GB924049A - Electroless plating of copper - Google Patents

Electroless plating of copper

Info

Publication number
GB924049A
GB924049A GB25498/59A GB2549859A GB924049A GB 924049 A GB924049 A GB 924049A GB 25498/59 A GB25498/59 A GB 25498/59A GB 2549859 A GB2549859 A GB 2549859A GB 924049 A GB924049 A GB 924049A
Authority
GB
United Kingdom
Prior art keywords
copper
mols
salt
give
chloride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB25498/59A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of GB924049A publication Critical patent/GB924049A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

A copper-plating bath comprises 0.02-0.25 mols. of a water-soluble copper salt; 0.25-2.1 mols. of formaldehyde (or equivalent amount of paraformaldehyde or trioxan); 0.002-0.25 mols., but in amount less than that necessary to complex completely said copper salt, of a copper complexing salt selected from the group consisting of Rochelle salts, sodium gluconate and sodium citrate; alkali metal hydroxide from 5-7 times the number of mols. of the copper complexing salt and sufficient to give the bath a pH of at least 11.0; and water sufficient to give one litre of solution. Before plating, the substrate may be treated in solutions of stannous chloride, fluoborate or sulphate, and palladium chloride or auric chloride. Surfaces which may be copper-plated include plastics,
GB25498/59A 1958-12-08 1959-07-24 Electroless plating of copper Expired GB924049A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US778736A US3033703A (en) 1958-12-08 1958-12-08 Electroless plating of copper

Publications (1)

Publication Number Publication Date
GB924049A true GB924049A (en) 1963-04-18

Family

ID=25114268

Family Applications (1)

Application Number Title Priority Date Filing Date
GB25498/59A Expired GB924049A (en) 1958-12-08 1959-07-24 Electroless plating of copper

Country Status (4)

Country Link
US (1) US3033703A (en)
BE (1) BE585448A (en)
CH (1) CH413539A (en)
GB (1) GB924049A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012048412A1 (en) * 2010-10-13 2012-04-19 University Of Windsor Process for electroless deposition of metals using highly alkaline plating bath
US8900998B2 (en) 2012-11-21 2014-12-02 University Of Windsor Process for electroless deposition of gold and gold alloys on silicon

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164908A (en) * 1961-09-18 1965-01-12 United Aircraft Corp Measurement methods and gauges
US3222195A (en) * 1962-02-23 1965-12-07 Pearlstein Fred Stabilized electroless copper solution
US3340164A (en) * 1963-12-26 1967-09-05 Sperry Rand Corp Method of copper plating anodized aluminum
US3313642A (en) * 1964-01-17 1967-04-11 Thomas Bonar & Co Canada Ltd Process of modifying the surface properties of polyolefin film
US3340161A (en) * 1964-02-19 1967-09-05 Sperry Rand Corp Printed circuits and method of manufacture thereof
US3341350A (en) * 1964-09-30 1967-09-12 Philip D Anderson Method of preparing a uranium article for a protective coating
US3421922A (en) * 1965-03-08 1969-01-14 Bruce W Wilson Process for preconditioning a nonmetallic surface for chemically depositing a metal thereon
US3370974A (en) * 1965-10-20 1968-02-27 Ivan C. Hepfer Electroless plating on non-conductive materials
US3449176A (en) * 1966-01-14 1969-06-10 Minnesota Mining & Mfg Coating of solid substrates
US3725108A (en) * 1969-03-05 1973-04-03 Enthone Chemical reduction metal plated diallylphthalate polymer and preparation process
US3853589A (en) * 1970-11-09 1974-12-10 Ici Ltd Metal deposition process
USRE29039E (en) * 1969-11-26 1976-11-16 Imperial Chemical Industries Limited Metal deposition process
US4066804A (en) * 1969-11-26 1978-01-03 Imperial Chemical Industries Limited Metal deposition process
GB1340622A (en) * 1970-10-07 1973-12-12 Fuji Photo Film Co Ltd Method for production of photographic material
US4039714A (en) * 1971-05-28 1977-08-02 Dr. -Ing. Max Schloetter Pretreatment of plastic materials for metal plating
US3791848A (en) * 1972-05-19 1974-02-12 Western Electric Co A method of improving the adherence of a metal deposit to a polyimide surface
US4981725A (en) * 1972-07-11 1991-01-01 Amp-Akzo Corporation Process and composition for sensitizing articles for metallization
DE2425196A1 (en) * 1974-05-24 1975-12-11 Hoechst Ag METHOD OF MANUFACTURING ELECTRICALLY CONDUCTIVE FLEECE
USRE31694E (en) * 1976-02-19 1984-10-02 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
US4272570A (en) * 1980-04-11 1981-06-09 Sunbeam Corporation Provision of surface layers of copper or copper alloyed with zinc on die castings of zinc or zinc alloys
DE3307901A1 (en) * 1983-03-05 1984-09-06 Degussa Ag, 6000 Frankfurt METHOD FOR INTRODUCING BATH COMPONENTS IN GALVANIC AND CURRENTLY FREE BATHS
US4839023A (en) * 1987-09-16 1989-06-13 Exxon Research And Engineering Company Once-through coking with hydrotreating and fluid catalytic cracking
US5419926A (en) * 1993-11-22 1995-05-30 Lilly London, Inc. Ammonia-free deposition of copper by disproportionation
EP1787742B1 (en) * 2004-08-20 2014-10-15 Ishihara Sangyo Kaisha, Ltd. A process for producing copper microparticle

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2454610A (en) * 1946-08-13 1948-11-23 Narcus Harold Method for metalization on nonconductors
US2702253A (en) * 1950-11-01 1955-02-15 Gasaccumulator Svenska Ab Surface metallizing method
US2874072A (en) * 1956-09-17 1959-02-17 Gen Electric Autocatalytic copper plating process and solution
US2872359A (en) * 1956-12-03 1959-02-03 Sylvania Electric Prod Copper sensitizers
US2930106A (en) * 1957-03-14 1960-03-29 American Felt Co Gaskets

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012048412A1 (en) * 2010-10-13 2012-04-19 University Of Windsor Process for electroless deposition of metals using highly alkaline plating bath
CN103221579A (en) * 2010-10-13 2013-07-24 温莎大学 Process for electroless deposition of metals using highly alkaline plating bath
CN103221579B (en) * 2010-10-13 2015-04-29 温莎大学 Process for electroless deposition of metals using highly alkaline plating bath
US8900998B2 (en) 2012-11-21 2014-12-02 University Of Windsor Process for electroless deposition of gold and gold alloys on silicon

Also Published As

Publication number Publication date
CH413539A (en) 1966-05-15
US3033703A (en) 1962-05-08
BE585448A (en) 1960-06-08

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