JPS4843787B1 - - Google Patents
Info
- Publication number
- JPS4843787B1 JPS4843787B1 JP45052484A JP5248470A JPS4843787B1 JP S4843787 B1 JPS4843787 B1 JP S4843787B1 JP 45052484 A JP45052484 A JP 45052484A JP 5248470 A JP5248470 A JP 5248470A JP S4843787 B1 JPS4843787 B1 JP S4843787B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US83490969A | 1969-06-19 | 1969-06-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4843787B1 true JPS4843787B1 (ja) | 1973-12-20 |
Family
ID=25268111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP45052484A Pending JPS4843787B1 (ja) | 1969-06-19 | 1970-06-18 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3664933A (ja) |
JP (1) | JPS4843787B1 (ja) |
BE (1) | BE751427A (ja) |
CA (1) | CA924670A (ja) |
DE (1) | DE2026698A1 (ja) |
FR (1) | FR2046885B1 (ja) |
GB (1) | GB1294027A (ja) |
NL (1) | NL7008864A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112020007889T5 (de) | 2020-12-28 | 2023-11-02 | Mitsubishi Electric Corporation | Bildverarbeitungseinrichtung, programm und bildverarbeitungsverfahren |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4272570A (en) * | 1980-04-11 | 1981-06-09 | Sunbeam Corporation | Provision of surface layers of copper or copper alloyed with zinc on die castings of zinc or zinc alloys |
US4454168A (en) * | 1982-09-29 | 1984-06-12 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from metallized photoadhesive layers |
US5558759A (en) * | 1994-07-26 | 1996-09-24 | Sargent Manufacturing Company | Metal finishing process |
US6921467B2 (en) * | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
WO2000061498A2 (en) | 1999-04-13 | 2000-10-19 | Semitool, Inc. | System for electrochemically processing a workpiece |
US6752584B2 (en) * | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
JPH10330950A (ja) * | 1997-06-02 | 1998-12-15 | Nippon Parkerizing Co Ltd | 改良充填置換析出型めっき金属材料及びその製造方法 |
US7244677B2 (en) * | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
US6632292B1 (en) * | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
TW593731B (en) * | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
US6197181B1 (en) * | 1998-03-20 | 2001-03-06 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
US6497801B1 (en) | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7189318B2 (en) * | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7585398B2 (en) | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US6916412B2 (en) * | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
US7102763B2 (en) * | 2000-07-08 | 2006-09-05 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
US6541188B2 (en) | 2001-05-11 | 2003-04-01 | Kodak Polychrome Graphics Llc | Developer for alkaline-developable lithographic printing plates |
AU2002343330A1 (en) | 2001-08-31 | 2003-03-10 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US6893505B2 (en) * | 2002-05-08 | 2005-05-17 | Semitool, Inc. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
FR2839982B1 (fr) * | 2002-05-22 | 2005-04-15 | Centre Nat Rech Scient | Composition de precurseur pour le depot de cuivre sur un support |
US7025866B2 (en) * | 2002-08-21 | 2006-04-11 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US20050230262A1 (en) * | 2004-04-20 | 2005-10-20 | Semitool, Inc. | Electrochemical methods for the formation of protective features on metallized features |
KR20060128739A (ko) * | 2005-06-10 | 2006-12-14 | 엔쏜 인코포레이티드 | 비-전도성 기판의 직접적인 금속화 방법 |
US20080264774A1 (en) * | 2007-04-25 | 2008-10-30 | Semitool, Inc. | Method for electrochemically depositing metal onto a microelectronic workpiece |
DE102009041250B4 (de) * | 2009-09-11 | 2011-09-01 | Umicore Galvanotechnik Gmbh | Verfahren zur elektrolytischen Verkupferung von Zinkdruckguss mit verringerter Neigung zur Blasenbildung |
BR112013003430A2 (pt) | 2010-08-17 | 2016-06-21 | Chemetall Gmbh | "processo para o cobreamento de substratos metálicos sem corrente elétrica." |
US11661666B2 (en) | 2019-10-10 | 2023-05-30 | The Boeing Company | Electrodeposited zinc and iron coatings for corrosion resistance |
US11618951B2 (en) | 2020-05-27 | 2023-04-04 | Global Circuit Innovations Incorporated | Chemical evaporation control system |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US43557A (en) * | 1864-07-12 | Improved mode of coating and bronzing metals | ||
US2128550A (en) * | 1933-02-06 | 1938-08-30 | Gen Motors Corp | Anticorrosion process for zinc base castings |
DE962489C (de) * | 1954-02-10 | 1957-04-25 | Dehydag Gmbh | Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln |
GB792847A (en) * | 1955-08-08 | 1958-04-02 | Nat Alloys Ltd | Improvements in or relating to immersion brass finishing of zinc-alloy die-castings |
FR1288498A (fr) * | 1961-05-03 | 1962-03-24 | Photocircuits Corp | Procédé de cuivrage non galvanique, et bains utilisés pour la mise en oeuvre de ce procédé |
US3282659A (en) * | 1965-08-24 | 1966-11-01 | Westinghouse Electric Corp | Plated zinc base articles and method of making |
-
1969
- 1969-05-19 US US834909A patent/US3664933A/en not_active Expired - Lifetime
-
1970
- 1970-05-06 CA CA082040A patent/CA924670A/en not_active Expired
- 1970-05-13 GB GB23269/70A patent/GB1294027A/en not_active Expired
- 1970-06-01 DE DE19702026698 patent/DE2026698A1/de active Pending
- 1970-06-02 FR FR7020172A patent/FR2046885B1/fr not_active Expired
- 1970-06-03 BE BE751427D patent/BE751427A/xx unknown
- 1970-06-17 NL NL7008864A patent/NL7008864A/xx unknown
- 1970-06-18 JP JP45052484A patent/JPS4843787B1/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112020007889T5 (de) | 2020-12-28 | 2023-11-02 | Mitsubishi Electric Corporation | Bildverarbeitungseinrichtung, programm und bildverarbeitungsverfahren |
Also Published As
Publication number | Publication date |
---|---|
FR2046885B1 (ja) | 1974-05-24 |
DE2026698A1 (de) | 1971-01-07 |
BE751427A (fr) | 1970-12-03 |
GB1294027A (en) | 1972-10-25 |
NL7008864A (ja) | 1970-12-22 |
US3664933A (en) | 1972-05-23 |
CA924670A (en) | 1973-04-17 |
FR2046885A1 (ja) | 1971-03-12 |