KR100575111B1 - Loading and unloading apparatus of plating board - Google Patents

Loading and unloading apparatus of plating board Download PDF

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Publication number
KR100575111B1
KR100575111B1 KR1020040049610A KR20040049610A KR100575111B1 KR 100575111 B1 KR100575111 B1 KR 100575111B1 KR 1020040049610 A KR1020040049610 A KR 1020040049610A KR 20040049610 A KR20040049610 A KR 20040049610A KR 100575111 B1 KR100575111 B1 KR 100575111B1
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KR
South Korea
Prior art keywords
plating
conveyor belt
substrates
unit
substrate
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Application number
KR1020040049610A
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Korean (ko)
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KR20060000674A (en
Inventor
박용순
Original Assignee
주식회사 티케이씨
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Priority to KR1020040049610A priority Critical patent/KR100575111B1/en
Publication of KR20060000674A publication Critical patent/KR20060000674A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks

Abstract

The present invention relates to a loading and unloading apparatus for loading and unloading substrates to be plated in a process of plating a printed circuit board in a plating tank to transport the substrates to a plating tank and transporting and unloading the plated substrates in the plating tank, A plating apparatus for loading and unloading substrates onto a substrate in a plating bath for racking and transporting substrates one by one to a clamper, characterized in that the printed circuit boards (1) to be plated are cleaned, degreased and rinsed, A centering machine 3 for transferring and positioning the printed circuit boards 1 mounted on the injector 2 one by one, a circuit board 3 for positioning the substrates 1 positioned in the centering machine 3 by a clamper A first rail conveyor belt 5 for moving the substrate 1 along the rail 6 in units of a predetermined number of units stacked by the clamper 4, (7 Unit group of substrate units 100 transported through the first rail conveyor belt 7 and transferred to the plating tank 8 and transferred to the plating unit 8 in the plating unit 8, A transferring unit 10 for transferring the groups 100 of the plated substrates to the second rail conveyor belt 9 through the transferring unit 10 and the second rail conveying belt 9, (11).

Description

[0001] Loading and unloading apparatus of plating board [0002]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing the entire loading and unloading apparatus of a plating substrate according to the present invention,

Fig. 2 is a front view in the direction A in Fig. 1,

Fig. 3 is a side view in the direction C in Fig. 1,

Description of the Related Art [0002]

1: printed circuit board, 2: injector,

3: centering machine, 4: clamper,

5: racking part, 6: rail,

7: first conveyor belt, 8: plating vessel,

9: second conveyor belt, 10: transfer,

11: unloading machine, 12: guide rail,

100: substrate group.

The present invention relates to a plating and unloading apparatus for loading and unloading substrates to be plated in a process of plating a printed circuit board in a plating tank to transport the substrates to a plating tank and transporting and unloading the plated substrates in the plating tank .

When plating a synthetic resin substrate such as a printed circuit board, the substrate to be plated is first cleaned by cleaning, rinsing, rinsing, etc., and then the cleaned substrate is transferred to a plating bath using a loading device and a transfer The plating process is performed in the plating bath, and the substrate having been plated in the plating bath is moved to the post-treatment process by the unloading device.

Conventionally, a loading and unloading apparatus for a plating substrate used for plating a printed circuit board includes a loading unit for transferring substrates to be plated to a plating tank, a racking unit, and a transfer unit. There is a problem that the space occupied by the equipment is large due to the decrease of the production efficiency, the overflow of the labor force, and the occupied layout of each facility.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems and it is an object of the present invention to provide a compact, The present invention has an object of providing an apparatus for loading and unloading a plating substrate having both a competitiveness and a merchandise property.                         

In order to accomplish the above object, the present invention provides a method of manufacturing a semiconductor device, comprising: an injector for holding a printed circuit board to be plated after washing, degreasing and rinsing in a pretreatment process, A first rack conveyor belt for moving the substrate stacked by the clamper along the rails, a second rack conveyor belt for moving the substrate stacked by the clamper along the rails, A transfer unit for transferring the group of unit units transferred through the transfer unit to the plating unit and connecting the unit groups of the unit units of the plating unit in the plating unit to the second rail conveyor belt, And an unloading unit for taking over via the unloading unit.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows the entire plating and unloading apparatus according to the present invention. FIGS. 2 and 3 are front views in the direction A of FIG. 1, and are side views in the direction C of FIG.

The present invention relates to a method for plating a printed circuit board on a printed circuit board by plating a plate in a plating bath by laminating a thick plate or a thick plate on a printed circuit board to be plated with a clamper and then unloading the plated substrate, It is a device that moves to the next process.

The present invention relates to a printer comprising a charging device (2) in which a printed circuit board (1) to be plated is cleaned, degreased and rinsed in a known pretreatment process and is kept in a standby state, and a printed circuit board A racking unit 5 for holding the substrates 1 positioned in the centering unit 3 by using the clamper 4, a clamping unit 5 for clamping the substrates 1 positioned in the centering unit 3 by using the clamper 4, A first rail conveyor belt 7 for moving the board 1 laid by the first rail conveyor belt 7 in a predetermined number of unit units along the rail 6, Transfer unit group 100 of unit units 100 transferred to the plating tank 8 and connecting the group of the unit substrates 100 plated in the plating tank 8 to the second rail conveyor belt 9, (10), the group of plated substrates (100) is transferred to the transfer (10) and the second rail And an unloading unit 11 for taking over through the conveyor belt 9.

Two forward and backward waiting conveyor belts 10a and 10b are provided on the transfer 10 reciprocating forward and backward along another guide rail 12. The rear waiting conveyor belt 10b, The front waiting conveyor belt 10a in front is connected to the first conveyor belt 7 that supplies the group of substrates 100 to be unloaded to the unloader 11 And a second conveyor belt 9 for conveying the same.

Next, the operation of the present invention will be described.

As described above, in order to plate the printed circuit boards 1, which have been cleaned, degreased, and rinsed, in the plating tank 8, a plurality of substrates 1 are stacked in the dispenser 2 by using a known conveying device do.

A vacuum or a vacuum pad is used to transport the substrate 1a at the top of the substrates 1 to the centering unit 3 one by one.

Therefore, the substrates 1 transported individually by the centering machine 3 are determined to be in a correct position, and the substrates 1 positioned one by one are transported one by one to the racking station 5 by using an adsorption plate or a vacuum pad.

The clamper 4 of the racking unit 5 grips the substrates 1 carried one by one one by one to form a certain number of clamsheets 4), but this is for the purpose of helping understanding of the present invention, and the number of the substrates 1 of the substrate group 100 to be gripped and moved according to need can be variously changed To form the substrate group 100 of FIG.

When the unit group 100 of the unit units having the substrates 1 suspended in the clamper 4 is conveyed on the rail 6 of the first conveyor belt 7 and reaches the transfer 10, And is introduced into the rear waiting conveyor belt 10b provided on the rear side of the transfer 10.

At this time, the substrate group 100 to be plated is not present on the front waiting conveyor belt 10a provided at the front side of the transfer 10 at first.

In this way, in the state where the group of substrates 100 to be plated is put into only the rear waiting conveyor belt 10b of the transfer 10, the transfer 10 moves in the direction of the arrow " The substrate group 100 to be plated is transported to a known plating bath 8.

The group of substrates 100 that have been plated in the plating tank 8 is transferred to the front atmosphere conveyor belt 10a of the transfer unit 10 and the transferred transfer unit 10, When the substrate 10 is moved to the position shown in Fig. 1 by moving along the guide rail 12 in the direction opposite to the "A" direction, the substrate group 100, which has been plated on the front atmosphere conveyor belt 10a of the transfer 10, The substrate groups 100 to be newly plated are transferred to the rear waiting conveyor belt 10b of the transfer 10 through the first conveyor belt 7. At the same time,

The group of the plated substrates 100 transferred by the second conveyor belt 9 is transported by the second conveyor belt 9 to be transported to the unloader 11 by the clamper 4 ) So that the plated substrates 1 are in an unloaded state in order to sequentially enter the next process.

Thus, the present invention can continuously provide a work flow in which the group of substrates 100 to be plated and the group of plated substrates 100 are simultaneously transferred and transferred in the transfer 10, Lt; / RTI >

As described above, the apparatus for loading and unloading the plating substrate according to the present invention can greatly improve the productivity by automating the process while assisting the plating in the plating bath by loading and unloading the substrates regardless of various thicknesses of the substrates to be plated And the advantages such as facility layout reduction and reduction of occupied space can improve the competitiveness and merchantability of facilities.

Claims (2)

1. A loading apparatus for a plating substrate for racking and transporting substrates one by one to a clamper for performing gold plating on a substrate in a plating bath,
(2) for holding the printed circuit boards (1) to be plated after washing, degreasing and rinsing, and holding the printed circuit boards (1) loaded on the printed circuit boards (1) A racking portion 5 for holding the substrates 1 positioned in the centering machine 3 by using the clamper 4 one by one using the centering device 3, A plurality of unit unit substrate groups 100 transported through the first rail conveyor belt 7 and a plurality of unit unit substrate units 100 transported through the first rail conveyor belt 7, Transferring the transferred substrate groups 100 to the second rail conveyor belt 9 by transferring them to the plating tank 8 and transferring the unit group of the unit units 100 of which plating is finished in the plating tank 8 to the second rail conveyor belt 9, The substrate group 100 is transferred through the transfer 10 and the second rail conveyor belt 9 And an unloading unit (11) for loading and unloading the plating substrate.
The method of claim 1, wherein the transfer (10) is reciprocated back and forth along another guide rail (12), wherein two forward and backward waiting conveyor belts (10a, 10b) The rear atmosphere waiting conveyor belt 10b on the rear side is associated with the first conveyor belt 7 supplying the group of substrates 100 to be plated and the front waiting waiting conveyor belt 10a is plated on the plating tank 8 And a second conveyor belt (9) for transferring the group of substrates (100) to the unloading machine (11).
KR1020040049610A 2004-06-29 2004-06-29 Loading and unloading apparatus of plating board KR100575111B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020040049610A KR100575111B1 (en) 2004-06-29 2004-06-29 Loading and unloading apparatus of plating board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040049610A KR100575111B1 (en) 2004-06-29 2004-06-29 Loading and unloading apparatus of plating board

Publications (2)

Publication Number Publication Date
KR20060000674A KR20060000674A (en) 2006-01-06
KR100575111B1 true KR100575111B1 (en) 2006-04-28

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KR1020040049610A KR100575111B1 (en) 2004-06-29 2004-06-29 Loading and unloading apparatus of plating board

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101057335B1 (en) * 2009-01-12 2011-08-17 주식회사 티케이씨 Printed Circuit Board Automatic Racking Device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59153894A (en) 1983-02-19 1984-09-01 Chuo Seisakusho:Kk Automatic plating apparatus of printed circuit board
JPH07316885A (en) * 1994-05-31 1995-12-05 Japan Tobacco Inc Circuit board mounting device and removing device for plating
KR20010051504A (en) * 1999-11-08 2001-06-25 마에다 시게루 Plating apparatus and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59153894A (en) 1983-02-19 1984-09-01 Chuo Seisakusho:Kk Automatic plating apparatus of printed circuit board
JPH07316885A (en) * 1994-05-31 1995-12-05 Japan Tobacco Inc Circuit board mounting device and removing device for plating
KR20010051504A (en) * 1999-11-08 2001-06-25 마에다 시게루 Plating apparatus and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101057335B1 (en) * 2009-01-12 2011-08-17 주식회사 티케이씨 Printed Circuit Board Automatic Racking Device

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