TWI797534B - Substrate conveying equipment for vertical continuous gilding equipment - Google Patents

Abstract

The present invention provides a substrate conveying equipment for continuously conveying substrates arranged in a vertical direction in a gilding section. The substrate conveying equipment includes a main frame, a substrate mounting part, a rail part, a loading part, a clamping part, and a metal wire part. The substrate mounting part is used to mount a substrate. The rail part is arranged on the main frame and is used to provide a conveying path for the substrate mounting part. The loading part is used to load the substrate on the rail part so that the substrate is conveyed along the initial section of the rail part. The clamping part is arranged on the substrate mounting part. The metal wire part may be combined with and released from the clamping part and is used to convey the substrate mounting part. The substrate conveying equipment of the present invention improves the gilding quality and reduces the gilding deviation between substrates.

Description

Substrate transfer equipment for vertical continuous gold plating equipment

The present invention relates to a substrate transfer device, and more particularly, to a substrate transfer device for continuously transferring substrates arranged in a vertical direction in a gold plating section.

A vertical continuous plating apparatus (vertical continuous plating, VCP) is used as an apparatus for plating a plate-shaped substrate such as a printed circuit board (PCB). The vertical type continuous gold plating equipment transfers the substrate while being dipped in the gold plating tank extending along the transfer direction, and gold-plates the surface of the substrate, etc.

In the above-mentioned vertical continuous gold plating equipment, a substrate transfer equipment is used to transfer the substrate to the gold plating section. The substrate transfer equipment continuously transfers a plurality of substrates at predetermined intervals, and currently, a transfer method using a chain is widely used.

However, at present, various problems have emerged in the above-mentioned chain transfer method. Typically, when the chain is used for a long period of time, deformation occurs, and thus, the gap between the substrates cannot be kept constant in the plating section. In addition, predetermined pulsation or vibration occurs in the structural characteristics of the chain, and such pulsation or the like adversely affects the quality of the gold plating. The above-mentioned problems will eventually lead to a reduction in the quality of gold plating on the substrate, and may cause irregular gold plating deviations. In particular, recent electronic devices and the like pursue extreme thinning and require high precision, and the quality of gold plating on substrates becomes more important.

Thus, new transfer methods such as Korea Authorized Patent No. 10-2030399 (name of invention: pendant transfer device for gold-plating), Korea Authorized Patent No. 10-1434414 (name of invention: pendant transfer device for gold-plating device) have been proposed, but Its practicality is not high.

An object of the present invention is to provide a substrate transfer facility for continuously transferring substrates arranged in a vertical direction in a gold plating section.

In addition, it is an object of the present invention to provide a substrate transfer device that can significantly reduce pulsation, vibration, etc., and can maintain a constant interval between substrates during substrate transfer.

Furthermore, an object of the present invention is to provide a substrate transfer facility capable of improving the quality of gold plating on a substrate and reducing variation in gold plating between substrates.

According to one embodiment of the present invention, the present invention can provide substrate transfer equipment, the above substrate transfer equipment continuously transfers the substrates arranged in the vertical direction in the gold plating section, the above substrate transfer equipment includes: a main frame; a substrate mounting part for mounting the substrate The track part is configured on the above-mentioned main frame and is used to provide the transfer path of the above-mentioned substrate installation part; the loading part is used to load the above-mentioned substrate on the above-mentioned track part, so that the above-mentioned substrate is transferred along the initial section of the above-mentioned track part; the clamping part, It is provided on the above-mentioned substrate mounting part; and the metal wire part can be connected and released from the above-mentioned clamping part, and is used for transferring the above-mentioned substrate mounting part.

Compared with the conventional chain and belt methods, the substrate transfer equipment of the embodiment of the present invention can reduce the pulsation and shaking of the substrate during the transfer process through the wire-based transfer method. Thus, the quality of gold plating on the substrate can be improved.

Moreover, the substrate transfer equipment according to the embodiment of the present invention can reduce the distance between the substrates during the gold plating process, and can maintain the initially set distance through the rigidity of the wire. Thereby, variation in gold plating between substrates can be reduced, and a part of it can contribute to productivity improvement.

Embodiments of the present invention will be described below with reference to the drawings. However, the following examples are used to help understand the present invention, and the scope of the present invention is not limited to the following examples. The following embodiments are provided to fully explain the present invention to those skilled in the art to which the present invention pertains, and detailed descriptions of known structures that are judged to make the technical idea of the present invention unclear will be omitted.

Fig. 1a is a perspective view of main parts of a substrate transfer device according to an embodiment of the present invention. Fig. 1b is a front view of the substrate transfer device shown in Fig. 1a. Fig. 1c is a side view of the substrate transfer apparatus shown in Fig. 1a. Fig. 1d is a top view of the substrate transfer device shown in Fig. 1a.

For convenience, taking the coordinate axes shown in FIG. 1a as a reference, the x-axis direction is the left-right direction, the y-axis direction is the front-rear direction, and the z-axis direction is the up-down direction.

Referring to FIG. 1 a to FIG. 1 d , the substrate transfer device 10 of this embodiment can be used to transfer a substrate 1 .

The substrate 1 may include a printed circuit board (printed circuit board, PCB).

The substrate transfer device 10 can be used for plating the substrate 1 . Alternatively, the substrate 1 can be transferred through the substrate transfer device 10 and be gold-plated. For example, the substrate 1 can be transferred through the substrate transfer device 10 and processed through copper or copper alloy (copper alloy) gold plating.

However, the substrate transfer facility 10 is not limited to gold plating or the like. For example, the substrate transfer equipment 10 can be widely used in fields and applications where the substrates 1 arranged vertically are transferred on a predetermined plane and subjected to predetermined processing, and precise control of vibration and spacing is required.

In addition, "gold plating" described in this specification basically refers to electroplating, but does not exclude other known forms of gold plating such as molten metal immersion plating, thermal spraying, evaporation plating, and cathodic spraying. And, depending on the situation, various surface treatment processes can be widely included.

Depending on circumstances, the substrate transfer apparatus 10 may constitute a part of a gold plating apparatus. That is, the substrate transfer facility 10 can transfer the substrate 1 within the gold plating facility, and can constitute a part of the gold plating facility. For example, the above-mentioned gold plating equipment may include equipment for vertically erecting the substrate 1 to transfer it, and applying current to the surface of the substrate 1 or the like to perform gold plating. For reference, in the technical field to which the present invention belongs, this kind of gold plating equipment is called a vertical continuous plating equipment (vertical continuous plating, VCP).

Overall, the substrate transfer device 10 of this embodiment may include: a main frame 100; a substrate mounting part 200 for mounting the substrate 1; a rail part 300 for providing a transfer path for the substrate mounting part 200; a loading part 400 and an unloading part 500, used for loading and unloading substrates from the rail portion 300; the clamping portion 600 is arranged on the substrate mounting portion 200 and can be combined with the wire portion 700; and the wire portion 700 is connected with the clamping portion 600 The combination is used to transfer the board mounting part 200 to one side (left side in the figure).

Looking at the brief operation, the substrate 1 is mounted on the substrate mounting part 200 , and the substrate mounting part 200 is arranged at the initial position (the right end in the figure). Next, the loading part 400 is fastened to the clamping part 600 , and the substrate mounting part 200 passes through the flat plate 472 provided on the loading part 400 and is transferred to one side (left side in the figure) along the rail part 300 . When the substrate mounting part 200 is moved to one end (the left end in the figure) of the loading part 400 , the clamping part 600 is fastened to the wire part 700 , and the clamping part 600 is released from the loading part 400 .

Next, the substrate mounting part 200 is transferred to one side (the left side in the figure) through the metal wire part 700 , and during the transfer process, gold plating can be performed through a prescribed gold plating equipment. For reference, in Fig. 1a etc., the gold plating equipment is omitted. When the substrate mounting part 200 is moved to one end (the left end in the figure) of the wire part 700 , the unloading part 500 is fastened to the clamp part 600 , and the clamp part 600 is released from the wire part 700 . Then, the unloading unit 500 transfers the substrate mounting unit 200 toward one end (the left end in the drawing) of the rail unit 300 .

After the unloading section 500, the substrate 1 may undergo necessary subsequent processes. For example, the substrate 1 can be passed to the next process after being washed with water, and the substrate mounting part 200 can be separated from the substrate 1 and restored to its original position. However, in the present invention, the steps after the unloading unit 500 are not particularly limited.

The above-described operations can be performed simultaneously and multiple times for a plurality of substrate mounting units 200 or substrates 1 . That is, the substrate transfer facility 10 may include a plurality of substrate mounting units 200 , and the above-described operations may be performed multiple times for each of the substrate mounting units 200 at the same time.

The substrate transfer device 10 described above has a feature of transferring the substrate 1 through the metal wire part 700 during the gold plating process. Vibration or pulsation can be reduced by the transfer method of the wire part 700 , and thus the distance between the substrate mounting parts 200 can be kept constant. On the other hand, this can help to reduce the space between the substrate mounting parts 200 and reduce the variation of gold plating among the respective substrates 1 .

Each structure of the substrate transfer apparatus 10 described above will be described in more detail below.

The substrate transfer device 10 of this embodiment may include a main frame 100 .

The main frame 100 may form the overall appearance of the substrate transfer apparatus 10 and provide a support structure for mounting structural components. The main frame 100 may be formed of a skeleton structure, and its structure or shape is not particularly limited as long as it has prescribed rigidity and can provide a supporting structure.

The substrate transfer device 10 of this embodiment may include a rail portion 300 disposed on the main frame 100 .

The rail portion 300 basically extends in the left-right direction on the upper portion of the main frame 100 . In the case of the present embodiment, the rail part 300 may be illustrated as an additional part distinguished from the main frame 100 , and the rail part 300 may be integrally formed on the main frame 100 according to circumstances.

The rail part 300 may have a predetermined cross-sectional shape and extend left and right to provide a moving path of a rail bracket described later.

As needed, the rail part 300 may be formed of a pair spaced front and rear. That is, the rail part 300 may include: a front rail 310 ; and a rear rail 320 extending left and right corresponding to the front rail 310 at a predetermined interval along the rear of the front rail 310 . In the above situation, the front rail 310 can provide a transfer path for gold-plating the substrate 1 , and the rear rail 320 can be used to restore the substrate mounting part 200 to the original position again.

Fig. 2a is an enlarged perspective view of the loading part shown in Fig. 1a. Fig. 2b is a front view of the loading part shown in Fig. 2a. Fig. 2c is a bottom perspective view of the sliding unit shown in Fig. 2a.

Referring to FIGS. 2 a to 2 c , the substrate transfer device 10 of this embodiment may include a loading part 400 .

The loading part 400 may be disposed substantially at a side (right side) area of the main frame 100 corresponding to an initial position (right side end in the drawing) of the substrate mounting part 200 . The loading unit 400 can transfer the substrate mounting unit 200 disposed at the initial position to one end (the left end in the drawing) of the wire unit 700 . When there are a plurality of substrate mounting parts 200 , the loading part 400 can sequentially transfer each substrate mounting part 200 to the wire part 700 . Each substrate mounting part 200 can be properly spaced and arranged at a predetermined interval through the loading part 400 .

Specifically, the loading part 400 may include a fixed track 410 and a moving track 420 .

The fixed rail 410 can extend left and right, and can be fastened to the main frame 100 . The fixing rail 410 can be fixed on the main frame 100 . The moving track 420 can extend left and right, and can be fastened to the fixed track 410 . Wherein, the moving rail 420 is fastened to the fixed rail 410 in a manner that can slide along the fixed rail 410 .

For reference, the sliding of the moving rail 420 relative to the fixed rail 410 can be passively realized through the connection unit 470 described later.

On the other hand, the loading unit 400 may include a sliding unit 430 and a lifting unit 440 .

The sliding unit 430 is fastened to the moving rail 420 in a manner to be slidable along the moving rail 420 . The sliding unit 430 may have a prescribed driving unit and may move back and forth relative to the moving rail 420 .

The lifting unit 440 is fastened to the sliding unit 430 in a vertically slidable manner. The lifting unit 440 may have a prescribed driving unit and can move up and down relative to the sliding unit 430 .

For reference, the above-mentioned driving unit may include known driving units such as motors and actuators, and the driving units of the sliding unit 430 and the lifting unit 440 may be integrated or separated as required. Moreover, in the case of this embodiment, the sliding unit 430 and the lifting unit 440 can be substantially in the form of a square frame or a plate, and the forms of the sliding unit 430 and the lifting unit 440 are not limited thereto, and can have various forms as required.

On the other hand, the loading part 400 may include a pressurizing block 450 .

The pressurizing block 450 can be configured on the lifting unit 440 . In the case of the present embodiment, the pressurizing block 450 is basically inclined toward the front from the bottom surface part of the lifting unit 440 .

The pressing block 450 may include a placement groove 451 . The placement groove 451 may be a groove recessed from a lower portion toward an upper side of the pressing block 450 . The placement groove 451 can pressurize and support the push roller 620 of the clamping part 600 which will be described later. Thus, preferably, the placement groove 451 may have a shape, size, etc. corresponding to the push roller 620 .

The press block 450 may include an inclined surface 452 as needed. The inclined surface 452 may extend from the lower part of the slot 451 toward the lower end of the pressing block 450 in a tapered manner. Accordingly, the width of the opening at the lower end of the pressurizing block 450 can be formed to be larger than the width of the placement groove 451 by a predetermined degree. The push roller 620 may be guided by the inclined surface 452 and stably fastened to the placement groove 451 .

On the other hand, the loading part 400 may include a working block 460 .

The working block 460 can be arranged on the lifting unit 440 so as to be adjacent to the pressurizing block 450 . In the case of the present embodiment, the working block 460 is arranged at a distance from the bottom surface part of the lifting unit 440 along the rear of the pressurizing block 450 .

The working block 460 can be arranged so as to correspond to the rotating roller 632 of the clamping unit 600 described later, and can pressurize and support the rotating roller 632 according to the operation of the elevating unit 440 . In addition, the working block 460 can apply pressure to the rotating roller 632 to rotate it, so that the clamping part 600 can be combined with or released from the wire part 700 . This will be described later in the clamping unit 600 .

For the above work, the working block 460 can move up and down through a prescribed driving unit. The driving unit of the working block 460 can be distinguished from the lifting unit 440, and can make the working block 460 move up and down independently.

According to needs, the working block 460 may include a horizontal surface 461 and a vertical surface 462 . The horizontal plane 461 can extend substantially horizontally from the bottom surface of the lifting unit 440 , and the vertical plane 462 can extend vertically from one end of the horizontal plane 461 (the front end in the figure) instead. In the above situation, the horizontal surface 461 can apply pressure to the upper surface of the rotating roller 632, and the vertical surface 462 contacts the rolling surface of the guiding rotating roller to realize stable pressurization.

In the above case, the working block 460 may further include an inclined surface 463 . The inclined surface 463 can be cut so that the lower end of the vertical surface 462 is inclined to a predetermined degree. When the turning roller 632 enters toward the lower end of the vertical surface 462 of the turning roller 632, the inclined surface 463 can make it enter smoothly.

On the other hand, the loading part 400 may include a connection unit 470 .

The connecting unit 470 can be disposed on the bottom side of the moving rail 420 (the left side in the figure), and fastened to the moving rail 420 . The connecting unit 470 can be fixedly arranged on the moving track 420 , so that the connecting unit 470 and the moving track 420 can move left and right together along the fixed track 410 . More specifically, as the moving rail 420 moves along one side (left side in the figure) together with the sliding unit 430 , the moving rail 420 can move left and right relative to the fixed rail 410 .

The connecting unit 470 may include a connecting bracket 471 , a flat plate 472 and an actuator 473 . The connecting bracket 471 can be installed on the bottom surface of the moving track 420 , and the flat plate 472 and the actuator 473 can be fastened to the connecting bracket 471 . Wherein, the flat plate 472 can be fastened to the connecting bracket 471 through the first hinge 472a, and the actuator 473 can make the working arm fasten to the flat plate 472 through the second hinge 473a. The first hinge and the second hinge may form vertical rotation axes, respectively, and may be separated from each other by a predetermined interval.

According to the combination structure, the plate 472 can be rotated to one side around the first hinge 472a to protrude forward to a certain extent, or rotated in the opposite direction through the actuator 473 to be arranged substantially in the left-right direction. In the former case, the flat plate 472 may contact and interfere with the connecting block 612 of the holding part 600 described later, and in the latter case, the flat plate 472 may be separated from the connecting block 612 . Therefore, the former case is called "interference state", and the latter case is called "non-interference state".

The operation of the connecting unit 470 will be described through the clamping portion 600 described later.

On the other hand, the substrate transfer apparatus 10 of this embodiment may include an unloading part 500 .

Referring to FIG. 1a etc., the unloading part 500 may be disposed substantially on the opposite side (the left end in the figure) of the loading part 400 . The unloading part 500 can release the substrate mounting part 200 transferred through the wire part 700 from the wire part 700 . That is, the substrate mounting part 200 can be detached from the wire part 700 , can be supported by the unloading part 500 , and can be properly transferred to the next process through the unloading part 500 .

The unloading part 500 differs in configuration or a part of functions, not only that, but is basically the same as or similar to the loading part 400 described above, and thus, a detailed description thereof will be omitted.

Fig. 3a is an enlarged perspective view of the substrate mounting part shown in Fig. 1a. Fig. 3b is a front view of the board mounting part shown in Fig. 3a.

Referring to FIGS. 3 a to 3 b , the substrate transfer device 10 of this embodiment may include a substrate installation part 200 .

The substrate mounting part 200 is provided on the rail part 300 so as to be movable along the rail part 300 . In addition, the substrate 1 can be mounted on the substrate mounting portion 200 . The board|substrate 1 can move along the rail part 300 in the state mounted in the board|substrate mounting part 200, and can carry out a gold-plating process through predetermined gold-plating equipment.

A plurality of substrate mounting parts 200 may be provided. In FIG. 1a etc., for convenience, only one substrate mounting portion 200 is provided at both ends, but a plurality of substrate mounting portions 200 may be provided. The plurality of substrate mounting parts 200 can be arranged adjacent to each other on the left and right, and can be transported along the rail part 300 . Thus, the gold plating process can be performed continuously or simultaneously and multiple times in a plurality of board mounting parts 200 .

On the other hand, the substrate mounting part 200 may include a rail mounting bracket 210 .

The rail mounting bracket 210 may be basically disposed on the upper portion of the substrate mounting portion 200 and may extend along one side (rear) toward the rail portion 300 .

The rail mounting bracket 210 includes a plurality of rollers 211 , 212 in a rollable manner along the rail portion 300 . Preferably, the rail mounting bracket 210 may basically include: a pair of upper rollers 211 rolling in contact with the upper side of the rail part 300 ; and a pair of lower rollers 212 rolling in contact with the lower side of the rail part 300 . The pair of upper rollers 211 and lower rollers 212 may be arranged at a distance from each other to the left and right.

In addition, the upper roller 211 can be arranged to contact and roll on one surface (for example, the front surface) of the rail part 300 , and the lower roller 212 can be arranged to contact and roll on the opposite surface (for example, the rear surface) of the rail part 300 . Thus, the rail mounting bracket 210 can also serve as a function of supporting the substrate mounting portion 200 on the rail portion 300 .

On the other hand, the substrate mounting part 200 may include a substrate mounting frame 220 .

The substrate mounting frame 220 may extend from the rail mounting bracket 210 along the front so as to provide a support structure for mounting the substrate 1 . The substrate mounting frame 220 can be embodied in the form of a frame, a plate, etc. of a predetermined shape and structure, and in the case of this embodiment, it is substantially in the form of a square frame. However, the form of the substrate mounting frame 220 is not limited thereto, and can be appropriately changed as needed.

Also, the substrate mounting frame 220 may include an upper clamper 221 and a lower clamper 222 for clamping the substrate 1 . The plurality of upper grippers 221 may be spaced left and right on the upper side of the board mounting frame 220 , and the plurality of lower grippers 222 may be spaced left and right on the lower side of the board mounting frame 220 .

Although not shown, the board mounting part 200 may include a vibration generating unit as needed.

The vibration generating unit may be arranged on one side of the substrate mounting part 200 , and may apply fine vibrations of a predetermined frequency to the substrate mounting part 200 . For example, the vibration generating unit can be installed on one side of the rail mounting bracket 210 and mechanically contacted with the rail mounting bracket 210 to make the rail mounting bracket 210 or the substrate 1 supported by it vibrate finely. However, as long as the vibration generating unit can transmit a predetermined vibration to the substrate 1, it can be installed or arranged in more positions, and the installation position is not limited to the rail mounting bracket 210 and the like. The vibration generating means can apply fine vibrations to the substrate 1, and allow the gold plating solution to flow properly through the fine holes formed in the substrate 1, thereby contributing to the improvement of the quality of the gold plating.

Fig. 4a is an enlarged perspective view of the clamping portion shown in Fig. 1a. Fig. 4b is a side view of the clamping portion shown in Fig. 4a.

Referring to FIG. 4 a to FIG. 4 b , the substrate transfer device 10 of this embodiment may include a clamping part 600 .

The clamping part 600 can be mounted on one side of the substrate mounting part 200 . More specifically, as shown in the figure, the clamping portion 600 can be disposed on the upper surface of the above-mentioned rail installation bracket 210 and can be installed on the rail installation bracket 210 . Thus, the clamping part 600 can move together with the substrate mounting part 200 .

A plurality of clamping parts 600 can be formed corresponding to a plurality of board mounting parts 200 . That is, the plurality of substrate mounting parts 200 may include each clamping part 600 .

The clamping part 600 can be fastened to the loading part 400 or the unloading part 500 to be transferred through the loading part 400 or the unloading part 500 , or can be fastened to the wire part 700 to be transferred through the wire part 700 . Preferably, the clamping part 600 can be fastened to the wire part 700 at least in the gold-plating section, so that the clamping part 600 or the substrate mounting part 200 can be transported through the metal wire part 700 in the gold-plating section.

On the other hand, the clamping part 600 may include a clamping part main body 610 .

The clip body 610 can be fastened to the rail mounting bracket 210 . The clamping unit main body 610 may be in the form of a predetermined frame, a bracket, a main body, etc. to which each component of the clamping unit 600 is supported. However, the form of the clamping portion 600 is not limited thereto, and can also be modified into various forms having the same or similar functions.

A first clamping groove 611 can be formed in the clamping part main body 610 . The first clamping groove 611 can be basically formed at the rear end of the clamping part main body 610, and the part corresponding to the metal wire part 700 can be in the shape of a circle or an arc. The first clamping groove 611 may correspond to the second clamping groove 635 a described later to provide a bonding structure for holding the metal wire part 700 .

In addition, the clip body 610 may include a connection block 612 . The connection block 612 may be formed by protruding from the rear end of the holding part body 610 toward the upper side by a predetermined height. The connecting block 612 may interfere with the above-mentioned connecting unit 470 so that the moving rail 420 or the substrate mounting part 200 may move. This is explained through the working of the clamping part 600 .

The clip body 610 may include a guide hole 613 . The guide hole 613 can pass through the clamping part main body 610 left and right, and can extend in the shape of a long hole according to the moving track of the moving shaft 634 described later. Thus, the guide hole 613 can guide the movement of the movement shaft 634 .

On the other hand, the clamping part 600 may include a push roller 620 .

The push roller 620 can be disposed at the front end of the clamping part main body 610 and is rotatably supported by the clamping part main body 610 . The push roller 620 may basically have a rotation axis in a front-rear direction, and may be fastened to the clamping part main body 610 .

The push roller 620 may be fastened to the pressing block 450 of the loading part 400 described above. That is, the pressing block 450 can be lowered through the lifting unit 440 so that the push roller 620 is pressurized and supported by the placement groove 451 , thereby being fastened to the push roller 620 . The inclined surface 452 at the lower end of the pressing block 450 can correct the fastening position of the placement groove 451 and the push roller 620 .

Through the combination between the pushing roller 620 and the pressing block 450 , the substrate mounting part 200 can move left and right together with the sliding unit 430 . That is, the push roller 620 may function as a supporting unit for the left and right movement of the substrate mounting part 200 .

On the other hand, the clamping part 600 may include a rotating bracket 630 .

The rotation bracket 630 may be rotatably fastened to the clamping part main body 610 with a predetermined distance in front and rear of the push roller 620 . Specifically, the rotating bracket 630 may have an assembly shaft 631 at the rear end, through which the assembly shaft 631 may be rotatably fastened to the clamping part main body 610 . The assembly shaft 631 may basically form a rotation shaft in a left-right direction.

Also, the rotating bracket 630 may include a rotating roller 632 . The rotating roller 632 may have a roller shaft 632 a in a left-right direction, and is rotatably fastened to the front end of the rotating bracket 630 . For reference, this is in contrast to the aforementioned push roller 620 having a rotation axis in the front-rear direction.

The rotating roller 632 can press and move through the working block 460 . That is, the rotary roller 632 can be moved by being pressed downward by the work block 460 , or released and returned upward. The movement of the rotating roller 632 can be realized through the rotation of the rotating bracket 630 centered on the assembly shaft 631 .

Wherein, the horizontal surface 461 of the working block 460 contacts the upper side of the pressing roller 632, and the vertical surface 462 contacts the front of the guiding roller 632, so that a stable pressing operation can be performed. Moreover, the inclined surface 452 at the lower end of the working block 460 can make the initial contact between the working block 460 and the rotating roller 632 be realized smoothly.

Moreover, the rotating bracket 630 may include a spring shaft 633 and a moving shaft 634 . The spring shaft 633 is used to fasten an elastic support portion 640 described later, and is arranged at a distance along the lower side of the roller shaft 632 a to form a rotation shaft in the left-right direction according to an example.

The moving shaft 634 can be arranged at a predetermined interval from the spring shaft 633 , and can be fastened to the above-mentioned guide hole 613 . The moving shaft 634 can move according to the guide hole 613 corresponding to the movement of the rotating roller 632 , thereby guiding the rotating work of the rotating roller 632 or the rotating bracket 630 .

Also, the rotating bracket 630 may include a jig 635 . The clip 635 can basically extend downward from the rear end of the rotating bracket 630 . The clamp 635 may include a second clamping groove 635a, and a portion of the second clamping groove 635a corresponding to the above-mentioned first clamping groove 611 may be in the shape of a circle or an arc. The clamping part 600 can press and contact the metal wire part 700 between the first clamping groove 611 and the second clamping groove 635 a, so as to be fastened to the metal wire part 700 .

On the other hand, the clamping part 600 may include an elastic supporting part 640 .

The elastic supporting part 640 can elastically support the rotating bracket 630 between the clamping part main body 610 and the rotating bracket 630 . One end (front end) of the elastic support part 640 is rotatably fastened to the clamping part main body 610 , and the opposite end (rear end) is rotatably fastened to the rotating bracket 630 .

The elastic supporting portion 640 can elastically support the rotating bracket 630 in a manner that the first clamping groove 611 and the second clamping groove 635 a are close to each other. Thus, in a state where no external force is applied, the first clamping groove 611 and the second clamping groove 635a are elastically supported along the direction of approaching each other, so that they can be fastened to the wire part 700 or the like.

Moreover, in the above state, when an external force is applied (that is, when the working block 460 exerts pressure on the rotating roller 632 ), the elastic supporting portion 640 can be elastically compressed and deformed through the external force. In this case, the first clamping groove 611 and the second clamping groove 635a can move along directions spaced apart from each other, so as to be detached from the metal wire portion 700 and the like.

According to requirements, the elastic supporting part 640 may include: a cylinder 641 fastened between the front end of the clamping part main body 610 and the spring shaft 633 ; and a compression spring 642 elastically supporting the front and rear ends of the cylinder 641 . In addition, although not shown, the compression spring 642 and the like may be covered with a cover member for blocking the inflow of foreign matter or the like.

Fig. 4c is a diagram of the first working state of the clamping part shown in Fig. 4a.

Figure 4c shows a state where no external force is applied. Referring to FIG. 4c, in the first working state, the elastic support portion 640 elastically supports the rotating bracket 630 so that it is arranged along the direction in which the first clamping groove 611 and the second clamping groove 635a approach each other. In this state, the first clamping groove 611 and the second clamping groove 635 a can be in pressure contact with the metal wire part 700 , so that they can be fastened to the metal wire part 700 .

The above-mentioned first working state can basically be maintained in the movement interval from the clamping part 600 to the substrate mounting part 200 based on the metal wire part 700 . Alternatively, the first working state can be maintained in the moving interval where the substrate 1 is gold-plated. That is, the clamping part 600 or the substrate mounting part 200 can be fastened to the metal wire part 700 through the first working state, and can be transferred and gold-plated according to the movement of the metal wire part 700 .

Fig. 4d is a diagram of the second working state of the clamping part shown in Fig. 4a.

FIG. 4 d shows a state in which pressure is applied to the roller 632 through the working block 460 . Referring to Fig. 4d, in the second working state, the rotating roller 632 can pass through the working block 460 to apply a predetermined degree of pressure downward, thus, the rotating bracket 630 can rotate to a predetermined degree centered on the assembly shaft 631 (counterclockwise in the figure). direction). Furthermore, the jig 635 rotates in the corresponding direction (counterclockwise in the figure) centered on the assembly axis 631 , and the first clamping groove 611 and the second clamping groove 635 a are spaced apart so that the wire part 700 can be released from the connection.

The above-mentioned second operating state may be maintained in the transfer section of the loading section 400 or the unloading section 500 other than the transfer section of the wire section 700 . Alternatively, the second working state may be maintained in the transfer interval before and after the gold plating treatment. That is, the clamping part 600 or the substrate mounting part 200 can be transferred to the front end of the metal wire part 700 through the second working state, or can be separated from the rear end of the metal wire part 700 .

On the other hand, referring to the above-mentioned FIG. 1a and the like, the substrate transfer apparatus 10 of this embodiment may include a wire part 700 .

The wire part 700 can be supported by the main frame 100, and can move the substrate mounting part 200 left and right. The wire part 700 can basically be used as a transfer unit of the substrate 1 in the gold plating process section of the substrate 1 .

The metal wire part 700 may be formed of a metal wire made of flexible material. Preferably, the wire portion 700 may be formed of a stainless steel wire that has corrosion resistance and can maintain an appropriate tension according to the weight of the substrate 1 and the like. However, the material of the wire portion 700 is not limited to the illustrated stainless steel, and may be replaced by other materials having the same or similar properties as the case may be.

The metal wire portion 700 can be transported along the longitudinal direction (the left-right direction in the drawing). Thereby, the board mounting part 200 etc. fastened to the wire part 700 can be transferred along the wire part 700, and predetermined gold plating can be performed during transfer.

Although not explicitly shown, the metal wire portion 700 can be moved in the longitudinal direction through a predetermined driving unit such as a traction wheel. In addition, the metal wire part 700 may form a closed loop and be conveyed along the longitudinal direction, and a tension maintaining unit for maintaining an appropriate tension may be added as necessary. However, in this embodiment, there are no particular limitations on the transfer path or form of the metal wire portion 700 .

Compared with the conventional method, the above-mentioned wire part 700 can reduce the pulsation when moving, and can help reduce the space between the substrate 1 or the substrate mounting part 200 .

Specifically, the system that has been widely used in the past is the system using a chain. In this case, due to the structural characteristics of the chain, a predetermined pulsation occurs when the chain moves. In addition, there is a structure in which the hanger corresponding to the board mounting portion is simply placed on the chain and transferred, so that the position of the hanger is deformed after driving for a long time. In addition, it is known that a belt is used in other ways, but the belt made of urethane material or the like is stretched, so it cannot be properly used in the related technical field. The substrate transfer apparatus 10 of the present embodiment introduces a new transfer structure using the wire part 700 to solve such conventional problems.

The operation of the above-mentioned substrate transfer apparatus 10 will be described below.

Fig. 5a is a diagram of a first working state of the substrate transfer device shown in Fig. 1a.

For convenience, in Fig. 5a and the like, the description will focus on the operation at the loading section 400 site. The work at the site of the unloading unit 500 can be performed in the same or similar manner in the reverse order.

In addition, in FIG. 5a and the like, it is assumed that a plurality of substrates 1-1, 1-2 are continuously loaded, and the process of newly loading the second substrate 1-2 is centered on the state where the first substrate 1-1 is loaded and transferred first. Be explained. Also, for convenience, the structural elements corresponding to the transfer of the first substrate 1-1 are referred to as the first substrate mounting part 200-1, etc., and the structural elements corresponding to the transfer of the second substrate 1-2 are described through similar The mode is referred to as the second substrate mounting part 200-2 or the like.

Referring to FIG. 5a, in the process of mounting the first substrate 1-1 on the first substrate mounting part 200-1 and transferring it through the wire part 700, the second substrate mounting part 200-2 for mounting the second substrate 1-2 is configured in the initial position.

If the second substrate installation part 200 - 2 is disposed at the initial position, the sliding unit 430 will move to the corresponding position, and the pressing block 450 will descend. Thus, the pressure block 450 is fastened to the second clamping portion 600 - 2 (ie, the push roller 620 ) disposed on the second substrate mounting portion 200 - 2 . Next, the working block 460 descends to apply pressure to and support the second clamping part 600 - 2 (ie, the rotating roller 632 ) downward. That is, the second clamping part 600-2 may have a second working state as shown in FIG. 4d.

As mentioned above, the first clamping portion 600 - 1 disposed on the first substrate mounting portion 200 - 1 is in contact with the connecting unit 470 . Specifically, the flat plate 472 of the connection unit 470 rotates on the moving path of the first clamping part 600 - 1 , and one side of the first clamping part 600 - 1 (ie, the connection block 612 ) contacts the flat plate 472 . Thus, the connection unit 470 can interfere with the first clamping part 600 - 1 , and move along the metal wire part 700 together with the first clamping part 600 - 1 .

And, the moving rail 420 and the second board mounting part 200 - 2 are pulled along one side (the left side in the drawing) together with the connection unit 470 .

Fig. 5b is a diagram of a second working state of the substrate transfer device shown in Fig. 1a.

Referring to FIG. 5b, if the first substrate mounting part 200-1 moves to the set predetermined position, the sliding unit 430 is driven so that the second substrate mounting part 200-2 moves toward the side adjacent to the first substrate mounting part 200-1. location transfer. Wherein, the second substrate mounting portion 200 - 2 is spaced apart from the first substrate mounting portion 200 - 1 at a predetermined distance, and can be basically arranged at the front end of the wire portion 700 .

Next, in the second substrate mounting part 200 - 2 , the second clamping part 600 - 2 can be fastened through the wire part 700 . Specifically, the working block 460 rises, so that the restriction of the second clamping part 600-2 (ie, the rotating roller 632) is released, and the second rotating bracket 630-2 rotates through the second elastic supporting part 640-2. Thus, the second clamping part 600 - 2 (ie, the clamp 635 ) is also fastened to the wire part 700 . That is, the second clamping part 600-2 transforms into the first working state as shown in FIG. 4c. In addition, the pressure block 450 also rises, so that the second substrate mounting part 200 - 2 is transferred through the wire part 700 .

As described above, the connection unit 470 is disengaged from the first clamping part 600-1. That is, the connection unit 470 rotates the flat plate 472 in the opposite direction, and the contact with the first holding part 600-1 is released. Thus, the first substrate mounting part 200 - 1 is transferred through the wire part 700 without interfering with the flat plate 472 .

Fig. 5c is a diagram of a third working state of the substrate transfer device shown in Fig. 1a.

Referring to FIG. 5c, next, the slide unit 430 returns to the initial position shown in FIG. 5a, and is in a standby state for the newly inputted third substrate mounting part 200-3. The sliding unit 430 is fastened to the third substrate installation part 200-3 in a manner similar to that of the second substrate installation part 200-2, so that the above described working process can be repeated.

And, the connecting unit 470 rotates again with the flat plate 472, the restoration of the sliding unit 430 and the movement of the second substrate mounting part 200-2 gradually approach the second clamping part 600-2, and the second clamping part 600-2 contact interference. Thus, similar to the above, the connection unit 470 can interfere with the second clamping part 600 - 2 , so that it can be moved along the wire part 700 .

As described above, the substrate transfer apparatus 10 according to the embodiment of the present invention can continuously transfer the substrates 1 arranged in the vertical direction in the gold plating section.

In particular, compared with the conventional chain and belt methods, the substrate transfer equipment 10 of the embodiment of the present invention can reduce the pulsation and shaking of the substrate during the transfer process through the wire-based transfer method. Thereby, the gold plating quality of the substrate 1 can be improved.

Moreover, the substrate transfer device 10 of the embodiment of the present invention can properly adjust the interval between the substrates 1 during the gold plating process, and the rigidity of the transmission line can maintain the initially set interval. Thereby, variation in gold plating between substrates 1 can be reduced, and productivity can be improved.

Above, the embodiments of the present invention have been described, as long as those with ordinary knowledge in the technical field to which the present invention belongs can add, change, delete, or Additions and other modifications and variations are made to the present invention, and these also belong to the protection scope of the present invention.

As follows: 1: Substrate 1-1: The first substrate 1-2: Second substrate 10: Substrate transfer equipment 100: main frame 200: Substrate mounting part 200-1: The first substrate installation part 200-2: Second substrate mounting part 200-3: The third substrate installation part 210: Rail mounting bracket 211: upper roller 212: lower roller 220: Substrate mounting frame 221: Upper gripper 222: Lower gripper 300: track department 310: front track 320: rear track 400:Loading department 410: fixed track 420:Move track 430: sliding unit 440: lifting unit 450: pressurized block 451: place slot 452: Inclined surface 460: work block 461: Horizontal plane 462: vertical plane 463: inclined surface 470: connection unit 471: connection bracket 472: tablet 472a: first hinge 473:Actuator 473a: Second hinge 500: unloading department 600: clamping part 600-1: The first clamping part 600-2: Second clamping part 610: clamping part main body 611: The first clamping groove 612: Connection block 613: guide hole 620: push roller 630: rotating bracket 631: Assembly shaft 632: Roller 632a: roller shaft 633: spring shaft 634: Move axis 635: fixture 635a: the second clip groove 640: elastic support part 641: cylinder / elastic support cylinder 642: Compression spring 700: Metal wire department x, y, z: coordinate axes

As follows: Fig. 1a is a perspective view of main parts of a substrate transfer device according to an embodiment of the present invention. Fig. 1b is a front view of the substrate transfer device shown in Fig. 1a. Fig. 1c is a side view of the substrate transfer apparatus shown in Fig. 1a. Fig. 1d is a top view of the substrate transfer device shown in Fig. 1a. Fig. 2a is an enlarged perspective view of the loading part shown in Fig. 1a. Fig. 2b is a front view of the loading part shown in Fig. 2a. Fig. 2c is a bottom perspective view of the sliding unit shown in Fig. 2a. Fig. 3a is an enlarged perspective view of the substrate mounting part shown in Fig. 1a. Fig. 3b is a front view of the board mounting part shown in Fig. 3a. Fig. 4a is an enlarged perspective view of the clamping portion shown in Fig. 1a. Fig. 4b is a side view of the clamping portion shown in Fig. 4a. Fig. 4c is a diagram of the first working state of the clamping part shown in Fig. 4a. Fig. 4d is a diagram of the second working state of the clamping part shown in Fig. 4a. Fig. 5a is a diagram of a first working state of the substrate transfer device shown in Fig. 1a. Fig. 5b is a diagram of a second working state of the substrate transfer device shown in Fig. 1a. Fig. 5c is a diagram of a third working state of the substrate transfer device shown in Fig. 1a.

none.

1: Substrate

10: Substrate transfer equipment

100: main frame

200: Substrate mounting part

300: track department

310: front track

320: rear track

400:Loading department

500: unloading department

600: clamping part

700: Metal wire department

x, y, z: coordinate axes

Claims (9)

A substrate transfer device, the substrate transfer device continuously transfers substrates arranged along a vertical direction in a gold-plating section, and the substrate transfer device includes: a main frame (100); a substrate installation part (200), used for installing a substrate (1); The track part (300), configured on the main frame (100), is used to provide the transfer path of the substrate installation part (200); the loading part (400), is used to load the substrate (1) on the track part (300) , the substrate (1) is transferred along the initial section of the track portion (300); the clamping portion (600) is arranged on the substrate mounting portion (200); and the metal wire portion (700) can be connected with the clamping portion (600) coupling and uncoupling for transferring the substrate installation part (200), wherein the loading part (400) includes: a fixed rail (410), fastened to the main frame (100); a moving rail (420), Fastened on the fixed track (410), capable of sliding along the fixed track (410); sliding unit (430), fastened on the moving track (420), able to slide along the moving track (420); lifting unit and The working block (460) is arranged adjacent to the pressurizing block (450), and applies pressure to the clamping part (600) to make it work. The substrate transfer device as described in claim 1, wherein the pressurizing block (450) includes: a placement groove (451), so that the bottom surface of the pressurizing block (450) is concave toward the upper side, and the clamping The push roller (620) of the part (600) is press-contacted; and the inclined surface (452), which extends obliquely at the lower end of the placement groove (451), is used to contact and guide the fastening of the push roller (620). The substrate transfer equipment as claimed in item 1, wherein the working block (460) includes: a horizontal surface (461), which extends along the horizontal direction on the bottom surface of the working block (460), and is arranged on the clamping part (600 ) of the upper surface of the roller (632) in press contact; and a vertical surface (462) extending downward from one side of the horizontal surface (461) for contacting and guiding the side of the front surface of the roller (632) . The substrate transfer equipment according to claim 1, wherein: the loading part (400) includes a connection unit (470) fastened to one side of the moving track (420), and the connection unit (470) includes: a connection bracket (471), fastened to the moving track (420); the flat plate (472), fastened to the connecting bracket (471), is formed in a manner capable of rotating around the upper and lower shafts, and is formed by the clamping portion (600) contact interference; and an actuator (473), fastened to the plate (472), for driving the plate (472) in rotation. The substrate transfer device as described in claim 4, wherein: the connection unit (470) includes: an interference state, the flat plate (472) is disturbed by the clamping part (600); and a non-interference state, the flat plate (472) Rotate to a predetermined degree in the interference state to separate the flat plate (472) from the clamping part (600), and in the interference state, the movement of the loading part (400) and the clamping part (600) are linked , in the non-interference state, the movement of the loading part (400) and the clamping part (600) is separated. A substrate transfer device, the substrate transfer device continuously transfers substrates arranged along a vertical direction in a gold-plating section, and the substrate transfer device includes: a main frame (100); a substrate installation part (200), used for installing a substrate (1); The track part (300), configured on the main frame (100), is used to provide the transfer path of the substrate installation part (200); the loading part (400), is used to load the substrate (1) on the track part (300) , the substrate (1) is transferred along the initial section of the track portion (300); the clamping portion (600) is arranged on the substrate mounting portion (200); and the metal wire portion (700) can be connected with the clamping portion (600) Combining and uncoupling are used to transfer the substrate installation part (200), wherein the clamping part (600) includes: a clamping part main body (610), fastened to the substrate installation part (200); The roller (620) is fastened to the clamping part main body (610) in a rotatable manner, and is fastened to the pressing block (450) of the loading part (400); the rotating bracket (630) has a The assembly shaft (631) is fastened to the clamping part main body (610) in a manner capable of rotating around the assembly shaft (631), and has a pressure contact with the working block (460) of the loading part (400). The rotating roller (632); and the elastic supporting part (640), relative to the clamping part main body (610), elastically supports the rotating bracket (630). The substrate transfer device as claimed in item 6, wherein: the clamping part main body (610) has a first clamping groove (611) on one side, The rotating bracket (630) includes a second clamping groove (635a), which is formed in a manner corresponding to the first clamping groove (611), and can be connected with the metal wire part (700) together with the first clamping groove (611). ) to combine or unbind. The substrate transfer device according to claim 7, wherein the clamping part (600) includes: a first working state, the roller (632) is pressed by the working block (460), the first clamping groove (611) , the second clamping groove (635a) is separated in the initial state, and the combination is released from the metal wire part (700); Through the recovery of the elastic supporting part (640), the metal wire part (700) is combined between the first clamping groove (611) and the second clamping groove (635a). The substrate transfer device as claimed in item 6, wherein: the clamping part main body (610) includes a long-hole-shaped guide hole (613), separated from the assembly shaft (631), and connected to the rotating bracket (630) Connected and combined, the rotating bracket (630) includes: a moving shaft (634), fastened in the guide hole (613), used to guide the rotation of the rotating bracket (630) centered on the assembly shaft (631) moving; and the connection block (612), disturbed by the contact of the connection unit (470) of the loading part (400).

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