JPS56271A - Non-electrolytic copper plating solution - Google Patents
Non-electrolytic copper plating solutionInfo
- Publication number
- JPS56271A JPS56271A JP7461579A JP7461579A JPS56271A JP S56271 A JPS56271 A JP S56271A JP 7461579 A JP7461579 A JP 7461579A JP 7461579 A JP7461579 A JP 7461579A JP S56271 A JPS56271 A JP S56271A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- cupric
- agent
- plating
- polyoxyalkylamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To render a plating liquid stable and to enhance mechanical property of plated film by a method wherein nonion surfactant based on polyoxyalkylamine is added to a non-electrolytic plating liquid consisting of water soluble cupric salt, complexing agent of cupric ions, etc.
CONSTITUTION: A non-electrolytic plating solution consists of at least one of water soluble cupric salts selected from the group of sulfate, nitrate, etc., at least one of cupric-ion complexing-agents selected from the group of ethylene diamine tetra- acetate, etc., a pH control agent such as alkali metal hydroxides or sulfuric acid, and a reducing agent for copper ions such as formaldehyde. The plating solution may contain a cuprous-ion complexing-agent such as sodium cyanate. To this plating solution, is added a proper amount of nonion surfactant based on polyoxyalkylamine which is obtained by adding amines to PE, PP. In this manner , the plating solution is stabilized, its service life is prolonged, the plating speed is increased, and the mechanical strength of the plated film is enhanced.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7461579A JPS56271A (en) | 1979-06-15 | 1979-06-15 | Non-electrolytic copper plating solution |
| US06/159,231 US4303443A (en) | 1979-06-15 | 1980-06-13 | Electroless copper plating solution |
| DE8080302009T DE3066952D1 (en) | 1979-06-15 | 1980-06-16 | Electroless copper plating solution |
| EP80302009A EP0021757B1 (en) | 1979-06-15 | 1980-06-16 | Electroless copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7461579A JPS56271A (en) | 1979-06-15 | 1979-06-15 | Non-electrolytic copper plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56271A true JPS56271A (en) | 1981-01-06 |
Family
ID=13552245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7461579A Pending JPS56271A (en) | 1979-06-15 | 1979-06-15 | Non-electrolytic copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56271A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57192255A (en) * | 1981-05-18 | 1982-11-26 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| JPS59116366A (en) * | 1982-12-24 | 1984-07-05 | Hitachi Ltd | Chemical copper plating solution |
| US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
| JPH02250978A (en) * | 1989-03-23 | 1990-10-08 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| JPH0320474A (en) * | 1989-06-15 | 1991-01-29 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| DE112013006817B4 (en) | 2013-03-13 | 2022-07-14 | Fujifilm Corporation | Image recording device, signal processing method and signal processing program |
| US11447357B2 (en) | 2018-06-13 | 2022-09-20 | Seiko Epson Corporation | Recording device |
-
1979
- 1979-06-15 JP JP7461579A patent/JPS56271A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57192255A (en) * | 1981-05-18 | 1982-11-26 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| JPH0137477B2 (en) * | 1981-05-18 | 1989-08-07 | Matsushita Electric Ind Co Ltd | |
| JPS59116366A (en) * | 1982-12-24 | 1984-07-05 | Hitachi Ltd | Chemical copper plating solution |
| JPS6337187B2 (en) * | 1982-12-24 | 1988-07-25 | Hitachi Ltd | |
| US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
| JPH02250978A (en) * | 1989-03-23 | 1990-10-08 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| JPH0320474A (en) * | 1989-06-15 | 1991-01-29 | Matsushita Electric Ind Co Ltd | Electroless copper plating solution |
| DE112013006817B4 (en) | 2013-03-13 | 2022-07-14 | Fujifilm Corporation | Image recording device, signal processing method and signal processing program |
| US11447357B2 (en) | 2018-06-13 | 2022-09-20 | Seiko Epson Corporation | Recording device |
| US11919735B2 (en) | 2018-06-13 | 2024-03-05 | Seiko Epson Corporation | Recording device |
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