JPS5418275A - Forming method of ohmic contact - Google Patents

Forming method of ohmic contact

Info

Publication number
JPS5418275A
JPS5418275A JP8327977A JP8327977A JPS5418275A JP S5418275 A JPS5418275 A JP S5418275A JP 8327977 A JP8327977 A JP 8327977A JP 8327977 A JP8327977 A JP 8327977A JP S5418275 A JPS5418275 A JP S5418275A
Authority
JP
Japan
Prior art keywords
ohmic contact
forming method
formation
metal layer
featuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8327977A
Other languages
Japanese (ja)
Inventor
Setsuo Hiraoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP8327977A priority Critical patent/JPS5418275A/en
Publication of JPS5418275A publication Critical patent/JPS5418275A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To ensure the formation of an ohmic contact featuring a high degree of adhesion by giving a heating process with a range within which Si does not reach the metal layer surface at or after formation of the metal layer.
COPYRIGHT: (C)1979,JPO&Japio
JP8327977A 1977-07-11 1977-07-11 Forming method of ohmic contact Pending JPS5418275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8327977A JPS5418275A (en) 1977-07-11 1977-07-11 Forming method of ohmic contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8327977A JPS5418275A (en) 1977-07-11 1977-07-11 Forming method of ohmic contact

Publications (1)

Publication Number Publication Date
JPS5418275A true JPS5418275A (en) 1979-02-10

Family

ID=13797914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8327977A Pending JPS5418275A (en) 1977-07-11 1977-07-11 Forming method of ohmic contact

Country Status (1)

Country Link
JP (1) JPS5418275A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5693317A (en) * 1979-12-26 1981-07-28 Nec Home Electronics Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5693317A (en) * 1979-12-26 1981-07-28 Nec Home Electronics Ltd Manufacture of semiconductor device

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