JPS5785987A - Plating method for lead-indium alloy - Google Patents
Plating method for lead-indium alloyInfo
- Publication number
- JPS5785987A JPS5785987A JP16023280A JP16023280A JPS5785987A JP S5785987 A JPS5785987 A JP S5785987A JP 16023280 A JP16023280 A JP 16023280A JP 16023280 A JP16023280 A JP 16023280A JP S5785987 A JPS5785987 A JP S5785987A
- Authority
- JP
- Japan
- Prior art keywords
- alloy plating
- lead
- plating method
- concn
- borofluoride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To form Pb-In alloy plating utilizable effectively for forming solder of a semiconductor device on a substance to be plated by using a borofluoride alloy plating bath regulated to a prescribed value or above of In ion concn. and a specified strongly acidic range of pH.
CONSTITUTION: A Pb-In borofluoride alloy plating bath is regulated to ≥80% In ion concn. and 1.0W1.8pH, and Pb and In are simultaneously precipitated on a substance to be plated. As a result, even if a single electrode is used as an anode, a Pb-In alloy film having 0.5W <100% In concn. can be precipitated and formed at a practicable current density such as 1W3A/dm2.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16023280A JPS604917B2 (en) | 1980-11-14 | 1980-11-14 | Plating method for lead-indium alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16023280A JPS604917B2 (en) | 1980-11-14 | 1980-11-14 | Plating method for lead-indium alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5785987A true JPS5785987A (en) | 1982-05-28 |
JPS604917B2 JPS604917B2 (en) | 1985-02-07 |
Family
ID=15710557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16023280A Expired JPS604917B2 (en) | 1980-11-14 | 1980-11-14 | Plating method for lead-indium alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS604917B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04305499A (en) * | 1991-04-02 | 1992-10-28 | Aoi Kokuban Seisakusho:Kk | Wiper for board inscribed on surface |
US8460533B2 (en) | 2006-12-15 | 2013-06-11 | Rohm And Haas Electronic Materials Llc | Indium compositions |
US8491773B2 (en) | 2008-04-22 | 2013-07-23 | Rohm And Haas Electronic Materials Llc | Method of replenishing indium ions in indium electroplating compositions |
RU2739741C1 (en) * | 2020-07-05 | 2020-12-28 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Пензенский государственный университет" | Method for application of electroplating coatings with indium-lead alloy |
-
1980
- 1980-11-14 JP JP16023280A patent/JPS604917B2/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04305499A (en) * | 1991-04-02 | 1992-10-28 | Aoi Kokuban Seisakusho:Kk | Wiper for board inscribed on surface |
US8460533B2 (en) | 2006-12-15 | 2013-06-11 | Rohm And Haas Electronic Materials Llc | Indium compositions |
US9206519B2 (en) | 2006-12-15 | 2015-12-08 | Rohm And Haas Electronic Materials Llc | Indium compositions |
US8491773B2 (en) | 2008-04-22 | 2013-07-23 | Rohm And Haas Electronic Materials Llc | Method of replenishing indium ions in indium electroplating compositions |
RU2739741C1 (en) * | 2020-07-05 | 2020-12-28 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Пензенский государственный университет" | Method for application of electroplating coatings with indium-lead alloy |
Also Published As
Publication number | Publication date |
---|---|
JPS604917B2 (en) | 1985-02-07 |
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