GB1294027A - Process for acid copper plating of zinc - Google Patents

Process for acid copper plating of zinc

Info

Publication number
GB1294027A
GB1294027A GB23269/70A GB2326970A GB1294027A GB 1294027 A GB1294027 A GB 1294027A GB 23269/70 A GB23269/70 A GB 23269/70A GB 2326970 A GB2326970 A GB 2326970A GB 1294027 A GB1294027 A GB 1294027A
Authority
GB
United Kingdom
Prior art keywords
electro
alkali metal
immersion
plating bath
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB23269/70A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Udylite Corp
Original Assignee
Udylite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Corp filed Critical Udylite Corp
Publication of GB1294027A publication Critical patent/GB1294027A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1294027 Electro-plating copper on zinc; immersion copper or nickel plating UDYLITE CORP 13 May 1970 [19 June 1969] 23269/70 Headings C7B and C7F A smooth adherent Cu electro-plate is formed on complex Zn castings having recessed areas by applying an electrolytic Cu, Cu alloy e.g. brass or Ni strike to the Zn surface; treating the strike plated Zn surface with an immersion Cu plating bath to form a displacement Cu deposit (e. g. 5-35 millionths of an inch thick) on the surface, optionally treating with an immersion Ni plating bath to form a further displacement Ni deposit; and then electro-plating Cu (e. g. to a thickness 0À002-0À0015 inch) from an aqueous acidic Cu electro-plating bath, e.g. containing copper sulphate fluoborate, nitrate, sulphamate, alkyl sulphonates or disulphonates, with one or more brightening and levelling additives. The Cu electro-plate may be further electro-plated with Ni and/or Cr. The Zn surface may be prior cleaned with alkaline, acidic or organic solvent by scrubbing, spraying, vapour degreasing or steam or ultrasonic cleaning. The Cu strike plating bath may contain copper and alkali metal cyanides, an alkali metal hydroxide and Rochelle salt. The immersion Cu plating bath may comprise 8-30 g/l of Cu supplied by a water soluble Cu salt, e.g. sulphate, chloride, acetate or carbonate; 30-350 g/l of a primary complexing agent for cupric ions, such as an alkali metal (e. g. Na) gluconate, citric acid, a tartrate, ethylene diamine, diethylene triamine, diethanol glycine, E.D.T.A. or lactonitride; 5-80 g/l of an alkali metal (e.g. Na) hydroxide or carbonate; 5-70 g/l of an alkali metal (e.g. Na) or alkaline earth metal (e.g. Mg) chloride as accelerator and/or 0À2-5 g/l of an alkali metal (e.g. Na) cyanide or NH 4 OH as a secondary complexing agent for cuprous ions. The bath may be air agitated. The immersion Ni plating bath may comprise 50-500 g/l NiCl 2 , 50-300 g/l NiSO 4 , 20-100 g/l NaCl and 10-45 g/l H 3 BO 3 .
GB23269/70A 1969-06-19 1970-05-13 Process for acid copper plating of zinc Expired GB1294027A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83490969A 1969-06-19 1969-06-19

Publications (1)

Publication Number Publication Date
GB1294027A true GB1294027A (en) 1972-10-25

Family

ID=25268111

Family Applications (1)

Application Number Title Priority Date Filing Date
GB23269/70A Expired GB1294027A (en) 1969-06-19 1970-05-13 Process for acid copper plating of zinc

Country Status (8)

Country Link
US (1) US3664933A (en)
JP (1) JPS4843787B1 (en)
BE (1) BE751427A (en)
CA (1) CA924670A (en)
DE (1) DE2026698A1 (en)
FR (1) FR2046885B1 (en)
GB (1) GB1294027A (en)
NL (1) NL7008864A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4272570A (en) * 1980-04-11 1981-06-09 Sunbeam Corporation Provision of surface layers of copper or copper alloyed with zinc on die castings of zinc or zinc alloys
US4454168A (en) * 1982-09-29 1984-06-12 E. I. Du Pont De Nemours And Company Printed circuits prepared from metallized photoadhesive layers
US5558759A (en) * 1994-07-26 1996-09-24 Sargent Manufacturing Company Metal finishing process
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
WO2000061498A2 (en) 1999-04-13 2000-10-19 Semitool, Inc. System for electrochemically processing a workpiece
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
JPH10330950A (en) * 1997-06-02 1998-12-15 Nippon Parkerizing Co Ltd Modified double replacement-type plated metal material and its production
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6197181B1 (en) * 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7102763B2 (en) * 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6541188B2 (en) 2001-05-11 2003-04-01 Kodak Polychrome Graphics Llc Developer for alkaline-developable lithographic printing plates
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
FR2839982B1 (en) * 2002-05-22 2005-04-15 Centre Nat Rech Scient PRECURSOR COMPOSITION FOR COPPER DEPOSITION ON A SUPPORT
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
KR20060128739A (en) * 2005-06-10 2006-12-14 엔쏜 인코포레이티드 Method for direct metallization of non-conducting substrates
US20080264774A1 (en) * 2007-04-25 2008-10-30 Semitool, Inc. Method for electrochemically depositing metal onto a microelectronic workpiece
DE102009041250B4 (en) * 2009-09-11 2011-09-01 Umicore Galvanotechnik Gmbh Process for the electrolytic copper plating of zinc die casting with reduced tendency to blister
BR112013003430A2 (en) 2010-08-17 2016-06-21 Chemetall Gmbh "process for covering metallic substrates without electric current."
US11661666B2 (en) 2019-10-10 2023-05-30 The Boeing Company Electrodeposited zinc and iron coatings for corrosion resistance
US11618951B2 (en) 2020-05-27 2023-04-04 Global Circuit Innovations Incorporated Chemical evaporation control system
JP7118295B1 (en) 2020-12-28 2022-08-15 三菱電機株式会社 Image processing device, program and image processing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US43557A (en) * 1864-07-12 Improved mode of coating and bronzing metals
US2128550A (en) * 1933-02-06 1938-08-30 Gen Motors Corp Anticorrosion process for zinc base castings
DE962489C (en) * 1954-02-10 1957-04-25 Dehydag Gmbh Saver pickling agent to protect metals when treated with acidic agents
GB792847A (en) * 1955-08-08 1958-04-02 Nat Alloys Ltd Improvements in or relating to immersion brass finishing of zinc-alloy die-castings
FR1288498A (en) * 1961-05-03 1962-03-24 Photocircuits Corp Non-galvanic copper plating process, and baths used for the implementation of this process
US3282659A (en) * 1965-08-24 1966-11-01 Westinghouse Electric Corp Plated zinc base articles and method of making

Also Published As

Publication number Publication date
FR2046885B1 (en) 1974-05-24
DE2026698A1 (en) 1971-01-07
JPS4843787B1 (en) 1973-12-20
BE751427A (en) 1970-12-03
NL7008864A (en) 1970-12-22
US3664933A (en) 1972-05-23
CA924670A (en) 1973-04-17
FR2046885A1 (en) 1971-03-12

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees