JPS57101684A - Method for plating palladium - Google Patents
Method for plating palladiumInfo
- Publication number
- JPS57101684A JPS57101684A JP17587480A JP17587480A JPS57101684A JP S57101684 A JPS57101684 A JP S57101684A JP 17587480 A JP17587480 A JP 17587480A JP 17587480 A JP17587480 A JP 17587480A JP S57101684 A JPS57101684 A JP S57101684A
- Authority
- JP
- Japan
- Prior art keywords
- palladium
- compound
- strike
- nitrous
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title abstract 14
- 229910052763 palladium Inorganic materials 0.000 title abstract 7
- 238000007747 plating Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 6
- GQPLMRYTRLFLPF-UHFFFAOYSA-N nitrous oxide Inorganic materials [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 abstract 4
- 150000002941 palladium compounds Chemical class 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 239000003792 electrolyte Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 abstract 1
Abstract
PURPOSE: To omit gold strike and enhance economical efficiency by a method wherein, prior to applying palladium plating, a palladium strike is applied by a palladium strike bath containing a small amount of a water soluble palladium compound, a nitrous compound and a sulfurous compound.
CONSTITUTION: A palladium strike bath containing 0.5W1.5g/l water soluble palldium compound, 5W20g/l nitrous compound and 20W100g/l sulfurous compound is prepared and, by said bath, palladium strike is applied under such a condition that pH is 8.5W9.5, a temp. is 35W70°C and a cathode current density is 5W50A/dm2. Next, in a plating bath containing a nitrous compound in an amount sufficient for supplying free nitrous ion relatively excessive against the palladium compound, an electrolyte and palladium ion, palladium plating is applied.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17587480A JPS57101684A (en) | 1980-12-15 | 1980-12-15 | Method for plating palladium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17587480A JPS57101684A (en) | 1980-12-15 | 1980-12-15 | Method for plating palladium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57101684A true JPS57101684A (en) | 1982-06-24 |
| JPS639030B2 JPS639030B2 (en) | 1988-02-25 |
Family
ID=16003710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17587480A Granted JPS57101684A (en) | 1980-12-15 | 1980-12-15 | Method for plating palladium |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57101684A (en) |
-
1980
- 1980-12-15 JP JP17587480A patent/JPS57101684A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS639030B2 (en) | 1988-02-25 |
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