23 Rohm And Haas Electronic Materials Llc Method of replenishing indium ions in indium electroplating compositions
RU2739741C1 (en) * 2020-07-05 2020-12-28 Федеральное государственное бюджетное образовательное учреждение высшего образования "Пензенский государственный университет" Method for application of electroplating coatings with indium-lead alloy

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04305499A (en) * 1991-04-02 1992-10-28 Aoi Kokuban Seisakusho:Kk Wiper for board inscribed on surface
US8460533B2 (en) 2006-12-15 2013-06-11 Rohm And Haas Electronic Materials Llc Indium compositions
US9206519B2 (en) 2006-12-15 2015-12-08 Rohm And Haas Electronic Materials Llc Indium compositions
US8491773B2 (en) 2008-04-22 2013-07-23 Rohm And Haas Electronic Materials Llc Method of replenishing indium ions in indium electroplating compositions
RU2739741C1 (en) * 2020-07-05 2020-12-28 Федеральное государственное бюджетное образовательное учреждение высшего образования "Пензенский государственный университет" Method for application of electroplating coatings with indium-lead alloy

Also Published As

Publication number Publication date
JPS604917B2 (en) 1985-02-07

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