JPS57203787A - Gold-indium alloy plating method - Google Patents
Gold-indium alloy plating methodInfo
- Publication number
- JPS57203787A JPS57203787A JP8860581A JP8860581A JPS57203787A JP S57203787 A JPS57203787 A JP S57203787A JP 8860581 A JP8860581 A JP 8860581A JP 8860581 A JP8860581 A JP 8860581A JP S57203787 A JPS57203787 A JP S57203787A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- gold
- indium
- plating
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To obtain a thick plating layer which has perfect specular surface gloss, high hardness, excellent abrasion resistance, adhesive property and corrosion resistance, by adding trivalent gold containing cyanogen, to a plating liquid of low pH containing indium salt, and performing electric plating.
CONSTITUTION: Trivalent gold containing cyanogen is added by 1W30g/l to a plating liquid whose pH is ≤3.0, containing 10W400g/l of acidic oxide of acetic acid, citric acid, tartaric acid, phosphoric acid, lactic acid, etc., and 0.1W50g/l as metallic indium in the form of soluble salt in an acidic oxide solution based on salt of sulfuric acid, sulphamic acid, citric acid, tartaric acid, phosphoric acid, etc., also an interfacial active agent such as polyethylene glycol, etc. is contained as necessary, electric plating is performed at a bath temperature of 20W70°C and by current density of 0.1W5A/dm2, and a thick plating layer of gold-indium is obtained.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8860581A JPS57203787A (en) | 1981-06-09 | 1981-06-09 | Gold-indium alloy plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8860581A JPS57203787A (en) | 1981-06-09 | 1981-06-09 | Gold-indium alloy plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57203787A true JPS57203787A (en) | 1982-12-14 |
| JPH0123557B2 JPH0123557B2 (en) | 1989-05-02 |
Family
ID=13947442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8860581A Granted JPS57203787A (en) | 1981-06-09 | 1981-06-09 | Gold-indium alloy plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57203787A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009287118A (en) * | 2008-04-22 | 2009-12-10 | Rohm & Haas Electronic Materials Llc | Method of replenishing indium ions in indium electroplating composition |
| KR20160085790A (en) | 2013-11-08 | 2016-07-18 | 니신 쇼쿠힌 홀딩스 가부시키가이샤 | Noodle cutting machine and raw noodles |
-
1981
- 1981-06-09 JP JP8860581A patent/JPS57203787A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009287118A (en) * | 2008-04-22 | 2009-12-10 | Rohm & Haas Electronic Materials Llc | Method of replenishing indium ions in indium electroplating composition |
| US8491773B2 (en) | 2008-04-22 | 2013-07-23 | Rohm And Haas Electronic Materials Llc | Method of replenishing indium ions in indium electroplating compositions |
| KR20160085790A (en) | 2013-11-08 | 2016-07-18 | 니신 쇼쿠힌 홀딩스 가부시키가이샤 | Noodle cutting machine and raw noodles |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0123557B2 (en) | 1989-05-02 |
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