GB1058915A - Autocatalytic metal plating - Google Patents

Autocatalytic metal plating

Info

Publication number
GB1058915A
GB1058915A GB2627365A GB2627365A GB1058915A GB 1058915 A GB1058915 A GB 1058915A GB 2627365 A GB2627365 A GB 2627365A GB 2627365 A GB2627365 A GB 2627365A GB 1058915 A GB1058915 A GB 1058915A
Authority
GB
United Kingdom
Prior art keywords
moles
litre
water soluble
metal plating
sodium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2627365A
Inventor
John F Mccormack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of GB1058915A publication Critical patent/GB1058915A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

A group 1B metal, e.g. copper is electrolessly deposited from a solution pH 10 to 14 comprising (moles 1 litre) 0.002 to 0.6 water soluble metal salt, 0.002 to 2.5 alkali metal borohydride or amine borane, and a complexing agent in an amount between 0.7 and 10 times the moles of the water soluble salt. In an example a solution comprises copper sulphate 0.05 moles/1., E.D.T.A.0.12 moles 1 litre, sodium cyanide 0.008 moles/1., and sodium borohydride 80 mg/1. The substrate may be Ni, Co, Fe or steel, Pd, Pt, Cu or brass, Mn, Cr, Mo, W, Ti, Sn, Ag paper, glass, ceramic or plastics. A surfactant, e.g. organic phosphate esters or oxyethylated sodium salts may be present up to 5 g.11.
GB2627365A 1964-06-24 1965-06-22 Autocatalytic metal plating Expired GB1058915A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37750964A 1964-06-24 1964-06-24

Publications (1)

Publication Number Publication Date
GB1058915A true GB1058915A (en) 1967-02-15

Family

ID=23489393

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2627365A Expired GB1058915A (en) 1964-06-24 1965-06-22 Autocatalytic metal plating

Country Status (4)

Country Link
JP (1) JPS5020012B1 (en)
DK (1) DK130725B (en)
GB (1) GB1058915A (en)
SE (1) SE316667B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2086188A1 (en) * 1970-04-20 1971-12-31 Kollmorgen Corp Electroless silver plating soln - giving high density coatings
US4838937A (en) * 1987-03-09 1989-06-13 Schering Aktiengesellschaft Stabilized alkaline gold bath for the electro-less deposition of gold
JP2013091833A (en) * 2011-10-27 2013-05-16 C Uyemura & Co Ltd Reducing electroless silver plating solution and reducing electroless silver plating method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3062666A (en) * 1958-11-26 1962-11-06 Du Pont Bath compositions for the chemical reductive plating of nickel-boron and cobalt-boron alloys

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2086188A1 (en) * 1970-04-20 1971-12-31 Kollmorgen Corp Electroless silver plating soln - giving high density coatings
US4838937A (en) * 1987-03-09 1989-06-13 Schering Aktiengesellschaft Stabilized alkaline gold bath for the electro-less deposition of gold
JP2013091833A (en) * 2011-10-27 2013-05-16 C Uyemura & Co Ltd Reducing electroless silver plating solution and reducing electroless silver plating method
EP2772566A4 (en) * 2011-10-27 2015-07-01 Uyemura C & Co Ltd Reducing electroless silver plating solution and reducing electroless silver plating method
TWI572742B (en) * 2011-10-27 2017-03-01 C Uyemura & Co Ltd Reduction Electroless Silver Plating Solution and Reduced Electroless Silver Plating Method

Also Published As

Publication number Publication date
DK130725B (en) 1975-04-01
JPS5020012B1 (en) 1975-07-11
DK130725C (en) 1975-09-01
SE316667B (en) 1969-10-27

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