JPS544830A - Preparation of low melting point metal plating wire - Google Patents

Preparation of low melting point metal plating wire

Info

Publication number
JPS544830A
JPS544830A JP7066477A JP7066477A JPS544830A JP S544830 A JPS544830 A JP S544830A JP 7066477 A JP7066477 A JP 7066477A JP 7066477 A JP7066477 A JP 7066477A JP S544830 A JPS544830 A JP S544830A
Authority
JP
Japan
Prior art keywords
melting point
point metal
low melting
preparation
metal plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7066477A
Other languages
Japanese (ja)
Other versions
JPS5856759B2 (en
Inventor
Shinichi Kiyota
Masaru Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP7066477A priority Critical patent/JPS5856759B2/en
Publication of JPS544830A publication Critical patent/JPS544830A/en
Publication of JPS5856759B2 publication Critical patent/JPS5856759B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To obtain the low melting point metal plating wire having a good soldering property with a high efficiency and at a low cost, by forming plating layer of low melting point metal on the surface of metal wire rod and heating in vertical traveling state after stretching and then, melting and resolidifying the above plating layer.
COPYRIGHT: (C)1979,JPO&Japio
JP7066477A 1977-06-15 1977-06-15 Manufacturing method of low melting point metal plated wire Expired JPS5856759B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7066477A JPS5856759B2 (en) 1977-06-15 1977-06-15 Manufacturing method of low melting point metal plated wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7066477A JPS5856759B2 (en) 1977-06-15 1977-06-15 Manufacturing method of low melting point metal plated wire

Publications (2)

Publication Number Publication Date
JPS544830A true JPS544830A (en) 1979-01-13
JPS5856759B2 JPS5856759B2 (en) 1983-12-16

Family

ID=13438148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7066477A Expired JPS5856759B2 (en) 1977-06-15 1977-06-15 Manufacturing method of low melting point metal plated wire

Country Status (1)

Country Link
JP (1) JPS5856759B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191642U (en) * 1983-06-06 1984-12-19 株式会社　千代田製作所 Environmental tester
CN108396314A (en) * 2018-01-22 2018-08-14 南昌大学 A kind of surface modifying method of titanium alloy surface chemical deposit electron beam remelting again

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191642U (en) * 1983-06-06 1984-12-19 株式会社　千代田製作所 Environmental tester
JPH0320763Y2 (en) * 1983-06-06 1991-05-07
CN108396314A (en) * 2018-01-22 2018-08-14 南昌大学 A kind of surface modifying method of titanium alloy surface chemical deposit electron beam remelting again

Also Published As

Publication number Publication date
JPS5856759B2 (en) 1983-12-16

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