GB1095905A - Improvements in or relating to electro-plating solutions - Google Patents
Improvements in or relating to electro-plating solutionsInfo
- Publication number
- GB1095905A GB1095905A GB4955265A GB4955265A GB1095905A GB 1095905 A GB1095905 A GB 1095905A GB 4955265 A GB4955265 A GB 4955265A GB 4955265 A GB4955265 A GB 4955265A GB 1095905 A GB1095905 A GB 1095905A
- Authority
- GB
- United Kingdom
- Prior art keywords
- gold
- electro
- electrolyte
- platinum
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Abstract
An electrolyte for electro-deposition of gold is formed from orthophosphoric acid and ammonia, or from salts thereof, and potassium dicyanoaurate, the resultant electrolyte containing 1-180 gr/1 potassium dicyanoaurate and having a buffered pH of 5.2-5.8, e.g. the electrolyte may be formed by dissolving in water 1-180 gr/1 potassium dicyanoaurate; and 5-500 gr/1 diammonium hydrogen orthophosphate and 5-500 gr/1 ammonium hydrogen orthophosphate, or orthophosphoric acid and ammonium hydroxide. Electro-deposition may be carried out using a current density of less than 35 Amps/sq. ft. and a temperature between room temperature and 90 DEG C. The anode may be of platinum or of platinum-coated titanium. The gold may be deposited on silver, nickel, copper or an alloy thereof. The bath may be agitated, e.g. by use of a reciprocating cathode. Gold deposited from the bath may be replaced by addition of a solution of a gold compound.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB4955265A GB1095905A (en) | 1965-11-22 | 1965-11-22 | Improvements in or relating to electro-plating solutions |
| ES0333287A ES333287A1 (en) | 1965-11-22 | 1966-11-11 | A process for gold electrodeposition. (Machine-translation by Google Translate, not legally binding) |
| FR83707A FR91246E (en) | 1965-11-22 | 1966-11-15 | Gold electroplating process |
| CH1650066A CH511288A (en) | 1965-11-22 | 1966-11-16 | Gold electrodeposition from potassiumaurocya |
| NL6616173A NL153945B (en) | 1965-11-22 | 1966-11-16 | PROCESS FOR THE PREPARATION OF AN ELECTROLYTIC SOLUTION, AND THE USE OF THIS SOLUTION IN THE ELECTROLYTIC DEPOSIT OF GOLD ON A SUBSTRATE, AND THE SUBSTRATES OBTAINED THEREOF, COATED WITH A GOLD COATING. |
| SE1576766A SE336261B (en) | 1965-11-22 | 1966-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB4955265A GB1095905A (en) | 1965-11-22 | 1965-11-22 | Improvements in or relating to electro-plating solutions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1095905A true GB1095905A (en) | 1967-12-20 |
Family
ID=10452719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4955265A Expired GB1095905A (en) | 1965-11-22 | 1965-11-22 | Improvements in or relating to electro-plating solutions |
Country Status (5)
| Country | Link |
|---|---|
| CH (1) | CH511288A (en) |
| ES (1) | ES333287A1 (en) |
| GB (1) | GB1095905A (en) |
| NL (1) | NL153945B (en) |
| SE (1) | SE336261B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4067783A (en) * | 1977-03-21 | 1978-01-10 | Bell Telephone Laboratories, Incorporated | Gold electroplating process |
| US5176811A (en) * | 1991-02-01 | 1993-01-05 | International Business Machines Corporation | Gold plating bath additives for copper circuitization on polyimide printed circuit boards |
| CN102899678A (en) * | 2012-09-10 | 2013-01-30 | 天津金瑞森科技发展有限公司 | Preparation process for silver potassium cyanide based on diaphragm electrolysis |
-
1965
- 1965-11-22 GB GB4955265A patent/GB1095905A/en not_active Expired
-
1966
- 1966-11-11 ES ES0333287A patent/ES333287A1/en not_active Expired
- 1966-11-16 CH CH1650066A patent/CH511288A/en not_active IP Right Cessation
- 1966-11-16 NL NL6616173A patent/NL153945B/en unknown
- 1966-11-17 SE SE1576766A patent/SE336261B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| ES333287A1 (en) | 1967-12-01 |
| NL153945B (en) | 1977-07-15 |
| NL6616173A (en) | 1967-05-23 |
| SE336261B (en) | 1971-06-28 |
| CH511288A (en) | 1971-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1143178A (en) | Palladium-nickel alloy plating bath | |
| US2027358A (en) | Electrodeposition of metals of the platinum group | |
| GB1151943A (en) | Improvements in or relating to the Etching of Metallic Copper | |
| GB1062681A (en) | Electrodeposition of palladium | |
| ES449678A1 (en) | Electroplating iron alloys containing nickel, cobalt or nickel and cobalt | |
| GB1095905A (en) | Improvements in or relating to electro-plating solutions | |
| ES440326A1 (en) | Electrode position of alloys of nickel, cobalt or nickel and cobalt with iron and electrolytes therefor | |
| GB752901A (en) | Method of producing an electroplate of nickel on magnesium and the magnesium-base alloys | |
| ES8404426A1 (en) | Electrolytic stripping process | |
| JPS56112500A (en) | Method for electroplating | |
| GB2023182A (en) | Electroplating tin or tin alloy | |
| GB958685A (en) | Improvements in or relating to palladium plating | |
| Netherton et al. | Electrodeposition of rhenium from aqueous solutions | |
| US4411744A (en) | Bath and process for high speed nickel electroplating | |
| US3293157A (en) | Process for electrolytic silvering | |
| GB957808A (en) | Electrodeposition of copper-nickel alloy | |
| FR2385817A1 (en) | PROCESS FOR PREPARING ACTIVE ANODES FOR ELECTROCHEMISTRY, IN PARTICULAR FOR PRODUCING HYDROGEN | |
| US3298938A (en) | Electrodeposition of zinc | |
| FR2252422A1 (en) | ||
| ES375190A1 (en) | Improvements in or relating to Electrode position of Ruthenium. | |
| GB760084A (en) | Improvements in and relating to the electrodeposition of antimony | |
| JPH04124293A (en) | Nickel-molybdenum alloy plating bath and plating method | |
| US3809628A (en) | Gold alloy plating process and solution | |
| GB526968A (en) | Improvements in or relating to methods of nickel plating and nickel plating solutions therefor | |
| SU486081A1 (en) | Electrolyte for silver based alloy deposition |