JPS5396760A - Case for semiconductor device and production of the same - Google Patents

Case for semiconductor device and production of the same

Info

Publication number
JPS5396760A
JPS5396760A JP1078077A JP1078077A JPS5396760A JP S5396760 A JPS5396760 A JP S5396760A JP 1078077 A JP1078077 A JP 1078077A JP 1078077 A JP1078077 A JP 1078077A JP S5396760 A JPS5396760 A JP S5396760A
Authority
JP
Japan
Prior art keywords
case
production
same
semiconductor device
make
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1078077A
Other languages
Japanese (ja)
Inventor
Teruo Kato
Masato Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1078077A priority Critical patent/JPS5396760A/en
Publication of JPS5396760A publication Critical patent/JPS5396760A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To make a case of less crack production by a metal sinter of relative density ratios 90 to 98 % without applying brazing.
COPYRIGHT: (C)1978,JPO&Japio
JP1078077A 1977-02-04 1977-02-04 Case for semiconductor device and production of the same Pending JPS5396760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1078077A JPS5396760A (en) 1977-02-04 1977-02-04 Case for semiconductor device and production of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1078077A JPS5396760A (en) 1977-02-04 1977-02-04 Case for semiconductor device and production of the same

Publications (1)

Publication Number Publication Date
JPS5396760A true JPS5396760A (en) 1978-08-24

Family

ID=11759838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1078077A Pending JPS5396760A (en) 1977-02-04 1977-02-04 Case for semiconductor device and production of the same

Country Status (1)

Country Link
JP (1) JPS5396760A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342147A (en) * 1986-08-07 1988-02-23 Shinko Electric Ind Co Ltd Manufacture of ceramic package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342147A (en) * 1986-08-07 1988-02-23 Shinko Electric Ind Co Ltd Manufacture of ceramic package

Similar Documents

Publication Publication Date Title
JPS51119419A (en) Valve guide material
JPS522277A (en) Soldering device
JPS52140269A (en) Formation of solder electrode
JPS5396760A (en) Case for semiconductor device and production of the same
JPS53120383A (en) Production of semiconductor device
JPS5216068A (en) Parts insertion device
JPS5361973A (en) Production of semiconductor element
JPS5419652A (en) Lead bonding method
JPS5425165A (en) Semiconductor device
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5425256A (en) Method of producing powdered tungsten
JPS5310266A (en) Production of soldred semiconductor wafers
JPS52143764A (en) Metal connecting method
JPS51124767A (en) A tapping screw and the preparation method
JPS527668A (en) Method of manufacturing microchannel plates
JPS5225000A (en) Method for production of feb powder
JPS5416979A (en) Production of semiconuctor device
JPS52143186A (en) Taping device
JPS527273A (en) Binding method of watch parts
JPS5230163A (en) Method for junction of semiconductor parts
JPS51147958A (en) Method for forming metal electrode
JPS544568A (en) Semiconductor device and production of the same
JPS5227280A (en) Method to form pinholes
JPS5384974A (en) 7-leucylamino-4-methylcoumarin and its production
JPS5273675A (en) Structure of die bonding