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Hitachi Ltd
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Hitachi Ltd
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Priority to JP283576ApriorityCriticalpatent/JPS5286776A/en
Publication of JPS5286776ApublicationCriticalpatent/JPS5286776A/en
Internal Circuitry In Semiconductor Integrated Circuit Devices
(AREA)
Abstract
PURPOSE: To form a uniform thin olating film on the surface of each lead wire by performing barrel-plating to the structure wherein the anode lead, cathode lead and gate lead of elements are conducting.
COPYRIGHT: (C)1977,JPO&Japio
JP283576A1976-01-141976-01-14Package plating method for semiconductor elements
PendingJPS5286776A
(en)