JPS5675590A - Electroliytic copper plating method - Google Patents
Electroliytic copper plating methodInfo
- Publication number
- JPS5675590A JPS5675590A JP15062279A JP15062279A JPS5675590A JP S5675590 A JPS5675590 A JP S5675590A JP 15062279 A JP15062279 A JP 15062279A JP 15062279 A JP15062279 A JP 15062279A JP S5675590 A JPS5675590 A JP S5675590A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- soln
- hydrogen peroxide
- copper plating
- suboxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To prevent the accumulation of anions in a plating soln. and the decrease in pH and maintain soln. composition always under optimum conditions by performing the replenishment of copper ions into the electrolytic copper plating soln. by the combined use of copper suboxide and hydrogen peroxide.
CONSTITUTION: In an electrolytic copper plating method of using insoluble electrodes, hydrogen peroxide is used as an oxidizing agent in combination with copper suboxide at the time of replenishing copper ions. This results in increased dissolving rate of copper suboxide. Good results are obtained if this hydrogen peroxide is added in excess of about 1.2W1.5 times the theoretically required amount. The control of the soln. is made easy and the long-term continuation of copper plating is made possible by this copper ion replenishing method.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15062279A JPS5675590A (en) | 1979-11-22 | 1979-11-22 | Electroliytic copper plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15062279A JPS5675590A (en) | 1979-11-22 | 1979-11-22 | Electroliytic copper plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5675590A true JPS5675590A (en) | 1981-06-22 |
Family
ID=15500882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15062279A Pending JPS5675590A (en) | 1979-11-22 | 1979-11-22 | Electroliytic copper plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5675590A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11335888A (en) * | 1998-05-25 | 1999-12-07 | Hitachi Ltd | Plating liquid and plating |
CN104120463A (en) * | 2014-06-25 | 2014-10-29 | 济南大学 | Cyanide-free cuprous copper-plating surface modification method for steel matrix |
US9557119B2 (en) | 2009-05-08 | 2017-01-31 | Arvos Inc. | Heat transfer sheet for rotary regenerative heat exchanger |
-
1979
- 1979-11-22 JP JP15062279A patent/JPS5675590A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11335888A (en) * | 1998-05-25 | 1999-12-07 | Hitachi Ltd | Plating liquid and plating |
US9557119B2 (en) | 2009-05-08 | 2017-01-31 | Arvos Inc. | Heat transfer sheet for rotary regenerative heat exchanger |
CN104120463A (en) * | 2014-06-25 | 2014-10-29 | 济南大学 | Cyanide-free cuprous copper-plating surface modification method for steel matrix |
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