SE8302798L - WATER-BATHING BATH FOR STROMLESS DEPOSIT OF GOLD AND PUT ON STROMLOUS PATH TO DEPEND GOLD WITH USE OF THE BATH - Google Patents

WATER-BATHING BATH FOR STROMLESS DEPOSIT OF GOLD AND PUT ON STROMLOUS PATH TO DEPEND GOLD WITH USE OF THE BATH

Info

Publication number
SE8302798L
SE8302798L SE8302798A SE8302798A SE8302798L SE 8302798 L SE8302798 L SE 8302798L SE 8302798 A SE8302798 A SE 8302798A SE 8302798 A SE8302798 A SE 8302798A SE 8302798 L SE8302798 L SE 8302798L
Authority
SE
Sweden
Prior art keywords
gold
alkali metal
bath
electroless
water
Prior art date
Application number
SE8302798A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE8302798D0 (en
Inventor
M F El-Shazly
A Halecky
K D Baker
Original Assignee
Occidental Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occidental Chem Co filed Critical Occidental Chem Co
Publication of SE8302798D0 publication Critical patent/SE8302798D0/en
Publication of SE8302798L publication Critical patent/SE8302798L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Abstract

An electroless or autocatalytic gold plating bath includes, as the gold ingredient, an admixture of (a) a water soluble trivalent gold component selected from an alkali metal auricyanide, an alkali metal aurihydroxide, and an alkali metal aurate; and (b) a water-soluble monovalent gold component such as an alkali metal aurocyanide. The bath contains an amino borane, alkali metal borohydride, alkali metal cyanoborohydride, hydrazine, or hyposulphite as the reducing agent; an alkaline agent such as an alkali metal hydroxide; and an alkaline buffering agent. The method of using such an electroless or autocatalytic plating bath for depositing gold on metallic substrates such as gold, copper, copper alloys, electroless copper, electroless nickel, nickel, nickel alloys, etc. and on a nonmetallic substrate is also described.
SE8302798A 1982-06-07 1983-05-18 WATER-BATHING BATH FOR STROMLESS DEPOSIT OF GOLD AND PUT ON STROMLOUS PATH TO DEPEND GOLD WITH USE OF THE BATH SE8302798L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38561782A 1982-06-07 1982-06-07

Publications (2)

Publication Number Publication Date
SE8302798D0 SE8302798D0 (en) 1983-05-18
SE8302798L true SE8302798L (en) 1983-12-08

Family

ID=23522165

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8302798A SE8302798L (en) 1982-06-07 1983-05-18 WATER-BATHING BATH FOR STROMLESS DEPOSIT OF GOLD AND PUT ON STROMLOUS PATH TO DEPEND GOLD WITH USE OF THE BATH

Country Status (14)

Country Link
JP (1) JPS591668A (en)
AT (1) AT380902B (en)
AU (1) AU541923B2 (en)
BE (1) BE896977A (en)
CA (1) CA1188458A (en)
CH (1) CH655132A5 (en)
DE (1) DE3320308C2 (en)
DK (1) DK231783A (en)
ES (1) ES8407520A1 (en)
FR (1) FR2528073B1 (en)
GB (1) GB2121444B (en)
IT (1) IT1171818B (en)
NL (1) NL8302029A (en)
SE (1) SE8302798L (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050719A (en) * 1976-08-24 1977-09-27 Cunningham Walter F Color coded indexing system
US4703669A (en) * 1984-08-27 1987-11-03 Toyota Jidosha Kabushiki Kaisha Support structure of steering column tube
JPS6299477A (en) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd Electroless gold plating solution
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
DE3640028C1 (en) * 1986-11-24 1987-10-01 Heraeus Gmbh W C Acid bath for the electroless deposition of gold layers
JPS6452082A (en) * 1987-06-22 1989-02-28 Gen Electric Electroless gold plating composition and method
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
US4979988A (en) * 1989-12-01 1990-12-25 General Electric Company Autocatalytic electroless gold plating composition
JP2538461B2 (en) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 Electroless gold plating method
DE10101375A1 (en) * 2001-01-13 2002-07-18 Forschungszentrum Juelich Gmbh Point contacts for semiconductors and their manufacture
JP5526458B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
JP5526459B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
JP5526440B2 (en) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 Printed wiring board formed using reduced deposition type electroless gold plating solution for palladium film

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151637A (en) * 1976-04-29 1977-12-16 Trw Inc Aqueous solution for gold plating and method of applying gold film onto nickel surface at room temperature
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating

Also Published As

Publication number Publication date
ES523032A0 (en) 1984-09-16
SE8302798D0 (en) 1983-05-18
DK231783D0 (en) 1983-05-24
GB2121444A (en) 1983-12-21
GB8315556D0 (en) 1983-07-13
AU1486083A (en) 1983-12-15
IT1171818B (en) 1987-06-10
AT380902B (en) 1986-07-25
ES8407520A1 (en) 1984-09-16
GB2121444B (en) 1986-03-12
FR2528073A1 (en) 1983-12-09
CH655132A5 (en) 1986-03-27
NL8302029A (en) 1984-01-02
DK231783A (en) 1983-12-08
JPS591668A (en) 1984-01-07
FR2528073B1 (en) 1986-02-14
BE896977A (en) 1983-12-06
ATA193183A (en) 1985-12-15
DE3320308A1 (en) 1983-12-08
IT8348420A0 (en) 1983-06-03
AU541923B2 (en) 1985-01-31
CA1188458A (en) 1985-06-11
DE3320308C2 (en) 1985-05-15

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Effective date: 19880519