BE751427A - Procede de revetement de zinc par du cuivre en milieu acide et nouveauxproduits ainsi obtenus - Google Patents

Procede de revetement de zinc par du cuivre en milieu acide et nouveauxproduits ainsi obtenus

Info

Publication number
BE751427A
BE751427A BE751427DA BE751427A BE 751427 A BE751427 A BE 751427A BE 751427D A BE751427D A BE 751427DA BE 751427 A BE751427 A BE 751427A
Authority
BE
Belgium
Prior art keywords
copper
coating process
new products
zinc coating
acid medium
Prior art date
Application number
Other languages
English (en)
French (fr)
Inventor
R J Clauss
Original Assignee
Udylite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Corp filed Critical Udylite Corp
Publication of BE751427A publication Critical patent/BE751427A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
BE751427D 1969-06-19 1970-06-03 Procede de revetement de zinc par du cuivre en milieu acide et nouveauxproduits ainsi obtenus BE751427A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83490969A 1969-06-19 1969-06-19

Publications (1)

Publication Number Publication Date
BE751427A true BE751427A (fr) 1970-12-03

Family

ID=25268111

Family Applications (1)

Application Number Title Priority Date Filing Date
BE751427D BE751427A (fr) 1969-06-19 1970-06-03 Procede de revetement de zinc par du cuivre en milieu acide et nouveauxproduits ainsi obtenus

Country Status (8)

Country Link
US (1) US3664933A (ja)
JP (1) JPS4843787B1 (ja)
BE (1) BE751427A (ja)
CA (1) CA924670A (ja)
DE (1) DE2026698A1 (ja)
FR (1) FR2046885B1 (ja)
GB (1) GB1294027A (ja)
NL (1) NL7008864A (ja)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4272570A (en) * 1980-04-11 1981-06-09 Sunbeam Corporation Provision of surface layers of copper or copper alloyed with zinc on die castings of zinc or zinc alloys
US4454168A (en) * 1982-09-29 1984-06-12 E. I. Du Pont De Nemours And Company Printed circuits prepared from metallized photoadhesive layers
US5558759A (en) * 1994-07-26 1996-09-24 Sargent Manufacturing Company Metal finishing process
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
WO2000061498A2 (en) 1999-04-13 2000-10-19 Semitool, Inc. System for electrochemically processing a workpiece
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
JPH10330950A (ja) * 1997-06-02 1998-12-15 Nippon Parkerizing Co Ltd 改良充填置換析出型めっき金属材料及びその製造方法
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6197181B1 (en) * 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7102763B2 (en) * 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6541188B2 (en) 2001-05-11 2003-04-01 Kodak Polychrome Graphics Llc Developer for alkaline-developable lithographic printing plates
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
FR2839982B1 (fr) * 2002-05-22 2005-04-15 Centre Nat Rech Scient Composition de precurseur pour le depot de cuivre sur un support
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
KR20060128739A (ko) * 2005-06-10 2006-12-14 엔쏜 인코포레이티드 비-전도성 기판의 직접적인 금속화 방법
US20080264774A1 (en) * 2007-04-25 2008-10-30 Semitool, Inc. Method for electrochemically depositing metal onto a microelectronic workpiece
DE102009041250B4 (de) * 2009-09-11 2011-09-01 Umicore Galvanotechnik Gmbh Verfahren zur elektrolytischen Verkupferung von Zinkdruckguss mit verringerter Neigung zur Blasenbildung
BR112013003430A2 (pt) 2010-08-17 2016-06-21 Chemetall Gmbh "processo para o cobreamento de substratos metálicos sem corrente elétrica."
US11661666B2 (en) 2019-10-10 2023-05-30 The Boeing Company Electrodeposited zinc and iron coatings for corrosion resistance
US11618951B2 (en) 2020-05-27 2023-04-04 Global Circuit Innovations Incorporated Chemical evaporation control system
JP7118295B1 (ja) 2020-12-28 2022-08-15 三菱電機株式会社 画像処理装置、プログラム及び画像処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US43557A (en) * 1864-07-12 Improved mode of coating and bronzing metals
US2128550A (en) * 1933-02-06 1938-08-30 Gen Motors Corp Anticorrosion process for zinc base castings
DE962489C (de) * 1954-02-10 1957-04-25 Dehydag Gmbh Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln
GB792847A (en) * 1955-08-08 1958-04-02 Nat Alloys Ltd Improvements in or relating to immersion brass finishing of zinc-alloy die-castings
FR1288498A (fr) * 1961-05-03 1962-03-24 Photocircuits Corp Procédé de cuivrage non galvanique, et bains utilisés pour la mise en oeuvre de ce procédé
US3282659A (en) * 1965-08-24 1966-11-01 Westinghouse Electric Corp Plated zinc base articles and method of making

Also Published As

Publication number Publication date
FR2046885B1 (ja) 1974-05-24
DE2026698A1 (de) 1971-01-07
JPS4843787B1 (ja) 1973-12-20
GB1294027A (en) 1972-10-25
NL7008864A (ja) 1970-12-22
US3664933A (en) 1972-05-23
CA924670A (en) 1973-04-17
FR2046885A1 (ja) 1971-03-12

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