JPS579866A - Electroless copper plating solution - Google Patents

Electroless copper plating solution

Info

Publication number
JPS579866A
JPS579866A JP8291480A JP8291480A JPS579866A JP S579866 A JPS579866 A JP S579866A JP 8291480 A JP8291480 A JP 8291480A JP 8291480 A JP8291480 A JP 8291480A JP S579866 A JPS579866 A JP S579866A
Authority
JP
Japan
Prior art keywords
copper
plating soln
electroless copper
plating
ion complexing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8291480A
Other languages
Japanese (ja)
Inventor
Osamu Miyazawa
Hitoshi Oka
Ataru Yokono
Tokio Isogai
Isamu Tanaka
Akira Matsuo
Yoshio Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8291480A priority Critical patent/JPS579866A/en
Publication of JPS579866A publication Critical patent/JPS579866A/en
Pending legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To improve the stability of an electroless copper plating soln. without exerting disadvantageous influence on the deposition speed and the physical properties of a film by adding a monovalent copper chelating agent contg. a nitrogen ring to the plating soln.
CONSTITUTION: This electroless copper plating soln. is prepared by blending water with water-soluble copper salt, a divalent copper ion complexing agent, a pH regulator, a copper ion reducing agent and ≥1 kinds of cuprous ion complexing agents such as ethylenediamine tetraacetates represented by formula I, II, III (where X in -N-, X' is -NH- or -CH2- and each of R and R' is -(CH2)2-, -CH=CH-, -N= N- or the like). The cuprous ion complexing agents are added alone or after mixing with a nonionic surfactant. By this composition the plating speed and the physical and mechanical properties of a plated film and enhanced, and the stability of the plating soln. is ensured.
COPYRIGHT: (C)1982,JPO&Japio
JP8291480A 1980-06-20 1980-06-20 Electroless copper plating solution Pending JPS579866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8291480A JPS579866A (en) 1980-06-20 1980-06-20 Electroless copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8291480A JPS579866A (en) 1980-06-20 1980-06-20 Electroless copper plating solution

Publications (1)

Publication Number Publication Date
JPS579866A true JPS579866A (en) 1982-01-19

Family

ID=13787512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8291480A Pending JPS579866A (en) 1980-06-20 1980-06-20 Electroless copper plating solution

Country Status (1)

Country Link
JP (1) JPS579866A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021383A (en) * 1983-07-12 1985-02-02 C Uyemura & Co Ltd Method for chemically plating copper
US5059243A (en) * 1989-04-28 1991-10-22 International Business Machines Corporation Tetra aza ligand systems as complexing agents for electroless deposition of copper
JP2014043412A (en) * 2012-08-27 2014-03-13 Shikoku Chem Corp 4-naphthyl imidazole compound and antioxidant

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021383A (en) * 1983-07-12 1985-02-02 C Uyemura & Co Ltd Method for chemically plating copper
JPH0222151B2 (en) * 1983-07-12 1990-05-17 Uemura Kogyo Kk
US5059243A (en) * 1989-04-28 1991-10-22 International Business Machines Corporation Tetra aza ligand systems as complexing agents for electroless deposition of copper
JP2014043412A (en) * 2012-08-27 2014-03-13 Shikoku Chem Corp 4-naphthyl imidazole compound and antioxidant

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