JPS5437571A - Formation method of bump eectrode - Google Patents

Formation method of bump eectrode

Info

Publication number
JPS5437571A
JPS5437571A JP10385777A JP10385777A JPS5437571A JP S5437571 A JPS5437571 A JP S5437571A JP 10385777 A JP10385777 A JP 10385777A JP 10385777 A JP10385777 A JP 10385777A JP S5437571 A JPS5437571 A JP S5437571A
Authority
JP
Japan
Prior art keywords
eectrode
bump
formation method
bump electrode
formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10385777A
Other languages
Japanese (ja)
Inventor
Masahiro Sekine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10385777A priority Critical patent/JPS5437571A/en
Publication of JPS5437571A publication Critical patent/JPS5437571A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To manufacture a highly reliable bump electrode with strong adhesion by preventing an etching solution from infiltrating into a adhesive surface during the formation of the bump electrode.
COPYRIGHT: (C)1979,JPO&Japio
JP10385777A 1977-08-29 1977-08-29 Formation method of bump eectrode Pending JPS5437571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10385777A JPS5437571A (en) 1977-08-29 1977-08-29 Formation method of bump eectrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10385777A JPS5437571A (en) 1977-08-29 1977-08-29 Formation method of bump eectrode

Publications (1)

Publication Number Publication Date
JPS5437571A true JPS5437571A (en) 1979-03-20

Family

ID=14365108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10385777A Pending JPS5437571A (en) 1977-08-29 1977-08-29 Formation method of bump eectrode

Country Status (1)

Country Link
JP (1) JPS5437571A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5583073A (en) * 1995-01-05 1996-12-10 National Science Council Method for producing electroless barrier layer and solder bump on chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5583073A (en) * 1995-01-05 1996-12-10 National Science Council Method for producing electroless barrier layer and solder bump on chip

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