EP2896720A4 - Electroless plating base agent - Google Patents

Electroless plating base agent

Info

Publication number
EP2896720A4
EP2896720A4 EP13837102.6A EP13837102A EP2896720A4 EP 2896720 A4 EP2896720 A4 EP 2896720A4 EP 13837102 A EP13837102 A EP 13837102A EP 2896720 A4 EP2896720 A4 EP 2896720A4
Authority
EP
European Patent Office
Prior art keywords
electroless plating
plating base
base agent
agent
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13837102.6A
Other languages
German (de)
French (fr)
Other versions
EP2896720A1 (en
EP2896720B1 (en
Inventor
Daigo Saito
Keisuke Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of EP2896720A1 publication Critical patent/EP2896720A1/en
Publication of EP2896720A4 publication Critical patent/EP2896720A4/en
Application granted granted Critical
Publication of EP2896720B1 publication Critical patent/EP2896720B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Powder Metallurgy (AREA)
EP13837102.6A 2012-09-13 2013-09-12 Electroless plating base agent Active EP2896720B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012201584 2012-09-13
JP2013003605 2013-01-11
JP2013053574 2013-03-15
PCT/JP2013/074714 WO2014042215A1 (en) 2012-09-13 2013-09-12 Electroless plating base agent

Publications (3)

Publication Number Publication Date
EP2896720A1 EP2896720A1 (en) 2015-07-22
EP2896720A4 true EP2896720A4 (en) 2016-06-22
EP2896720B1 EP2896720B1 (en) 2017-11-22

Family

ID=50278324

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13837102.6A Active EP2896720B1 (en) 2012-09-13 2013-09-12 Electroless plating base agent

Country Status (7)

Country Link
US (1) US20160010215A1 (en)
EP (1) EP2896720B1 (en)
JP (1) JP6354950B2 (en)
KR (2) KR102157192B1 (en)
CN (1) CN104641017B (en)
TW (1) TWI627194B (en)
WO (1) WO2014042215A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6352059B2 (en) * 2014-06-05 2018-07-04 奥野製薬工業株式会社 Composition for forming electroless plating underlayer
CN107532301A (en) * 2014-07-30 2018-01-02 日产化学工业株式会社 Electroless plating substrate agent comprising dissaving polymer, metal particle and resin bottom coating agent
JP6687907B2 (en) * 2014-09-05 2020-04-28 日産化学株式会社 Photosensitive electroless plating base material
WO2016035896A1 (en) * 2014-09-05 2016-03-10 日産化学工業株式会社 Photocurable electroless plating primer
CH710579A1 (en) * 2014-12-23 2016-06-30 Metalor Tech Int Sa A method of electroless plating of a precious metal.
JP6471392B2 (en) * 2015-02-12 2019-02-20 上村工業株式会社 Pretreatment agent for electroless plating, pretreatment method for printed wiring board using said pretreatment agent for electroless plating, and method for producing the same
KR102558400B1 (en) * 2015-03-31 2023-07-24 닛산 가가쿠 가부시키가이샤 Photosensitive electroless plating liner
KR20180113542A (en) * 2016-02-19 2018-10-16 닛산 가가쿠 가부시키가이샤 An electroless plating plating solution containing a high branching polymer and metal fine particles
JP6892635B2 (en) * 2016-03-09 2021-06-23 日産化学株式会社 Photosensitive electroless plating base material
JP6882721B2 (en) * 2016-03-09 2021-06-02 日産化学株式会社 Electroless plating base material containing highly branched polymer and metal fine particles
JP6607811B2 (en) * 2016-03-11 2019-11-20 マクセルホールディングス株式会社 Plating parts manufacturing method, plating parts, catalytic activity interference agent and electroless plating composite material
WO2019022151A1 (en) * 2017-07-25 2019-01-31 日産化学株式会社 Method for producing metal fine particle composite body
KR20210096142A (en) * 2018-12-21 2021-08-04 닛산 가가쿠 가부시키가이샤 Electroless plating agent containing polymer and metal fine particles
KR20210133960A (en) * 2019-03-05 2021-11-08 맥셀 홀딩스 가부시키가이샤 Electroless plating inhibiting composition and manufacturing method of plated parts
CN115135803B (en) * 2020-02-19 2024-06-28 日产化学株式会社 Electroless plating base agent containing polymer and metal microparticles

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1491656A1 (en) * 2003-06-24 2004-12-29 Rohm and Haas Electronic Materials, L.L.C. Electroless deposition catalyst and menthod
US20080248211A1 (en) * 2007-03-13 2008-10-09 Basf Corporation Coating compositions containing silane, methods for producing a coating composition and a coated substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006052101A (en) * 2004-08-10 2006-02-23 Mitsuboshi Belting Ltd Method of forming metal coating film on ceramic base material surface and metallized ceramic base material
JP2008007849A (en) * 2006-06-01 2008-01-17 Nippon Paint Co Ltd Primer composition for electroless plating and electroless plating method
CN101506246B (en) * 2006-09-01 2011-06-22 日产化学工业株式会社 Hyperbranched polymer and method for producing the same
CN104906997B (en) * 2008-08-22 2018-07-13 日产化学工业株式会社 The metal particle dispersant being made of the branched polymeric compound with ammonium
EP2698448A4 (en) * 2011-04-12 2015-01-07 Nissan Chemical Ind Ltd Electroless plating primer including hyperbranched polymer and metallic microparticles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1491656A1 (en) * 2003-06-24 2004-12-29 Rohm and Haas Electronic Materials, L.L.C. Electroless deposition catalyst and menthod
US20080248211A1 (en) * 2007-03-13 2008-10-09 Basf Corporation Coating compositions containing silane, methods for producing a coating composition and a coated substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014042215A1 *

Also Published As

Publication number Publication date
EP2896720A1 (en) 2015-07-22
CN104641017A (en) 2015-05-20
TWI627194B (en) 2018-06-21
KR20150054851A (en) 2015-05-20
KR20200015818A (en) 2020-02-12
US20160010215A1 (en) 2016-01-14
EP2896720B1 (en) 2017-11-22
CN104641017B (en) 2018-06-15
JP6354950B2 (en) 2018-07-11
KR102157192B1 (en) 2020-09-18
TW201418299A (en) 2014-05-16
JPWO2014042215A1 (en) 2016-08-18
WO2014042215A1 (en) 2014-03-20

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