JPS56136970A - Chemical copper plating bath - Google Patents

Chemical copper plating bath

Info

Publication number
JPS56136970A
JPS56136970A JP4039280A JP4039280A JPS56136970A JP S56136970 A JPS56136970 A JP S56136970A JP 4039280 A JP4039280 A JP 4039280A JP 4039280 A JP4039280 A JP 4039280A JP S56136970 A JPS56136970 A JP S56136970A
Authority
JP
Japan
Prior art keywords
copper
copper plating
plated
chemical copper
plating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4039280A
Other languages
Japanese (ja)
Other versions
JPS5856031B2 (en
Inventor
Yasuo Mori
Yoshio Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP55040392A priority Critical patent/JPS5856031B2/en
Publication of JPS56136970A publication Critical patent/JPS56136970A/en
Publication of JPS5856031B2 publication Critical patent/JPS5856031B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the deposition of copper on a part other than a surface to be plated and enhance the smoothness and brightness of a plated film by adding dipyridyl, polyalkylene glycol and sodium hydrogensulfite to a basic bath for chemical copper plating.
CONSTITUTION: To a basic bath for chemical copper plating contg. copper sulfate as copper salt, EDTA as a complexing agent, formaldehyde as a Cu ion reducing agent and alkali hydroxide as a pH adjusting agent are added 0.1W50mg/l dipyridyl, 0.1W20g/l polyethylene glycol or other polyalkylene glycol and 0.1W50g/l sodium hydrogensulfite. Thus, the smoothness and brightness of a copper plated film are enhanced, and no copper is deposited on a part other than a surface to be plated.
COPYRIGHT: (C)1981,JPO&Japio
JP55040392A 1980-03-31 1980-03-31 Chemical copper plating liquid Expired JPS5856031B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55040392A JPS5856031B2 (en) 1980-03-31 1980-03-31 Chemical copper plating liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55040392A JPS5856031B2 (en) 1980-03-31 1980-03-31 Chemical copper plating liquid

Publications (2)

Publication Number Publication Date
JPS56136970A true JPS56136970A (en) 1981-10-26
JPS5856031B2 JPS5856031B2 (en) 1983-12-13

Family

ID=12579381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55040392A Expired JPS5856031B2 (en) 1980-03-31 1980-03-31 Chemical copper plating liquid

Country Status (1)

Country Link
JP (1) JPS5856031B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002088423A1 (en) * 2001-04-27 2002-11-07 Sumitomo Special Metals Co., Ltd. Copper plating solution and method for copper plating
AU2005202863B2 (en) * 2004-09-06 2006-11-30 Nippon Mining & Metals Co., Ltd. Method for producing sheet-form electrolytic copper
JP2014129598A (en) * 2012-12-26 2014-07-10 Rohm & Haas Electronic Materials Llc Electroless copper plating composition not containing formaldehyde and method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002088423A1 (en) * 2001-04-27 2002-11-07 Sumitomo Special Metals Co., Ltd. Copper plating solution and method for copper plating
JP2002327278A (en) * 2001-04-27 2002-11-15 Sumitomo Special Metals Co Ltd Copper plating liquid and copper plating method
US7517555B2 (en) 2001-04-27 2009-04-14 Hitachi Metals, Ltd. Copper plating solution and method for copper plating
JP4595237B2 (en) * 2001-04-27 2010-12-08 日立金属株式会社 Copper plating solution and copper plating method
AU2005202863B2 (en) * 2004-09-06 2006-11-30 Nippon Mining & Metals Co., Ltd. Method for producing sheet-form electrolytic copper
JP2014129598A (en) * 2012-12-26 2014-07-10 Rohm & Haas Electronic Materials Llc Electroless copper plating composition not containing formaldehyde and method

Also Published As

Publication number Publication date
JPS5856031B2 (en) 1983-12-13

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