JPS57145955A - Thin copper alloy wire with high strength and flexibility - Google Patents

Thin copper alloy wire with high strength and flexibility

Info

Publication number
JPS57145955A
JPS57145955A JP3227081A JP3227081A JPS57145955A JP S57145955 A JPS57145955 A JP S57145955A JP 3227081 A JP3227081 A JP 3227081A JP 3227081 A JP3227081 A JP 3227081A JP S57145955 A JPS57145955 A JP S57145955A
Authority
JP
Japan
Prior art keywords
alloy wire
flexibility
high strength
copper alloy
thin copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3227081A
Other languages
Japanese (ja)
Inventor
Toshiaki Takano
Norihiko Kamiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP3227081A priority Critical patent/JPS57145955A/en
Publication of JPS57145955A publication Critical patent/JPS57145955A/en
Pending legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PURPOSE: To obtain a thin Cu alloy wire with high strength and flexibility by adding specified small amounts of Sn and Si to Cu as a principal component.
CONSTITUTION: The alloy composition of a thin Cu alloy wire composed of Cu, 0.1W1wt.% Sn and 0.1W0.8wt% Si. By adding a little Sn and a little Si to Cu, a thin Cu alloy wire with high strength and flexibility is obtd. without deteriorating the electric conductivity peculiar to Cu. To the composition may be added ≤0.2% P, Zn or Mn.
COPYRIGHT: (C)1982,JPO&Japio
JP3227081A 1981-03-06 1981-03-06 Thin copper alloy wire with high strength and flexibility Pending JPS57145955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3227081A JPS57145955A (en) 1981-03-06 1981-03-06 Thin copper alloy wire with high strength and flexibility

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3227081A JPS57145955A (en) 1981-03-06 1981-03-06 Thin copper alloy wire with high strength and flexibility

Publications (1)

Publication Number Publication Date
JPS57145955A true JPS57145955A (en) 1982-09-09

Family

ID=12354300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3227081A Pending JPS57145955A (en) 1981-03-06 1981-03-06 Thin copper alloy wire with high strength and flexibility

Country Status (1)

Country Link
JP (1) JPS57145955A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE35624E (en) * 1990-01-05 1997-10-07 Kiilunen; David D. Wires made of copper-based alloy compositions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE35624E (en) * 1990-01-05 1997-10-07 Kiilunen; David D. Wires made of copper-based alloy compositions

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