GB1151943A - Improvements in or relating to the Etching of Metallic Copper - Google Patents
Improvements in or relating to the Etching of Metallic CopperInfo
- Publication number
- GB1151943A GB1151943A GB15104/67A GB1510467A GB1151943A GB 1151943 A GB1151943 A GB 1151943A GB 15104/67 A GB15104/67 A GB 15104/67A GB 1510467 A GB1510467 A GB 1510467A GB 1151943 A GB1151943 A GB 1151943A
- Authority
- GB
- United Kingdom
- Prior art keywords
- etching
- solution
- copper
- metallic copper
- moles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 title abstract 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052802 copper Inorganic materials 0.000 title abstract 5
- 239000010949 copper Substances 0.000 title abstract 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 3
- 239000001117 sulphuric acid Substances 0.000 abstract 3
- 235000011149 sulphuric acid Nutrition 0.000 abstract 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- LXMQZGGLHVSEBA-UHFFFAOYSA-N chromium;trihydrate Chemical compound O.O.O.[Cr] LXMQZGGLHVSEBA-UHFFFAOYSA-N 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 238000002425 crystallisation Methods 0.000 abstract 1
- 230000008025 crystallization Effects 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000012452 mother liquor Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G3/00—Compounds of copper
- C01G3/10—Sulfates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Abstract
1,151,943. Etching. SIEMENS A.G. 3 April, 1967 [4 April, 1966], No. 15104/67. Heading B6J. [Also in Division C7] Metallic copper is etched with an aqueous chromosulphuric acid solution made from 1À5- 2À0 moles of chromium-VI-oxide and 1À5-2À5 moles of sulphuric acid per litre of solution. Hydrochloric acid may be added in an amount from 0À05-0À1 moles per litre and the etching may be at 40-50 C. The etching solution may be regenerated simultaneously with etching in the anode chamber of a diaphragm electrolytic cell. The etching solution is circulated between an etching vessel and the anode chamber, the chromium-III ions formed during etching being anodically oxidized and half the quantity of sulphuric acid used up during etching being reformed. Divalent copper formed during etching may be crystallized from the etching solution as copper sulphate by evaporation and/or cooling, the CuSO 4 dissolved in water and the solution fed to the cathode chamber of the cell where metallic copper is deposited and the other half of the sulphuric acid used up during etching is reformed. The etching solution is reconstituted from the mother liquor from the copper sulphate crystallization step and the liquid remaining in the cathode chamber after deposition of the metallic copper, water being removed or added as required.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0103016 | 1966-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1151943A true GB1151943A (en) | 1969-05-14 |
Family
ID=7524859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB15104/67A Expired GB1151943A (en) | 1966-04-04 | 1967-04-03 | Improvements in or relating to the Etching of Metallic Copper |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3615957A (en) |
| DE (1) | DE1521993B1 (en) |
| FR (1) | FR1520901A (en) |
| GB (1) | GB1151943A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5020922A (en) * | 1973-06-25 | 1975-03-05 | ||
| EP0011801A1 (en) * | 1978-11-22 | 1980-06-11 | Forschungszentrum Jülich Gmbh | Process for electrochemically machining metal surfaces |
| US4468305A (en) * | 1979-05-08 | 1984-08-28 | The Electricity Council | Method for the electrolytic regeneration of etchants for metals |
| GB2237818A (en) * | 1989-11-10 | 1991-05-15 | Kolbe & Co Hans | Apparatus for the electrolytic regeneration of etching solutions |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4073708A (en) * | 1976-06-18 | 1978-02-14 | The Boeing Company | Apparatus and method for regeneration of chromosulfuric acid etchants |
| DE2650912A1 (en) * | 1976-11-06 | 1978-05-18 | Hoellmueller Maschbau H | Electrolytic regeneration of copper etching reagent - contg. chloride and cuprous ion, with control of copper concn. in reagent and current density |
| US4097618A (en) * | 1977-03-09 | 1978-06-27 | Rca Corporation | Method of transferring a surface relief pattern from a poly(1-methyl-1-cyclopropene sulfone) layer to a non-metallic inorganic layer |
| US4371422A (en) * | 1980-10-15 | 1983-02-01 | Micro-Plate, Inc. | Continuous processing of printed circuit boards |
| DE3936363A1 (en) * | 1989-11-02 | 1991-05-08 | Hoellmueller Maschbau H | Etching unit esp. for printed copper circuit boards - in which used rinsing water is distilled to recover pure water and ammoniacal etchant to which ammonia is added prior to recycling |
| JP2010504423A (en) * | 2006-09-21 | 2010-02-12 | キュイテ−フェル エ チタン インコーポレイティド | Electrochemical method for recovery of metallic iron and chlorine values from iron-rich metal chloride waste |
| CA2718585C (en) * | 2008-03-20 | 2014-02-18 | Qit-Fer & Titane Inc. | Electrochemical process for the recovery of metallic iron and chlorine values from iron-rich metal chloride wastes |
| JP6604466B2 (en) * | 2015-03-25 | 2019-11-13 | 住友電気工業株式会社 | Copper manufacturing method and copper manufacturing apparatus |
| CN104911596A (en) * | 2015-06-01 | 2015-09-16 | 深圳中能润德环保有限公司 | Device and method for cyclic regeneration and copper extraction of etching liquid |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2507476A (en) * | 1946-02-04 | 1950-05-09 | Crimora Res & Dev Corp | Electrodeposition of chromium |
| US2872302A (en) * | 1957-09-12 | 1959-02-03 | Sylvania Electric Prod | Etchant |
-
1966
- 1966-04-04 DE DE19661521993 patent/DE1521993B1/en active Pending
-
1967
- 1967-03-29 FR FR100606A patent/FR1520901A/en not_active Expired
- 1967-04-03 US US627942A patent/US3615957A/en not_active Expired - Lifetime
- 1967-04-03 GB GB15104/67A patent/GB1151943A/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5020922A (en) * | 1973-06-25 | 1975-03-05 | ||
| JPS5248576B2 (en) * | 1973-06-25 | 1977-12-10 | ||
| EP0011801A1 (en) * | 1978-11-22 | 1980-06-11 | Forschungszentrum Jülich Gmbh | Process for electrochemically machining metal surfaces |
| US4468305A (en) * | 1979-05-08 | 1984-08-28 | The Electricity Council | Method for the electrolytic regeneration of etchants for metals |
| GB2237818A (en) * | 1989-11-10 | 1991-05-15 | Kolbe & Co Hans | Apparatus for the electrolytic regeneration of etching solutions |
Also Published As
| Publication number | Publication date |
|---|---|
| US3615957A (en) | 1971-10-26 |
| DE1521993B1 (en) | 1970-02-19 |
| FR1520901A (en) | 1968-04-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |