JPS56112500A - Method for electroplating - Google Patents
Method for electroplatingInfo
- Publication number
- JPS56112500A JPS56112500A JP1505480A JP1505480A JPS56112500A JP S56112500 A JPS56112500 A JP S56112500A JP 1505480 A JP1505480 A JP 1505480A JP 1505480 A JP1505480 A JP 1505480A JP S56112500 A JPS56112500 A JP S56112500A
- Authority
- JP
- Japan
- Prior art keywords
- anode
- auxiliary anode
- plating bath
- current
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 238000007747 plating Methods 0.000 abstract 8
- 238000005341 cation exchange Methods 0.000 abstract 3
- 239000012528 membrane Substances 0.000 abstract 3
- 239000011260 aqueous acid Substances 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- -1 hydrogen ions Chemical class 0.000 abstract 1
- 150000001455 metallic ions Chemical class 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 239000010936 titanium Substances 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To stabilize the composition of a plating bath and enable to operate for a long period by providing an insoluble auxiliary anode, in addition to a soluble anode, in an aqueous acid soln. via a cation exchange membrane in a plating tank, and flowing a part of current thereto for plating.
CONSTITUTION: In a plating tank 1, an insoluble auxiliary anode 5 delineated by a cation exchange membrane 3 is additionally provided, aside from a soluble anode 7, and an aqueous acid soln. is filled therein. A DC power source 6 is connected in series to the auxiliary anode 5 via a current controller 9 and an ammeter 8. The current corresponding to the difference in the current efficiencies of the soluble anode 7 and cathode 10 in the plating bath 2 is flowed to the auxiliary anode 5, whereby electroplating is accomplished. The rate of the current supply to the auxiliary anode 5 is controlled by the current controller 9 according to the fluctuations in the pH value of the plating bath 2. For example, titanium, platinum or the like is used for the auxiliary anode 5. Thereby, hydrogen ions may be supplied to the plating bath through the cation exchange membrane 3, and the increase in the pH and the metallic ion concn. of the plating bath 2 may be suppressed.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1505480A JPS56112500A (en) | 1980-02-09 | 1980-02-09 | Method for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1505480A JPS56112500A (en) | 1980-02-09 | 1980-02-09 | Method for electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56112500A true JPS56112500A (en) | 1981-09-04 |
Family
ID=11878115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1505480A Pending JPS56112500A (en) | 1980-02-09 | 1980-02-09 | Method for electroplating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56112500A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02175894A (en) * | 1988-12-28 | 1990-07-09 | Kosaku:Kk | Method and device for tin or tin alloy electroplating |
| JPH04284691A (en) * | 1991-03-13 | 1992-10-09 | Arumetsukusu:Kk | Electrically plating method for printed circuit board |
| US5162079A (en) * | 1991-01-28 | 1992-11-10 | Eco-Tec Limited | Process and apparatus for control of electroplating bath composition |
| JPH04333600A (en) * | 1990-10-22 | 1992-11-20 | Enthone Omi Inc | Nickel electroplating treatment, in which nickel ion storage is reduced |
| JP2002146599A (en) * | 2000-07-07 | 2002-05-22 | Applied Materials Inc | Coated anode device and related method |
| WO2004011698A1 (en) * | 2002-07-25 | 2004-02-05 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| US7273540B2 (en) | 2002-07-25 | 2007-09-25 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| WO2014147180A1 (en) * | 2013-03-21 | 2014-09-25 | Atotech Deutschland Gmbh | Apparatus and method for electrolytic deposition of metal layers on workpieces |
| WO2019164920A1 (en) * | 2018-02-23 | 2019-08-29 | Lam Research Corporation | Electroplating system with inert and active anodes |
| WO2022118876A1 (en) * | 2020-12-04 | 2022-06-09 | ディップソール株式会社 | Acidic plating system and anode cell |
-
1980
- 1980-02-09 JP JP1505480A patent/JPS56112500A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02175894A (en) * | 1988-12-28 | 1990-07-09 | Kosaku:Kk | Method and device for tin or tin alloy electroplating |
| JPH0424440B2 (en) * | 1988-12-28 | 1992-04-27 | Kosaku Kk | |
| JPH04333600A (en) * | 1990-10-22 | 1992-11-20 | Enthone Omi Inc | Nickel electroplating treatment, in which nickel ion storage is reduced |
| US5162079A (en) * | 1991-01-28 | 1992-11-10 | Eco-Tec Limited | Process and apparatus for control of electroplating bath composition |
| JPH04284691A (en) * | 1991-03-13 | 1992-10-09 | Arumetsukusu:Kk | Electrically plating method for printed circuit board |
| JP2002146599A (en) * | 2000-07-07 | 2002-05-22 | Applied Materials Inc | Coated anode device and related method |
| WO2004011698A1 (en) * | 2002-07-25 | 2004-02-05 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| US7273540B2 (en) | 2002-07-25 | 2007-09-25 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| WO2014147180A1 (en) * | 2013-03-21 | 2014-09-25 | Atotech Deutschland Gmbh | Apparatus and method for electrolytic deposition of metal layers on workpieces |
| WO2019164920A1 (en) * | 2018-02-23 | 2019-08-29 | Lam Research Corporation | Electroplating system with inert and active anodes |
| CN111936675A (en) * | 2018-02-23 | 2020-11-13 | 朗姆研究公司 | Electroplating system with inert and active anodes |
| CN111936675B (en) * | 2018-02-23 | 2024-05-10 | 朗姆研究公司 | Electroplating system with inert and active anodes |
| WO2022118876A1 (en) * | 2020-12-04 | 2022-06-09 | ディップソール株式会社 | Acidic plating system and anode cell |
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