JPS57145954A - Thin copper alloy wire with high strength and flexibility - Google Patents

Thin copper alloy wire with high strength and flexibility

Info

Publication number
JPS57145954A
JPS57145954A JP3226981A JP3226981A JPS57145954A JP S57145954 A JPS57145954 A JP S57145954A JP 3226981 A JP3226981 A JP 3226981A JP 3226981 A JP3226981 A JP 3226981A JP S57145954 A JPS57145954 A JP S57145954A
Authority
JP
Japan
Prior art keywords
alloy wire
flexibility
high strength
copper alloy
thin copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3226981A
Other languages
Japanese (ja)
Inventor
Toshiaki Takano
Norihiko Kamiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP3226981A priority Critical patent/JPS57145954A/en
Publication of JPS57145954A publication Critical patent/JPS57145954A/en
Pending legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PURPOSE: To obtain a thin Cu alloy wire with high strength and flexibility by adding specified small amounts of Sn and Ag to Cu as a principal component.
CONSTITUTION: The alloy composition of a thin Cu alloy wire is composed of Cu, 0.1W1wt.% Sn and 0.1W0.49wt.% Ag. By adding a little Sn and a little Ag to Cu, a thin Cu alloy wire with high strength and flexibility is obtd. without deteriorating the electric conductivity peculiar to Cu. To the composition may be added ≤0.2% P, Zn or Mn.
COPYRIGHT: (C)1982,JPO&Japio
JP3226981A 1981-03-06 1981-03-06 Thin copper alloy wire with high strength and flexibility Pending JPS57145954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3226981A JPS57145954A (en) 1981-03-06 1981-03-06 Thin copper alloy wire with high strength and flexibility

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3226981A JPS57145954A (en) 1981-03-06 1981-03-06 Thin copper alloy wire with high strength and flexibility

Publications (1)

Publication Number Publication Date
JPS57145954A true JPS57145954A (en) 1982-09-09

Family

ID=12354275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3226981A Pending JPS57145954A (en) 1981-03-06 1981-03-06 Thin copper alloy wire with high strength and flexibility

Country Status (1)

Country Link
JP (1) JPS57145954A (en)

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