JPS5675590A - Electroliytic copper plating method - Google Patents

Electroliytic copper plating method

Info

Publication number
JPS5675590A
JPS5675590A JP15062279A JP15062279A JPS5675590A JP S5675590 A JPS5675590 A JP S5675590A JP 15062279 A JP15062279 A JP 15062279A JP 15062279 A JP15062279 A JP 15062279A JP S5675590 A JPS5675590 A JP S5675590A
Authority
JP
Japan
Prior art keywords
copper
soln
hydrogen peroxide
copper plating
suboxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15062279A
Other languages
Japanese (ja)
Inventor
Toshiharu Kikko
Yoshio Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Nisshin Co Ltd
Original Assignee
Nisshin Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nisshin Steel Co Ltd filed Critical Nisshin Steel Co Ltd
Priority to JP15062279A priority Critical patent/JPS5675590A/en
Publication of JPS5675590A publication Critical patent/JPS5675590A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To prevent the accumulation of anions in a plating soln. and the decrease in pH and maintain soln. composition always under optimum conditions by performing the replenishment of copper ions into the electrolytic copper plating soln. by the combined use of copper suboxide and hydrogen peroxide.
CONSTITUTION: In an electrolytic copper plating method of using insoluble electrodes, hydrogen peroxide is used as an oxidizing agent in combination with copper suboxide at the time of replenishing copper ions. This results in increased dissolving rate of copper suboxide. Good results are obtained if this hydrogen peroxide is added in excess of about 1.2W1.5 times the theoretically required amount. The control of the soln. is made easy and the long-term continuation of copper plating is made possible by this copper ion replenishing method.
COPYRIGHT: (C)1981,JPO&Japio
JP15062279A 1979-11-22 1979-11-22 Electroliytic copper plating method Pending JPS5675590A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15062279A JPS5675590A (en) 1979-11-22 1979-11-22 Electroliytic copper plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15062279A JPS5675590A (en) 1979-11-22 1979-11-22 Electroliytic copper plating method

Publications (1)

Publication Number Publication Date
JPS5675590A true JPS5675590A (en) 1981-06-22

Family

ID=15500882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15062279A Pending JPS5675590A (en) 1979-11-22 1979-11-22 Electroliytic copper plating method

Country Status (1)

Country Link
JP (1) JPS5675590A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11335888A (en) * 1998-05-25 1999-12-07 Hitachi Ltd Plating liquid and plating
CN104120463A (en) * 2014-06-25 2014-10-29 济南大学 Cyanide-free cuprous copper-plating surface modification method for steel matrix
US9557119B2 (en) 2009-05-08 2017-01-31 Arvos Inc. Heat transfer sheet for rotary regenerative heat exchanger

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11335888A (en) * 1998-05-25 1999-12-07 Hitachi Ltd Plating liquid and plating
US9557119B2 (en) 2009-05-08 2017-01-31 Arvos Inc. Heat transfer sheet for rotary regenerative heat exchanger
CN104120463A (en) * 2014-06-25 2014-10-29 济南大学 Cyanide-free cuprous copper-plating surface modification method for steel matrix

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