KR102248854B1 - Substrate transfer facility for vertical continuous plating facility - Google Patents

Abstract

A substrate transfer facility is provided for continuously transferring substrates arranged in a vertical direction in a plating section. According to an aspect of the present invention, the main frame; A substrate mounting portion on which a substrate is mounted; A rail unit disposed on the main frame and providing a transfer path for the substrate mounting unit; A loading unit for loading the substrate onto the rail unit and moving the initial section along the rail unit; A clamping part provided in the substrate mounting part; And a wire unit formed to be coupled to and disengaged from the clamping unit to transfer the substrate mounting unit. The substrate transfer facility of the present invention can improve plating quality and reduce plating variation between substrates.

Description

Substrate transfer facility for vertical continuous plating facility

The present invention relates to a substrate transfer facility, and more particularly, to a substrate transfer facility for continuously transferring a substrate disposed in a vertical direction in a plating section.

As a facility for plating a flat substrate such as a printed circuit board (PCB), a vertical continuous plating facility (VCP) is known. In the vertical continuous plating facility, the substrate is immersed in a plating bath extending in the transfer direction, and the substrate surface is plated.

In the vertical continuous plating facility as described above, a substrate transfer facility is used to transfer the substrate within the plating section. The substrate transfer facility is configured to continuously transfer a plurality of substrates at predetermined intervals, and a transfer method using a chain is now commonly used.

However, the chain transfer method as described above has revealed many problems to date. Typically, the chain is deformed when used for a long period of time, and thereby, there is a problem that the substrate spacing is not kept constant in the plating section. In addition, the chain causes a certain pulsation or vibration due to structural characteristics, and the problem that such pulsation or the like adversely affects the plating quality is also pointed out. These problems may eventually deteriorate the plating quality of the substrate or cause irregular plating deviation. In particular, in recent electronic devices and the like, extremely light, thin, and short reduction is sought, and high precision is required, and the plating quality of the substrate is more important.

Accordingly, new transfer methods such as Korean Patent Registration No. 10-2030399 (name of the invention: a hanger transfer device for plating), Korean Registration Patent No. 10-1434414 (name of the invention: a hanger transfer device for plating apparatus) have been proposed. However, its utilization is not high.

An object of the present invention is to provide a substrate transfer facility for continuously transferring a substrate disposed in a vertical direction in a plating section.

In addition, an object of the present invention is to provide a substrate transfer facility capable of significantly reducing pulsation and shaking during transfer of substrates and maintaining a constant distance between substrates.

In addition, an object of the present invention is to provide a substrate transfer facility capable of improving the plating quality of a substrate and reducing plating variation between substrates.

According to an aspect of the present invention, there is provided a substrate transfer facility for continuously transferring a substrate disposed in a vertical direction in a plating section, comprising: a main frame; A substrate mounting portion on which a substrate is mounted; A rail unit disposed on the main frame and providing a transfer path for the substrate mounting unit; A loading unit for loading the substrate onto the rail unit and moving the initial section along the rail unit; A clamping part provided in the substrate mounting part; And a wire unit formed to be coupled to and disengaged from the clamping unit to transfer the substrate mounting unit.

The substrate transfer facility according to the embodiments of the present invention can reduce pulsation and vibration of a substrate during transfer compared to an existing chain or belt method through a transfer method through a wire. Accordingly, the plating quality of the substrate can be improved.

In addition, the substrate transfer facility according to the embodiments of the present invention can reduce the spacing between substrates during the plating process, and the initially set spacing may be kept constant through the rigidity of the wire. Accordingly, it is possible to reduce the plating deviation between substrates, and may contribute in part to productivity improvement.

1A is a perspective view of a main part of a substrate transfer facility according to an embodiment of the present invention.
1B is a front view of the substrate transfer facility shown in FIG. 1A.
1C is a side view of the substrate transfer facility shown in FIG. 1A.
1D is a plan view of the substrate transfer facility shown in FIG. 1A.
2A is an enlarged perspective view of the loading unit shown in FIG. 1A.
2B is a front view of the loading unit shown in FIG. 2A.
2C is a bottom perspective view of the slide unit shown in FIG. 2A.
3A is an enlarged perspective view of the substrate mounting portion shown in FIG. 1A.
3B is a front view of the substrate mounting portion shown in FIG. 3A.
4A is an enlarged perspective view of the clamping part shown in FIG. 1A.
Figure 4b is a side view of the clamping portion shown in Figure 4a.
4C is a first operating state diagram of the clamping unit shown in FIG. 4A.
4D is a second operational state diagram of the clamping unit shown in FIG. 4A.
5A is a first operational state diagram of the substrate transfer facility shown in FIG. 1A.
5B is a second operational state diagram of the substrate transfer facility shown in FIG. 1A.
5C is a third operational state diagram of the substrate transfer facility shown in FIG. 1A.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, the following examples are provided to aid understanding of the present invention, and the scope of the present invention is not limited to the following examples. The following embodiments are provided to more completely describe the present invention to those of ordinary skill in the relevant technical field, and a detailed description of a known configuration determined to unnecessarily obscure the technical subject matter of the present invention. I will omit it.

1A is a perspective view of a main part of a substrate transfer facility according to an embodiment of the present invention. 1B is a front view of the substrate transfer facility shown in FIG. 1A. 1C is a side view of the substrate transfer facility shown in FIG. 1A. 1D is a plan view of the substrate transfer facility shown in FIG. 1A.

For convenience, the x-axis direction is referred to as a left-right direction, a y-axis direction is referred to as a front-rear direction, and a z-axis direction is referred to as a vertical direction based on the coordinate axis shown in FIG.

1A to 1D, the substrate transfer facility 10 of the present embodiment may be used for transferring the substrate 1.

The substrate 1 may include a printed circuit board (PCB).

The substrate transfer facility 10 can be used for plating onto the substrate 1. Alternatively, the substrate 1 is transferred by the substrate transfer facility 10 and may be plated. For example, the substrate 1 is transferred by the substrate transfer facility 10 and may be plated with copper or copper alloy.

However, the substrate transfer facility 10 is not necessarily limited to plating treatment and the like, and is not applicable. For example, the substrate transfer facility 10 transfers the substrates 1 arranged up and down on a predetermined plane, performs a predetermined processing, and thus can be used in various fields and uses where precise control of vibrations and intervals is required. I can.

In addition, "plating" described herein is generally intended for electroplating, but does not exclude other known methods of plating such as molten metal immersion plating, thermal spray plating, evaporation plating, and cathode spray plating. In addition, in some cases, various surface treatment processes may be widely included.

In some cases, the substrate transfer facility 10 may constitute a part of the plating facility. That is, the substrate transfer facility 10 is used to transfer the substrate 1 within the plating facility, and may constitute a part of the plating facility. For example, the plating facility may include a facility in which the substrate 1 is vertically erected and transferred, and plating is performed by applying a current to the surface of the substrate 1 or the like. For reference, this plating facility is referred to in the art as a vertical continuous plating facility (VCP).

Overall, the substrate transfer facility 10 of the present embodiment includes a main frame 100, a substrate mounting portion 200 on which the substrate 1 is mounted, a rail portion 300 providing a transfer path for the substrate mounting portion 200, and a substrate ( 1) a loading unit 400 and an unloading unit 500 for loading and unloading the rail unit 300, a clamping unit 600 provided in the substrate mounting unit 200 and capable of being coupled to the wire unit 700, clamping It may include a wire portion 700 coupled to the portion 600 to transfer the substrate mounting portion 200 to one side (on the drawing, left).

Looking at the schematic operation, the substrate 1 is mounted on the substrate mounting portion 200, and the substrate mounting portion 200 is disposed in an initial position (on the drawing, at the right end). Subsequently, the loading part 400 is fastened to the clamping part 600, and the substrate mounting part 200 is on one side along the rail part 300 by a flap 472 provided in the loading part 400 (on the drawing, on the left side). ). When the substrate mounting part 200 is transferred to one end (on the drawing, the left end) of the loading part 400, the clamping part 600 is fastened to the wire part 700, and the clamping part 600 is the loading part 400 ) And disassociated.

Subsequently, the substrate mounting part 200 is transferred to one side (on the drawing, left) by the wire part 700, and may be plated through a predetermined plating facility during the transfer process. For reference, plating facilities are omitted in FIG. 1A and the like. When the substrate mounting portion 200 is transferred to one end (on the drawing, the left end) of the wire portion 700, the unloading portion 500 is fastened to the clamping portion 600, and the clamping portion 600 is a wire portion ( 700). In addition, the unloading unit 500 transfers the substrate mounting unit 200 toward one end (on the drawing, the left end) of the rail unit 300.

After the unloading unit 500, the substrate 1 may appropriately undergo a necessary next process. For example, the substrate 1 may be transferred to the next process through a washing process, and the substrate mounting unit 200 may be separated from the substrate 1 and returned to an initial position. However, in the present invention, the process after the unloading unit 500 is not particularly limited.

The above-described operation may be simultaneously performed for the plurality of substrate mounting portions 200 or the substrate 1. That is, the substrate transfer facility 10 may include a plurality of substrate mounting portions 200, and the above-described operation may be performed simultaneously for each of the substrate mounting portions 200.

Such a substrate transfer facility 10 has one characteristic in that the substrate 1 is transferred by the wire portion 700 during the plating process. The transfer method by the wire part 700 may reduce shaking or pulsation, and thus, the distance between the substrate mounting parts 200 may be kept constant. In another aspect, this may contribute to reducing the spacing between the substrate mounting portions 200 and reducing plating deviations between the respective substrates 1.

Hereinafter, each configuration of the substrate transfer facility 10 as described above will be described in more detail.

The substrate transfer facility 10 of this embodiment may include a main frame 100.

The main frame 100 forms the overall appearance of the substrate transfer facility 10 and may provide a support structure for mounting component parts. The main frame 100 may be formed in a frame structure, and as long as it has a predetermined rigidity and can provide a supporting structure, its structure or shape is not particularly limited.

The substrate transfer facility 10 of the present embodiment may include a rail unit 300 installed on the main frame 100.

The rail part 300 may be formed extending from the top of the main frame 100 to the left and right. In the present embodiment, the rail unit 300 is illustrated as a separate component distinguished from the main frame 100, but in some cases, the rail unit 300 may be integrally formed on the main frame 100. .

The rail part 300 has a predetermined cross-sectional shape and extends left and right, thereby providing a moving path of the rail bracket () to be described later.

If necessary, the rail unit 300 may be configured as a pair of spaced front and rear. That is, the rail unit 300 may include a front rail 310 and a rear rail 320 that is spaced apart from the rear of the front rail 310 by a predetermined distance and extends left and right to correspond to the front rail 310. In this case, the front rail 310 provides a transfer path for plating the substrate 1, and the rear rail 320 may be used to return the substrate mounting portion 200 back to the initial position.

2A is an enlarged perspective view of the loading unit shown in FIG. 1A. 2B is a front view of the loading unit shown in FIG. 2A. 2C is a bottom perspective view of the slide unit shown in FIG. 2A.

2S to 2C, the substrate transfer facility 10 of the present embodiment may include a loading unit 400.

The loading unit 400 may be disposed in a region on one side (right side) of the main frame 100 that generally corresponds to an initial position (on the drawing, at the right end) of the substrate mounting unit 200. The loading unit 400 may transfer the substrate mounting unit 200 disposed in the initial position to one end (on the drawing, the left end) of the wire unit 700. When a plurality of substrate mounting units 200 are provided, the loading unit 400 may sequentially transfer each of the substrate mounting units 200 to the wire unit 700. Each of the substrate mounting portions 200 may be properly spaced apart at predetermined intervals by the loading portion 400.

Specifically, the loading unit 400 may include a fixed rail 410 and a moving rail 420.

The fixed rail 410 is formed to extend left and right, and may be fastened to the main frame 100. The fixed rail 410 may be fixed to the main frame 100. The moving rail 420 is formed to extend left and right and may be fastened to the fixed rail 410. Here, the moving rail 420 may be fastened to the fixed rail 410 so as to slide along the fixed rail 410.

For reference, the sliding movement of the moving rail 420 with respect to the fixed rail 410 may be passively performed by a linker unit 470 to be described later.

Meanwhile, the loading unit 400 may include a slide unit 430 and an elevating unit 440.

The slide unit 430 may be fastened to the moving rail 420 so as to slide along the moving rail 420. The slide unit 430 may have a predetermined driving means and may be formed to be movable back and forth with respect to the moving rail 420.

The elevating unit 440 may be fastened to the slide unit 430 so as to slide up and down. The elevating unit 440 may have a predetermined driving means and may be formed to move up and down with respect to the slide unit 430.

For reference, the driving means may include a known driving means such as a motor and an actuator, and each driving means of the slide unit 430 and the elevating unit 440 may be integrated or separately separated as necessary. In addition, in the case of this embodiment, the slide unit 430 and the elevating unit 440 are exemplified in the form of a substantially square frame or plate, but the shape of the slide unit 430 and the elevating unit 440 is necessarily just as illustrated. It is not limited and may be variously modified as needed.

Meanwhile, the loading unit 400 may include a pressing block 450.

The pressure block 450 may be disposed on the elevating unit 440. In the case of this embodiment, the pressure block 450 is disposed generally skewed toward the front at the bottom portion of the elevating unit 440.

The pressing block 450 may have a seating groove 451. The seating groove 451 may be formed as a groove recessed from the lower portion of the pressure block 450 toward the upper side. The seating groove 451 may pressurize and support the push roller 620 of the clamping part 600 to be described later. Accordingly, preferably, the seating groove 451 may be formed in a shape, size, etc. corresponding to the push roller 620.

If necessary, the pressing block 450 may have an inclined surface 452. The inclined surface 452 may be formed to be tapered from the lower portion of the seating groove 451 toward the lower end of the pressing block 450. Accordingly, the width of the opening at the lower end of the pressing block 450 may be formed to be a predetermined amount larger than the width of the mounting groove 451, and the push roller 620 is guided by the inclined surface 452 while the mounting groove 451 ) Can be stably fastened.

Meanwhile, the loading unit 400 may include an operation block 460.

The operation block 460 may be disposed on the elevating unit 440 to be adjacent to the pressing block 450. In this embodiment, the operation block 460 is generally spaced apart from the bottom of the lifting unit 440 to the rear of the pressing block 450.

The operation block 460 is disposed to correspond to the rotation roller 632 of the clamping part 600 to be described later, and may press and support the rotation roller 632 according to the operation of the elevating unit 440. In addition, the operation block 460 may pressurize and rotate the rotating roller 632 to couple or disengage the clamping part 600 to the wire part 700. This will be amplified in relation to the clamping part 600 to be described later.

For the above operation, the operation block 460 may be formed to be movable up and down by a predetermined driving means. The driving means of the operation block 460 is distinguished from the elevating unit 440 and may be formed to independently move the operation block 460 up and down.

If necessary, the operation block 460 may have a horizontal surface 461 and a vertical surface 462. The horizontal surface 461 may be formed to extend substantially horizontally from the bottom portion of the elevating unit 440, and the vertical surface 462 may be formed to extend substantially vertically from one end (in the drawing, front end) of the horizontal surface 461. . In this case, the horizontal surface 461 pressurizes the upper surface portion of the rotating roller 632, and the vertical surface 462 guides the rotating roller in contact with the rolling surface portion, thereby achieving a stable pressing operation.

In this case, the operation block 460 may further include an inclined surface 463. The inclined surface 463 may be formed by cutting the lower end of the vertical surface 462 to be inclined to a predetermined degree. The inclined surface 463 may induce smooth entry of the rotating roller 632 when entering the lower end of the vertical surface 462 of the rotating roller 632.

Meanwhile, the loading unit 400 may include a linker unit 470.

The linker unit 470 is disposed on one side (on the left side of the drawing) of the bottom surface of the moving rail 420 and may be fastened to the moving rail 420. The linker unit 470 may be fixedly installed on the moving rail 420, and accordingly, the linker unit 470 and the moving rail 420 may be moved left and right along the fixed rail 410. More specifically, the moving rail 420 may be moved left and right with respect to the fixed rail 410 as the linker unit 470 moves to one side (on the drawing, left) together with the slide unit 430.

The linker unit 470 may include a linker bracket 471, a flap 472, and an actuator 473. The linker bracket 471 may be mounted on the bottom of the moving rail 420, and the flap 472 and the actuator 473 may be fastened to the linker bracket 471. Here, the flap 472 may be fastened to the linker bracket 471 via the first hinge 472a, and the actuator 473 is fastened to the flap 472 via the second hinge 473a. Can be. Each of the first and second hinges forms a vertical axis of rotation, and may be spaced apart from each other by a predetermined distance before and after each other.

According to the coupling structure as described above, the flap 472 is rotated to one side around the first hinge 472a, and is disposed to protrude forward by a predetermined degree, or is rotated in the opposite direction by the actuator 473, generally in the left and right direction. Can be placed side by side. In the former case, the flap 472 may contact and interfere with the link block 612 of the clamping unit 600 to be described later, and in the latter case, the flap 472 may be spaced apart from the link block 612. Accordingly, the former case is referred to as "interference state" and the latter case is referred to as "non-interference state".

The operation of the linker unit 470 will be amplified in connection with the clamping unit 600 to be described later.

Meanwhile, the substrate transfer facility 10 of the present embodiment may include an unloading unit 500.

Referring to FIG. 1A and the like, the unloading unit 500 may be disposed substantially opposite to the loading unit 400 (in the drawing, at the left end). The unloading unit 500 may disassociate the substrate mounting unit 200 transferred through the wire unit 700 from the wire unit 700. That is, the substrate mounting part 200 may be separated from the wire part 700 and supported by the unloading part 500, and may be appropriately transferred to the next process by the unloading part 500.

The unloading unit 500 may be formed in the same or similar to the above-described loading unit 400, but only partially different in arrangement or function, a detailed description thereof will be omitted.

3A is an enlarged perspective view of the substrate mounting portion shown in FIG. 1A. 3B is a front view of the substrate mounting portion shown in FIG. 3A.

3A to 3B, the substrate transfer facility 10 of the present embodiment may include a substrate mounting unit 200.

The substrate mounting part 200 may be installed on the rail part 300 so as to be movable along the rail part 300. In addition, the substrate 1 may be mounted on the substrate mounting part 200. The substrate 1 is moved along the rail unit 300 while being mounted on the substrate mounting unit 200 and may be plated through a predetermined plating facility.

A plurality of substrate mounting portions 200 may be provided. In FIG. 1A and the like, only one substrate mounting portion 200 is shown at each side for convenience, but a plurality of substrate mounting portions 200 may be provided, and a plurality of substrate mounting portions 200 are disposed adjacent to each other to the left and right. It may be transported along the rail part 300. Accordingly, plating treatment in the plurality of substrate mounting portions 200 may be performed continuously or simultaneously.

Meanwhile, the substrate mounting part 200 may include a rail mounting bracket 210.

The rail mounting bracket 210 is generally disposed on the upper portion of the substrate mounting portion 200 and may be formed to extend toward one side (rear) toward the rail portion 300.

The rail mounting bracket 210 may include a plurality of rollers 211 and 212 to enable rolling movement along the rail part 300. Preferably, the rail mounting bracket 210 is a pair of upper rollers 211 which are generally rolled in contact with the upper side of the rail part 300, and a pair of lower part which is generally rolled in contact with the lower side of the rail part 300 A roller 212 may be provided. A pair of upper rollers 211 and lower rollers 212 may be spaced apart from each other to the left and right.

In addition, the upper roller 211 is arranged to be clouded in contact with one surface (for example, the front) of the rail part 300, and the lower roller 212 is arranged to be clouded in contact with the opposite surface (for example, the rear) of the rail part 300. Can be placed. Accordingly, the rail mounting bracket 210 may have a function of supporting the substrate mounting portion 200 to the rail portion 300.

Meanwhile, the substrate mounting unit 200 may include a substrate mounting frame 220.

The substrate mounting frame 220 may extend forward from the rail mounting bracket 210 to provide a support structure for mounting the substrate 1. The substrate mounting frame 220 may be implemented in the form of a frame or plate having a predetermined shape and structure, and in the case of this embodiment, it is illustrated in the form of a substantially rectangular frame. However, the shape of the substrate mounting frame 220 is not necessarily limited to the illustrated bar, and may be appropriately modified as necessary.

In addition, the substrate mounting frame 220 may include an upper clamper 221 and a lower clamper 222 for clamping the substrate 1. A plurality of upper clampers 221 may be disposed horizontally apart from the upper side of the substrate mounting frame 220, and a plurality of lower clampers 222 may be disposed horizontally apart from the lower side of the substrate mounting frame 220.

Although not shown, if necessary, the substrate mounting unit 200 may be provided with a vibration generating means.

The vibration generating means is disposed on one side of the substrate mounting part 200 to apply fine vibrations of a predetermined frequency to the substrate mounting part 200. For example, the vibration generating means may be mounted on one side of the rail mounting bracket 210, and is mechanically contacted with the rail mounting bracket 210, so as to finely vibrate the rail mounting bracket 210 or the substrate 1 supported thereto. I can. However, if the vibration generating means is a position capable of transmitting a predetermined vibration to the substrate 1, it may be mounted or disposed in more various positions, and the mounting position is not necessarily limited to the rail mounting bracket 210 or the like. The vibration generating means applies micro-vibration to the substrate 1 so that a plating solution or the like can be appropriately introduced into the micro holes formed in the substrate 1, and may contribute to improving the plating quality.

4A is an enlarged perspective view of the clamping part shown in FIG. 1A. Figure 4b is a side view of the clamping portion shown in Figure 4a.

4A to 4B, the substrate transfer facility 10 of the present embodiment may include a clamping unit 600.

The clamping part 600 may be mounted on one side of the substrate mounting part 200. More specifically, as shown, the clamping part 600 is disposed on the upper surface of the rail mounting bracket 210 described above, and may be mounted on the rail mounting bracket 210. Accordingly, the clamping part 600 may be moved together with the substrate mounting part 200.

A plurality of clamping units 600 may be provided to correspond to the plurality of substrate mounting units 200. That is, the plurality of substrate mounting portions 200 may include respective clamping portions 600.

The clamping part 600 is fastened to the loading part 400 or the unloading part 500 and transferred by the loading part 400 or the unloading part 500, or fastened to the wire part 700 and the wire part 700 ) Can be transported. Preferably, the clamping part 600 may be fastened to the wire part 700 at least in the plating treatment section, and accordingly, the clamping part 600 to the substrate mounting part 200 are provided with the wire part 700 in the plating treatment section. Can be transported by

Meanwhile, the clamping part 600 may include a clamping part body 610.

The clamping part body 610 may be fastened to the rail mounting bracket 210. The clamping unit body 610 may be formed in the form of a predetermined frame, bracket, body, etc. to which each component of the clamping unit 600 can be mounted and supported. However, the shape of the clamping part 600 is not necessarily limited to the illustrated shape, and may be modified into various shapes having the same or similar functions.

A first grip groove 611 may be formed in the clamping part body 610. The first grip groove 611 may be generally formed at the rear end of the clamping unit body 610, and may be formed in a partial circular or arc shape corresponding to the wire part 700. The first grip groove 611 may correspond to the second grip groove 635a to be described later to provide a coupling structure for gripping the wire portion 700.

In addition, the clamping part body 610 may include a link block 612. The link block 612 may be formed to protrude a predetermined height upward from the rear end of the clamping body 610. The link block 612 interferes with the linker unit 470 described above, and may move the moving rail 420 to the substrate mounting part 200. This is amplified in relation to the operation of the clamping part 600.

The clamping part body 610 may include a guide hole 613. The guide hole 613 may be formed to pass through the clamping part body 610 left and right, and may extend in a long hole shape along a moving trajectory of the moving shaft 634 to be described later. Accordingly, the guide hole 613 may guide the movement of the moving shaft 634.

Meanwhile, the clamping part 600 may include a push roller 620.

The push roller 620 may be disposed at a front end portion of the clamping unit body 610 and rotatably supported by the clamping unit body 610. The push roller 620 may have a rotation axis in a generally front-rear direction, and may be fastened to the clamping part body 610.

The push roller 620 may be fastened with the pressing block 450 of the loading unit 400 described above. That is, the pressing block 450 is lowered by the elevating unit 440, and the push roller 620 is pressed and supported in the seating groove 451, so that it can be fastened with the push roller 620. The inclined surface 452 at the bottom of the pressure block 450 may correct and/or correct the fastening position of the mounting groove 451 and the push roller 620.

By the coupling between the push roller 620 and the pressing block 450 as described above, the substrate mounting part 200 may be moved left and right together with the slide unit 430 described above. That is, the push roller 620 may function as a support means for horizontal movement of the substrate mounting part 200.

Meanwhile, the clamping part 600 may include a rotation bracket 630.

The rotation bracket 630 may be spaced apart from the push roller 620 by a predetermined distance in front and rear, and may be rotatably fastened to the clamping part body 610. Specifically, the rotation bracket 630 may have an assembly shaft 631 at a rear end, and may be rotatably fastened to the clamping body 610 through the assembly shaft 631. The assembly shaft 631 may generally form a horizontal axis of rotation.

In addition, the rotation bracket 630 may include a rotation roller 632. The rotation roller 632 may be rotatably fastened to the front end of the rotation bracket 630 with the roller shaft 632a in the left and right direction. For reference, this is in contrast to the above-described push roller 620 having a rotation axis in the front and rear direction.

The rotating roller 632 may be moved by pressure by the operation block 460 described above. That is, the rotating roller 632 may be pressed downward by the operation block 460 and moved, or the pressurized may be released and returned upward. The movement of the rotating roller 632 may be performed by rotating the rotating bracket 630 around the assembly shaft 631.

Here, in the above-described operation block 460, the horizontal surface 461 contacts and presses the upper side of the rotating roller 632, and the vertical surface 462 contacts and guides the front of the rotating roller 632 so that a stable pressing operation can be achieved. do. In addition, the inclined surface 452 at the bottom of the operation block 460 allows the initial contact between the operation block 460 and the rotating roller 632 to be smoothly achieved.

In addition, the rotation bracket 630 may include a spring shaft 633 and a moving shaft 634. The spring shaft 633 is for fastening the elastic support portion 640 to be described later, and is spaced apart from the lower side of the roller shaft 632a, as illustrated, to form a horizontal axis of rotation.

The moving shaft 634 may be disposed spaced apart from the spring shaft 633 by a predetermined distance, and may be fastened to the guide hole 613 described above. The moving shaft 634 may be moved along the guide hole 613 in response to the movement of the rotating roller 632, thereby guiding the rotation of the rotating roller 632 to the rotating bracket 630. .

In addition, the rotation bracket 630 may include a gripper 635. The gripper 635 may generally extend downward from the rear end of the rotation bracket 630. The gripper 635 may have a second grip groove 635a, and the second grip groove 635a may be formed in a partial circular or arc shape corresponding to the first grip groove 611 described above. . The clamping part 600 may be fastened with the wire part 700 by pressing the wire part 700 in contact between the first and second grip grooves 611 and 635a.

Meanwhile, the clamping part 600 may include an elastic support part 640.

The elastic support part 640 may elastically support the rotation bracket 630 between the clamping part body 610 and the rotation bracket 630. The elastic support part 640 may have one end (front) rotatably fastened to the clamping part body 610, and the opposite end (rear end) may be rotatably fastened to the rotation bracket 630.

The elastic support part 640 may elastically support the rotation bracket 630 in a direction in which the first and second grip grooves 611 and 635a approach each other. Accordingly, in a state in which no external force is applied, the first and second grip grooves 611 and 635a are elastically supported in a direction approaching each other, and may be fastened to the wire portion 700 or the like.

In addition, in the above state, when an external force is applied (that is, when the operation block 460 presses the rotating roller 632), the elastic support 640 may be elastically compressed and deformed by the external force. In this case, the first and second grip grooves 611 and 635a may be moved in a direction spaced apart from each other and may be separated from the wire portion 700 or the like.

If necessary, the elastic support 640 is a compression spring that elastically supports the cylinder 641 fastened between the front end of the clamping body 610 and the spring shaft 633 and the front and rear ends of the cylinder 641 It can be composed of 642. In addition, although not shown, a cover member for blocking the inflow of foreign substances or the like may be covered on the compression spring 642 or the like.

4C is a first operating state diagram of the clamping unit shown in FIG. 4A.

4C shows a state in which no external force is applied. Referring to FIG. 4C, in the first operating state, the elastic support part 640 elastically supports the rotation bracket 630 so that the first and second grip grooves 611 and 635a may be disposed in a direction approaching each other. In such a state, the first and second grip grooves 611 and 635a are pressed into contact with the wire part 700 and may be fastened with the wire part 700.

The first operating state as described above may be generally maintained in the moving section of the clamping part 600 to the substrate mounting part 200 by the wire part 700. Alternatively, the first operating state may be maintained in a moving section in which the substrate 1 is plated. That is, the clamping part 600 to the substrate mounting part 200 are fastened to the wire part 700 through the first operating state, and may be plated while being transferred according to the movement of the wire part 700.

4D is a second operational state diagram of the clamping unit shown in FIG. 4A.

4D shows a state in which a pressing force is applied to the rotating roller 632 by the operation block 460. Referring to FIG. 4D, in the second operating state, the rotation roller 632 may be pressed downward by the operation block 460 to a predetermined degree, whereby the rotation bracket 630 is centered on the assembly shaft 631. It can be rotated to a certain degree (in the drawing, counterclockwise). In addition, the gripper 635 is rotated around the assembly shaft 631 in a corresponding direction (in the drawing, counterclockwise), and the first and second grip grooves 611 and 635a are spaced apart from each other, and the wire portion 700 Can be dissociated from

The second operating state as described above may be generally maintained in the transfer section of the loading unit 400 or the unloading unit 500 except for the transfer section of the wire section 700. Alternatively, the second operating state may be maintained in the transfer section before and after the plating treatment. That is, the clamping part 600 to the substrate mounting part 200 may be transferred to the front end section of the wire part 700 through the second operating state, or may be separated from the rear end of the wire part 700.

Meanwhile, referring to FIG. 1A and the like described above, the substrate transfer facility 10 of the present embodiment may include a wire unit 700.

The wire part 700 is supported by the main frame 100 and may transfer the substrate mounting part 200 to the left and right. The wire part 700 may be used as a transfer means of the substrate 1 in a section in which the substrate 1 is generally plated.

The wire part 700 may be formed of a flexible metal wire. Preferably, the wire portion 700 may be formed of a metal wire made of stainless steel that has corrosion resistance and can maintain an appropriate tension corresponding to the weight of the substrate 1 or the like. However, the material of the wire portion 700 is not necessarily limited to the illustrated stainless steel or the like, and in some cases, it may be replaced with another material having the same or similar properties.

The wire part 700 may be transported in the longitudinal direction (in the drawing, in the left and right directions). Accordingly, the substrate mounting portion 200, etc. fastened to the wire portion 700 may be transferred along the wire portion 700, and a predetermined plating treatment may be performed during the transfer process.

Although not clearly shown, the wire portion 700 may be transported in the longitudinal direction by a predetermined driving means such as a traction wheel. In addition, the wire portion 700 may form a closed loop and may be transferred in the longitudinal direction, and, if necessary, a tension maintaining means for maintaining an appropriate tension may be added. However, in this embodiment, the transfer path or shape of the wire part 700 is not particularly limited.

The wire portion 700 as described above may reduce pulsation during transfer compared to a conventionally known method, and may contribute to reducing a gap between the substrate 1 or the substrate mounting portion 200.

Incidentally, the conventionally commonly used method is a method of using a chain. In this case, due to the structural characteristics of the chain, a predetermined pulsation occurs during movement. In addition, since the hanger or the like corresponding to the substrate mounting portion has a structure in which the hanger or the like is simply placed on the chain and transferred, there has been a problem that the position of the hanger is changed after a long drive. In addition, a method of using a belt in another method is known, but this is not properly used in related fields because belts made of urethane materials are increased. The substrate transfer facility 10 of this embodiment solves these conventional problems by introducing a new transfer structure using the wire part 700.

Hereinafter, the operation of the substrate transfer facility 10 as described above will be described.

5A is a first operational state diagram of the substrate transfer facility shown in FIG. 1A.

For convenience, in FIG. 5A and the like, an operation in the loading part 400 will be mainly described. The operation at the unloading unit 500 may be performed in the same or similar order in the reverse order.

In addition, in FIG. 5A and the like, assuming that a plurality of substrates 1-1 and 1-2 are continuously loaded, the second substrate 1 is loaded and transferred first. -2) will be described focusing on the process of newly loading. In addition, for convenience, the components corresponding to the transfer of the first substrate 1-1 are referred to as the first substrate mounting part 200-1, etc., and components corresponding to the transfer of the second substrate 1-2 The elements will be referred to as the second substrate mounting portion 200-2 of a similar manner.

Referring to FIG. 5A, in a process where the first substrate 1-1 is mounted on the first substrate mounting portion 200-1 and transferred through the wire portion 700, the second substrate 1-2 is mounted. The second substrate mounting portion 200-2 is disposed in an initial position.

When the second substrate mounting portion 200-2 is disposed in the initial position, the slide unit 430 moves to a corresponding position, and the pressure block 450 is lowered. Accordingly, the pressing block 450 is fastened with the second clamping portion 600-2 (that is, the push roller 620) disposed on the second substrate mounting portion 200-2. Subsequently, the operation block 460 is lowered to press and support the second clamping part 600-2 (ie, the rotating roller 632) downward. That is, the second clamping part 600-2 may have a second operating state as shown in FIG. 4D.

Together with the above, the first clamping part 600-1 disposed on the first substrate mounting part 200-1 is in contact with the linker unit 470. Specifically, the flap 472 of the linker unit 470 is rotated on the moving path of the first clamping part 600-1, and the first clamping part 600-1 is one side (that is, the link block 612). ) Is in contact with the flap 472. Accordingly, the linker unit 470 may interfere with the first clamping part 600-1 and be transported along the wire part 700 together with the first clamping part 600-1.

In addition, the moving rail 420 and the second substrate mounting portion 200-2 may be pulled to one side (on the drawing, left) together with the linker unit 470 as described above.

5B is a second operational state diagram of the substrate transfer facility shown in FIG. 1A.

Referring to FIG. 5B, when the first board mounting part 200-1 is moved to a preset predetermined position, the slide unit 430 is driven, so that the second board mounting part 200-2 is moved to the first board mounting part 200- It is transferred to a position adjacent to 1). Here, the second board mounting part 200-2 may be spaced apart from the first board mounting part 200-1 at predetermined intervals, and may be generally disposed as a front end portion of the wire part 700.

Subsequently, in the second substrate mounting part 200-2, the second clamping part 600-2 may be fastened with the wire part 700. Specifically, the operation block 460 is raised and lowered, the restraint of the second clamping part 600-2 (that is, the rotating roller 632) is released, and the second rotation is performed by the second elastic support part 640-2. The bracket (630-2) is rotated. Accordingly, the second clamping portion 600-2 (that is, the gripper 635) is fastened to the wire portion 700. That is, the second clamping part 600-2 is converted to the first operating state as shown in FIG. 4C. In addition, the pressure block 450 is also elevated, and the second substrate mounting portion 200-2 is transferred by the wire portion 700.

Together with the above, the linker unit 470 is separated from the first clamping part 600-1. That is, in the linker unit 470, the flap 472 is rotated in the opposite direction, and the contact with the first clamping part 600-1 is released. Accordingly, the first substrate mounting portion 200-1 is transferred through the wire portion 700 without interference with the flap 472.

5C is a third operational state diagram of the substrate transfer facility shown in FIG. 1A.

Referring to FIG. 5C, the slide unit 430 is then returned to the initial position as shown in FIG. 5A, and waits for the third substrate mounting part 200-3 to be newly inserted. The slide unit 430 is fastened to the third board mounting part 200-3 in a similar manner to the above-described second board mounting part 200-2, so that the above-described operation process can be repeated.

In addition, the linker unit 470 is gradually rotated with the second clamping part 600-2 as the flap 472 is rotated again, and as the slide unit 430 returns and the second substrate mounting part 200-2 moves. As it approaches, contact interference with the second clamping part 600-2. Accordingly, similar to the above, the linker unit 470 may interfere with the second clamping part 600-2 and be transported along the wire part 700.

As described above, the substrate transfer facility 10 according to the embodiments of the present invention may be used to continuously transfer the substrate 1 disposed in the vertical direction in the plating section.

In particular, the substrate transfer facility 10 according to the embodiments of the present invention can reduce pulsation and vibration of the substrate during transfer compared to the conventional chain or belt method through a wire transfer method. Accordingly, the plating quality of the substrate 1 can be improved.

In addition, the substrate transfer facility 10 according to the embodiments of the present invention may properly adjust the spacing between the substrates 1 during the plating process, and the initially set spacing may be kept constant through the stiffness of the wire. Accordingly, it is possible to reduce the plating deviation between the substrates 1, and may contribute in part to productivity improvement.

As described above, embodiments of the present invention have been described, but those of ordinary skill in the relevant technical field can add, change, delete, or add components within the scope not departing from the spirit of the present invention described in the claims. Accordingly, the present invention can be variously modified and changed, and it will be said that this is also included within the scope of the present invention.

1: substrate 10: substrate transfer facility
100: main frame 200: board mounting portion
210: rail mounting bracket 220: board mounting frame
300: rail part 400: loading part
410: fixed rail 420: moving rail
430: slide unit 440: elevating unit
450: pressure block 460: operation block
470: linker unit 500: unloading unit
600: clamping part 610: clamping part body
620: push roller 630: rotation bracket
640: elastic support

Claims (10)

In a substrate transfer facility that continuously transfers substrates arranged in a vertical direction in a plating section,
Mainframe 100;
A substrate mounting portion 200 on which the substrate 1 is mounted;
A rail unit 300 disposed on the main frame 100 to provide a transfer path for the substrate mounting unit 200;
A loading unit 400 for loading the substrate 1 onto the rail unit 300 and moving the initial section along the rail unit 300;
A clamping part 600 provided in the substrate mounting part 200; And
Including; a wire portion 700 formed to be coupled to and disengaged from the clamping portion 600 to transfer the substrate mounting portion 200,
The loading unit 400,
A fixed rail 410 fastened to the main frame 100;
A moving rail 420 fastened to the fixed rail 410 and slidable along the fixed rail 410;
A slide unit 430 that is fastened to the moving rail 420 and slidable along the moving rail 420;
An elevating unit 440 formed to move up and down with respect to the slide unit 430;
A pressing block 450 disposed on the elevating unit 440 and formed to be coupled to the clamping unit 600; And
An operation block 460 disposed adjacent to the pressing block 450 and for pressing and operating the clamping part 600; including, a substrate transfer facility. delete The method according to claim 1,
The pressure block 450,
A seating groove 451 in which the bottom surface of the pressing block 450 is concavely inserted upward, and is pressed into contact with the push roller 620 of the clamping part 600; And
Containing, a substrate transfer facility including; an inclined surface 452 which extends obliquely from the lower end of the seating groove 451 and guides the fastening of the push roller 620 in contact. The method according to claim 1,
The operation block 460,
A horizontal surface 461 extending in a horizontal direction to the bottom surface of the operation block 460 and pressing and contacting the upper surface of the rotating roller 632 provided in the clamping part 600; And
A substrate transfer facility comprising; a vertical surface 462 extending downward from one side of the horizontal plane 461 and for contacting and guiding a front side of the rotating roller 632. The method according to claim 1,
The loading unit 400,
Including a linker unit 470 fastened to one side of the moving rail 420,
The linker unit 470,
A linker bracket 471 fastened to the moving rail 420;
A flap 472 that is fastened to the linker bracket 471 and is formed to be rotatable about an upper and lower axis, and interferes in contact with the clamping part 600; And
Containing, an actuator 473 which is fastened to the flap 472 and drives the flap 472 to rotate. The method of claim 5,
The linker unit 470,
An interference state in which the flap 472 touches and interferes with the clamping part 600; And
Including; a non-interference state in which the flap 472 is rotated by a predetermined degree in the interference state, and the flap 472 and the clamping part 600 are spaced apart,
The loading unit 400,
In the interference state, interlocked with the movement of the clamping unit 600, in the non-interference state, the substrate transfer facility to be separated from the movement of the clamping unit 600. In a substrate transfer facility that continuously transfers substrates arranged in a vertical direction in a plating section,
Mainframe 100;
A substrate mounting portion 200 on which the substrate 1 is mounted;
A rail unit 300 disposed on the main frame 100 to provide a transfer path for the substrate mounting unit 200;
A loading unit 400 for loading the substrate 1 onto the rail unit 300 and moving the initial section along the rail unit 300;
A clamping part 600 provided in the substrate mounting part 200; And
Including; a wire portion 700 formed to be coupled to and disengaged from the clamping portion 600 to transfer the substrate mounting portion 200,
The clamping part 600,
A clamping part body 610 fastened to the substrate mounting part 200;
A push roller 620 that is rotatably fastened to the clamping part body 610 and fastened to the pressing block 450 of the loading part 400;
A rotating roller that has an assembly shaft 631 on one side and is fastened to the clamping part body 610 so as to be rotatable about the assembly shaft 631, and pressurized contact with the operation block 460 of the loading part 400 Rotating bracket 630 having 632; And
Containing, a substrate transfer facility; an elastic support part (640) for elastically supporting the rotation bracket (630) with respect to the clamping part body (610). The method of claim 7,
The clamping part body 610,
It has a first grip groove 611 on one side,
The rotation bracket 630,
It is formed to correspond to the first grip groove 611, and having a second grip groove 635a formed to be coupled to and disengaged from the wire portion 700 together with the first grip groove 611, Substrate transfer facility. The method of claim 8,
The clamping part 600,
The first operation in which the rotating roller 632 is pressed by the operation block 460 and the first and second grip grooves 611 and 635a are separated from the initial state and disengaged from the wire part 700 state; And
The pressing force of the operation block 460 is removed, the rotating roller 632 is returned by the elastic support part 640, and the wire part 700 between the first and second grip grooves 611 and 635a Containing a; a second operating state is coupled, substrate transfer equipment. The method of claim 7,
The clamping part body 610,
It is spaced apart from the assembly shaft 631 and has a long-hole guide hole 613 that is linked to the rotation bracket 630,
The rotation bracket 630,
A moving shaft 634 that is fastened to the guide hole 613 and guides the rotational movement of the rotation bracket 630 around the assembly shaft 631; And
A link block 612 that interferes in contact with the linker unit 470 of the loading unit 400; including, a substrate transfer facility.

Images