SG10201605873QA - Plating apparatus and plating method - Google Patents

Plating apparatus and plating method

Info

Publication number
SG10201605873QA
SG10201605873QA SG10201605873QA SG10201605873QA SG10201605873QA SG 10201605873Q A SG10201605873Q A SG 10201605873QA SG 10201605873Q A SG10201605873Q A SG 10201605873QA SG 10201605873Q A SG10201605873Q A SG 10201605873QA SG 10201605873Q A SG10201605873Q A SG 10201605873QA
Authority
SG
Singapore
Prior art keywords
plating
plating method
plating apparatus
Prior art date
Application number
SG10201605873QA
Inventor
Minami Yoshio
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011158484A external-priority patent/JP5750327B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201605873QA publication Critical patent/SG10201605873QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
SG10201605873QA 2011-07-19 2012-03-07 Plating apparatus and plating method SG10201605873QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011158484A JP5750327B2 (en) 2010-10-21 2011-07-19 Plating apparatus, plating processing method, and attitude changing method of substrate holder for plating apparatus

Publications (1)

Publication Number Publication Date
SG10201605873QA true SG10201605873QA (en) 2016-09-29

Family

ID=47845651

Family Applications (3)

Application Number Title Priority Date Filing Date
SG10201605873QA SG10201605873QA (en) 2011-07-19 2012-03-07 Plating apparatus and plating method
SG10201605875SA SG10201605875SA (en) 2011-07-19 2012-03-07 Plating apparatus and plating method
SG2012016358A SG187305A1 (en) 2011-07-19 2012-03-07 Plating apparatus and plating method

Family Applications After (2)

Application Number Title Priority Date Filing Date
SG10201605875SA SG10201605875SA (en) 2011-07-19 2012-03-07 Plating apparatus and plating method
SG2012016358A SG187305A1 (en) 2011-07-19 2012-03-07 Plating apparatus and plating method

Country Status (3)

Country Link
KR (3) KR101826928B1 (en)
CN (1) CN106149031B (en)
SG (3) SG10201605873QA (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6239417B2 (en) * 2014-03-24 2017-11-29 株式会社荏原製作所 Substrate processing equipment
TWI653701B (en) * 2014-06-09 2019-03-11 日商荏原製作所股份有限公司 Substrate attaching and detaching portion for substrate holder, wet substrate processing device including the substrate attaching and detaching portion, substrate processing device, and substrate transfer method
JP6675257B2 (en) * 2016-04-14 2020-04-01 株式会社荏原製作所 Plating apparatus and plating method
JP6659467B2 (en) * 2016-06-03 2020-03-04 株式会社荏原製作所 Plating apparatus, substrate holder, method of controlling plating apparatus, and storage medium storing program for causing computer to execute method of controlling plating apparatus
JP6468540B2 (en) * 2017-05-22 2019-02-13 キヤノントッキ株式会社 Substrate transport mechanism, substrate mounting mechanism, film forming apparatus, and methods thereof
JP6975650B2 (en) * 2018-01-18 2021-12-01 株式会社荏原製作所 Current measurement module and inspection board using inspection board
KR102022627B1 (en) * 2019-05-24 2019-09-19 (주)엠앤에스코리아 Equipment for supplying and discharging workpiece for planting
KR102248854B1 (en) * 2020-11-20 2021-05-06 주식회사 케이피엠테크 Substrate transfer facility for vertical continuous plating facility

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3904647B2 (en) * 1996-12-27 2007-04-11 キヤノンアネルバ株式会社 Substrate support device, substrate attach / detach device for attaching / detaching substrate to / from the substrate support device, and substrate attach / detach method
US6416647B1 (en) * 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
JP3698596B2 (en) * 1999-08-12 2005-09-21 株式会社荏原製作所 Plating apparatus and plating method
JP2002212784A (en) * 2001-01-12 2002-07-31 Tokyo Electron Ltd Apparatus and method for electrolytic plating
JP2002220692A (en) * 2001-01-24 2002-08-09 Ebara Corp Plating equipment and method
JP2003243473A (en) * 2002-02-15 2003-08-29 Nec Electronics Corp Conveying cart of semiconductor substrate carrier
JP3827627B2 (en) * 2002-08-13 2006-09-27 株式会社荏原製作所 Plating apparatus and plating method
JP2009006802A (en) * 2007-06-27 2009-01-15 Miura Co Ltd Parent and child wheeled cart
JP5398225B2 (en) * 2008-10-28 2014-01-29 上村工業株式会社 Treatment tank

Also Published As

Publication number Publication date
KR20180019016A (en) 2018-02-22
KR101826928B1 (en) 2018-02-07
KR101918653B1 (en) 2018-11-15
CN106149031A (en) 2016-11-23
KR20180019017A (en) 2018-02-22
SG187305A1 (en) 2013-02-28
SG10201605875SA (en) 2016-09-29
CN106149031B (en) 2018-05-18
KR101853801B1 (en) 2018-05-02
KR20130010825A (en) 2013-01-29

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