JPS56136970A - Chemical copper plating bath - Google Patents
Chemical copper plating bathInfo
- Publication number
- JPS56136970A JPS56136970A JP4039280A JP4039280A JPS56136970A JP S56136970 A JPS56136970 A JP S56136970A JP 4039280 A JP4039280 A JP 4039280A JP 4039280 A JP4039280 A JP 4039280A JP S56136970 A JPS56136970 A JP S56136970A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper plating
- plated
- chemical copper
- plating bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prevent the deposition of copper on a part other than a surface to be plated and enhance the smoothness and brightness of a plated film by adding dipyridyl, polyalkylene glycol and sodium hydrogensulfite to a basic bath for chemical copper plating.
CONSTITUTION: To a basic bath for chemical copper plating contg. copper sulfate as copper salt, EDTA as a complexing agent, formaldehyde as a Cu ion reducing agent and alkali hydroxide as a pH adjusting agent are added 0.1W50mg/l dipyridyl, 0.1W20g/l polyethylene glycol or other polyalkylene glycol and 0.1W50g/l sodium hydrogensulfite. Thus, the smoothness and brightness of a copper plated film are enhanced, and no copper is deposited on a part other than a surface to be plated.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55040392A JPS5856031B2 (en) | 1980-03-31 | 1980-03-31 | Chemical copper plating liquid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55040392A JPS5856031B2 (en) | 1980-03-31 | 1980-03-31 | Chemical copper plating liquid |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56136970A true JPS56136970A (en) | 1981-10-26 |
JPS5856031B2 JPS5856031B2 (en) | 1983-12-13 |
Family
ID=12579381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55040392A Expired JPS5856031B2 (en) | 1980-03-31 | 1980-03-31 | Chemical copper plating liquid |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5856031B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002088423A1 (en) * | 2001-04-27 | 2002-11-07 | Sumitomo Special Metals Co., Ltd. | Copper plating solution and method for copper plating |
AU2005202863B2 (en) * | 2004-09-06 | 2006-11-30 | Nippon Mining & Metals Co., Ltd. | Method for producing sheet-form electrolytic copper |
JP2014129598A (en) * | 2012-12-26 | 2014-07-10 | Rohm & Haas Electronic Materials Llc | Electroless copper plating composition not containing formaldehyde and method |
-
1980
- 1980-03-31 JP JP55040392A patent/JPS5856031B2/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002088423A1 (en) * | 2001-04-27 | 2002-11-07 | Sumitomo Special Metals Co., Ltd. | Copper plating solution and method for copper plating |
JP2002327278A (en) * | 2001-04-27 | 2002-11-15 | Sumitomo Special Metals Co Ltd | Copper plating liquid and copper plating method |
US7517555B2 (en) | 2001-04-27 | 2009-04-14 | Hitachi Metals, Ltd. | Copper plating solution and method for copper plating |
JP4595237B2 (en) * | 2001-04-27 | 2010-12-08 | 日立金属株式会社 | Copper plating solution and copper plating method |
AU2005202863B2 (en) * | 2004-09-06 | 2006-11-30 | Nippon Mining & Metals Co., Ltd. | Method for producing sheet-form electrolytic copper |
JP2014129598A (en) * | 2012-12-26 | 2014-07-10 | Rohm & Haas Electronic Materials Llc | Electroless copper plating composition not containing formaldehyde and method |
Also Published As
Publication number | Publication date |
---|---|
JPS5856031B2 (en) | 1983-12-13 |
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