JPS56123363A - Pretreating liquid for chemical plating - Google Patents

Pretreating liquid for chemical plating

Info

Publication number
JPS56123363A
JPS56123363A JP2617980A JP2617980A JPS56123363A JP S56123363 A JPS56123363 A JP S56123363A JP 2617980 A JP2617980 A JP 2617980A JP 2617980 A JP2617980 A JP 2617980A JP S56123363 A JPS56123363 A JP S56123363A
Authority
JP
Japan
Prior art keywords
hydroxide
reducing agent
complexing agent
dipped
salt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2617980A
Other languages
Japanese (ja)
Inventor
Akira Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2617980A priority Critical patent/JPS56123363A/en
Publication of JPS56123363A publication Critical patent/JPS56123363A/en
Pending legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To simply obtain a pretreating liquid for increasing the adhesion between a plated layer and the surface of a substrate by adding an alkali metal hydroxide, a metal complexing agent and a reducing agent to water.
CONSTITUTION: To water are added an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide, a metal complexing agent such as EDTA, its salt, tartaric acid or its salt and a reducing agent such as formalin or trioxane. The amount of the hydroxide added is adjusted to 0.5W20wt% to the total amount of the resulting treating fluid, that of the complexing agent to 1W20wt%, and that of the reducing agent to 0.1W10wt%. A substance to be plated is dipped in the fluid for a fixed time, washed, and dipped in a chemically plating bath.
COPYRIGHT: (C)1981,JPO&Japio
JP2617980A 1980-03-04 1980-03-04 Pretreating liquid for chemical plating Pending JPS56123363A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2617980A JPS56123363A (en) 1980-03-04 1980-03-04 Pretreating liquid for chemical plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2617980A JPS56123363A (en) 1980-03-04 1980-03-04 Pretreating liquid for chemical plating

Publications (1)

Publication Number Publication Date
JPS56123363A true JPS56123363A (en) 1981-09-28

Family

ID=12186294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2617980A Pending JPS56123363A (en) 1980-03-04 1980-03-04 Pretreating liquid for chemical plating

Country Status (1)

Country Link
JP (1) JPS56123363A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182684A (en) * 1982-04-20 1983-10-25 セイコーエプソン株式会社 Mounting of display body panel
WO2022230668A1 (en) * 2021-04-26 2022-11-03 東京エレクトロン株式会社 Substrate liquid treatment method, and recording medium

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182684A (en) * 1982-04-20 1983-10-25 セイコーエプソン株式会社 Mounting of display body panel
JPH0437967B2 (en) * 1982-04-20 1992-06-23 Seiko Epson Corp
WO2022230668A1 (en) * 2021-04-26 2022-11-03 東京エレクトロン株式会社 Substrate liquid treatment method, and recording medium

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