EP2772566A4 - Reducing electroless silver plating solution and reducing electroless silver plating method - Google Patents

Reducing electroless silver plating solution and reducing electroless silver plating method

Info

Publication number
EP2772566A4
EP2772566A4 EP12843616.9A EP12843616A EP2772566A4 EP 2772566 A4 EP2772566 A4 EP 2772566A4 EP 12843616 A EP12843616 A EP 12843616A EP 2772566 A4 EP2772566 A4 EP 2772566A4
Authority
EP
European Patent Office
Prior art keywords
silver plating
electroless silver
reducing electroless
reducing
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12843616.9A
Other languages
German (de)
French (fr)
Other versions
EP2772566B1 (en
EP2772566A1 (en
Inventor
Daisuke Hashimoto
Kota Kitajima
Akira Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C Uyemura and Co Ltd
Original Assignee
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C Uyemura and Co Ltd filed Critical C Uyemura and Co Ltd
Publication of EP2772566A1 publication Critical patent/EP2772566A1/en
Publication of EP2772566A4 publication Critical patent/EP2772566A4/en
Application granted granted Critical
Publication of EP2772566B1 publication Critical patent/EP2772566B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
EP12843616.9A 2011-10-27 2012-10-09 Plating bath for the electroless deposition of silver and corresponding method Active EP2772566B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011235559A JP5840454B2 (en) 2011-10-27 2011-10-27 Reduced electroless silver plating solution and reduced electroless silver plating method
PCT/JP2012/076141 WO2013061773A1 (en) 2011-10-27 2012-10-09 Reducing electroless silver plating solution and reducing electroless silver plating method

Publications (3)

Publication Number Publication Date
EP2772566A1 EP2772566A1 (en) 2014-09-03
EP2772566A4 true EP2772566A4 (en) 2015-07-01
EP2772566B1 EP2772566B1 (en) 2019-03-06

Family

ID=48167607

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12843616.9A Active EP2772566B1 (en) 2011-10-27 2012-10-09 Plating bath for the electroless deposition of silver and corresponding method

Country Status (5)

Country Link
US (1) US20140242288A1 (en)
EP (1) EP2772566B1 (en)
JP (1) JP5840454B2 (en)
TW (1) TWI572742B (en)
WO (1) WO2013061773A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH710579A1 (en) * 2014-12-23 2016-06-30 Metalor Tech Int Sa A method of electroless plating of a precious metal.
US20170051411A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Electroless Silver Plating Bath and Method of Using the Same
JP6650136B2 (en) * 2015-09-02 2020-02-19 学校法人神奈川大学 Method for manufacturing flexible thermoelectric conversion member
JP6645881B2 (en) * 2016-03-18 2020-02-14 上村工業株式会社 Copper plating solution and copper plating method
KR102077426B1 (en) * 2019-07-01 2020-04-08 최철수 Manufacturing method for thin conductive nonwoven fabric and thin conductive nonwoven fabric manufactured using the same
CN112159975A (en) * 2020-10-12 2021-01-01 福建新大陆环保科技有限公司 Method for preparing high-voltage electrode by plating metal silver in slender glass tube
CN114808052B (en) * 2022-04-02 2024-03-15 中国机械总院集团武汉材料保护研究所有限公司 Cyanide-free conversion method for cyanide silver plating solution
CN114959666A (en) * 2022-05-12 2022-08-30 李正新 Chemical silver plating solution and novel chemical silver plating method
CN114932218B (en) * 2022-05-30 2023-08-04 暨南大学 Method for reducing evaporation of 3D printing zinc powder to form zinc-silver alloy through chemical silver plating

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1058915A (en) * 1964-06-24 1967-02-15 Photocircuits Corp Autocatalytic metal plating
DE3419755A1 (en) * 1984-05-26 1985-11-28 Bayer Ag, 5090 Leverkusen Chemical silvering bath

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113658A (en) * 1967-04-14 1978-09-12 Stamicarbon, N.V. Process for homogeneous deposition precipitation of metal compounds on support or carrier materials
CA945305A (en) * 1970-04-20 1974-04-16 Frederick W. Schneble (Jr.) Electroless silver plating
JPS52111835A (en) * 1976-03-18 1977-09-19 Tokyo Shibaura Electric Co Method of stabilizing nonnelectrolytic plating solution
US4746541A (en) * 1985-12-16 1988-05-24 Hoechst Celanese Corporation Electrically conductive thermally stabilized acrylic fibrous material and process for preparing same
FI95816C (en) * 1989-05-04 1996-03-25 Ad Tech Holdings Ltd Antimicrobial article and method of making the same
DE4210513A1 (en) * 1992-03-31 1993-10-07 Henkel Kgaa Nickel-free phosphating process
JP3074415B2 (en) 1992-04-02 2000-08-07 昭和電工株式会社 Production method of silver-plated copper powder
JP3937373B2 (en) 1998-06-25 2007-06-27 奥野製薬工業株式会社 Self-catalyzed electroless silver plating solution
JP2000309875A (en) 1999-04-23 2000-11-07 Okuno Chem Ind Co Ltd Substitution type electroless silver plating solution
JP2002180259A (en) 2000-12-12 2002-06-26 Shipley Co Llc Metal deposition acceleration compound in plating liquid and plating liquid containing the same
JP4171604B2 (en) 2002-03-18 2008-10-22 株式会社大和化成研究所 Electroless plating bath and metal coating obtained using the plating bath
JP2008085305A (en) * 2006-08-31 2008-04-10 Bridgestone Corp Method of manufacturing light transmissive electromagnetic wave shielding material, light transmissive electromagnetic wave shielding material, and filter for display

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1058915A (en) * 1964-06-24 1967-02-15 Photocircuits Corp Autocatalytic metal plating
DE3419755A1 (en) * 1984-05-26 1985-11-28 Bayer Ag, 5090 Leverkusen Chemical silvering bath

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013061773A1 *

Also Published As

Publication number Publication date
WO2013061773A1 (en) 2013-05-02
EP2772566B1 (en) 2019-03-06
TW201331413A (en) 2013-08-01
US20140242288A1 (en) 2014-08-28
JP2013091833A (en) 2013-05-16
TWI572742B (en) 2017-03-01
EP2772566A1 (en) 2014-09-03
JP5840454B2 (en) 2016-01-06

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