JPS5389657A - Electrode forming method of group iii-v compound semiconductor - Google Patents

Electrode forming method of group iii-v compound semiconductor

Info

Publication number
JPS5389657A
JPS5389657A JP480177A JP480177A JPS5389657A JP S5389657 A JPS5389657 A JP S5389657A JP 480177 A JP480177 A JP 480177A JP 480177 A JP480177 A JP 480177A JP S5389657 A JPS5389657 A JP S5389657A
Authority
JP
Japan
Prior art keywords
forming method
compound semiconductor
group iii
electrode forming
degradation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP480177A
Other languages
Japanese (ja)
Inventor
Hiroshi Hayashi
Kazuhisa Murata
Takeshi Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP480177A priority Critical patent/JPS5389657A/en
Publication of JPS5389657A publication Critical patent/JPS5389657A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: To prevent the degradation of electrodes by forming a surface electrode layer through the introduction of a gold plating method and suitably selecting the thickness thereof.
COPYRIGHT: (C)1978,JPO&Japio
JP480177A 1977-01-18 1977-01-18 Electrode forming method of group iii-v compound semiconductor Pending JPS5389657A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP480177A JPS5389657A (en) 1977-01-18 1977-01-18 Electrode forming method of group iii-v compound semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP480177A JPS5389657A (en) 1977-01-18 1977-01-18 Electrode forming method of group iii-v compound semiconductor

Publications (1)

Publication Number Publication Date
JPS5389657A true JPS5389657A (en) 1978-08-07

Family

ID=11593860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP480177A Pending JPS5389657A (en) 1977-01-18 1977-01-18 Electrode forming method of group iii-v compound semiconductor

Country Status (1)

Country Link
JP (1) JPS5389657A (en)

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