GB957808A - Electrodeposition of copper-nickel alloy - Google Patents

Electrodeposition of copper-nickel alloy

Info

Publication number
GB957808A
GB957808A GB511862A GB511862A GB957808A GB 957808 A GB957808 A GB 957808A GB 511862 A GB511862 A GB 511862A GB 511862 A GB511862 A GB 511862A GB 957808 A GB957808 A GB 957808A
Authority
GB
United Kingdom
Prior art keywords
alloy
electrodeposition
copper
saccharin
amps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB511862A
Inventor
Peter Louis Hawkes
Frederick George Tarbin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to GB511862A priority Critical patent/GB957808A/en
Publication of GB957808A publication Critical patent/GB957808A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

Ductile Cu/Ni alloy is electrolytically deposited from an aqueous bath comprising Cu and Ni salts, sodium citrate and saccharin. A typical aqueous electrolyte contains 150 g./l. tri-sodium citrate, 2 g./l. sodium chloride, 0.1-1.0 g./l. saccharin, 20 g./l. Ni, 1.27 g./l. Cu, these metals being added as their hydrated sulphates. The pH is about 5. Electrolysis is at 60 DEG C. using soluble anodes of 55% Cu/45% Ni alloy and a polished stainless steel cathode. A cathode current density of 0.4 amps./sq.dm. produces a ductile film containing 45% Ni and 0.7 amps./sq.dm. produces 70% Ni alloy.
GB511862A 1962-02-09 1962-02-09 Electrodeposition of copper-nickel alloy Expired GB957808A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB511862A GB957808A (en) 1962-02-09 1962-02-09 Electrodeposition of copper-nickel alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB511862A GB957808A (en) 1962-02-09 1962-02-09 Electrodeposition of copper-nickel alloy

Publications (1)

Publication Number Publication Date
GB957808A true GB957808A (en) 1964-05-13

Family

ID=9790051

Family Applications (1)

Application Number Title Priority Date Filing Date
GB511862A Expired GB957808A (en) 1962-02-09 1962-02-09 Electrodeposition of copper-nickel alloy

Country Status (1)

Country Link
GB (1) GB957808A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833481A (en) * 1972-12-18 1974-09-03 Buckbel Mears Co Electroforming nickel copper alloys
US4167459A (en) * 1979-01-08 1979-09-11 The United States Of America As Represented By The Secretary Of The Interior Electroplating with Ni-Cu alloy
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
CN103540977A (en) * 2013-10-12 2014-01-29 北京工业大学 Method for preparing high-gas tightness nickel-copper alloy for travelling wave tube
RU2588894C2 (en) * 2012-04-19 2016-07-10 Дипсол Кемикалз Ко., Лтд. Bath for electroplating of copper-nickel alloy and procedure for application of galvanic coating
DE102016217419A1 (en) 2016-09-13 2018-03-15 Leibniz-Institut Für Festkörper-Und Werkstoffforschung Dresden E.V. Electrolytes for electrochemical deposition of thermoelectric materials

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833481A (en) * 1972-12-18 1974-09-03 Buckbel Mears Co Electroforming nickel copper alloys
US4167459A (en) * 1979-01-08 1979-09-11 The United States Of America As Represented By The Secretary Of The Interior Electroplating with Ni-Cu alloy
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
RU2588894C2 (en) * 2012-04-19 2016-07-10 Дипсол Кемикалз Ко., Лтд. Bath for electroplating of copper-nickel alloy and procedure for application of galvanic coating
CN103540977A (en) * 2013-10-12 2014-01-29 北京工业大学 Method for preparing high-gas tightness nickel-copper alloy for travelling wave tube
DE102016217419A1 (en) 2016-09-13 2018-03-15 Leibniz-Institut Für Festkörper-Und Werkstoffforschung Dresden E.V. Electrolytes for electrochemical deposition of thermoelectric materials

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