JPS5413262A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5413262A
JPS5413262A JP7784677A JP7784677A JPS5413262A JP S5413262 A JPS5413262 A JP S5413262A JP 7784677 A JP7784677 A JP 7784677A JP 7784677 A JP7784677 A JP 7784677A JP S5413262 A JPS5413262 A JP S5413262A
Authority
JP
Japan
Prior art keywords
semiconductor device
solder
mated
soldered
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7784677A
Other languages
Japanese (ja)
Inventor
Masao Tsuruoka
Hideyuki Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7784677A priority Critical patent/JPS5413262A/en
Publication of JPS5413262A publication Critical patent/JPS5413262A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE: To obtain the copper carbon fiber composite material electrode having no solder flowing out, by coating the part other than the parts to be soldered on the electrode surface with heat-resistant film not mated to the solder.
COPYRIGHT: (C)1979,JPO&Japio
JP7784677A 1977-07-01 1977-07-01 Semiconductor device Pending JPS5413262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7784677A JPS5413262A (en) 1977-07-01 1977-07-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7784677A JPS5413262A (en) 1977-07-01 1977-07-01 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5413262A true JPS5413262A (en) 1979-01-31

Family

ID=13645409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7784677A Pending JPS5413262A (en) 1977-07-01 1977-07-01 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5413262A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834374A (en) * 1994-09-30 1998-11-10 International Business Machines Corporation Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834374A (en) * 1994-09-30 1998-11-10 International Business Machines Corporation Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates
US5945737A (en) * 1994-09-30 1999-08-31 International Business Machines Corporation Thin film or solder ball including a metal and an oxide, nitride, or carbide precipitate of an expandable or contractible element

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