KR20130010825A - Plating apparatus and plating method - Google Patents

Abstract

PURPOSE: A plating apparatus and plating method are provided to remove a separate power device to rotate a substrate holder by rotating a substrate holder using a substrate holder transfer part for transferring a substrate holder to a plating part. CONSTITUTION: A plating apparatus includes a plating part(130), a substrate holder, a substrate holder transferring part(140), a stoker(150) and a stoker configuring part. The plating part plates a substrate. The substrate holder holds a substrate. The substrate transferring part holds and transfers the substrate holder. The stoker stores the substrate holder. The stoker configuring part stores the stoker inside. The stoker includes a traveling mechanism for moving the stoker to inside of the stoker configuring part or from the stoker configuring part. The traveling mechanism includes a castor for moving or separating the stoker from the plating apparatus.

Description

Plating Apparatus and Plating Method {PLATING APPARATUS AND PLATING METHOD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for plating a surface of a workpiece (substrate), such as a semiconductor wafer, and to a method of plating. A plating apparatus and plating method suitable for forming bumps (protrusion electrodes) to be formed or electrically connected to electrodes such as a package on a surface of a substrate. For three-dimensional packaging such as semiconductor chips, it is necessary to form a number of through via plugs in substrates called interposers or spacers. The plating apparatus and plating method according to the present invention are also used to fill via holes for forming such through via plugs. More specifically, the present invention relates to a dip-type plating apparatus and a dip-type plating method for plating a substrate held by a substrate holder by immersing the substrate in a plating solution of a plating bath.

Devices for plating substrates are generally classified into face-down type plating apparatus and dip-type plating apparatus.

The face-down plating apparatus performs plating of a substrate such as a semiconductor wafer while the substrate is held in a horizontal direction by a head whose plating surface is downward. The substrate is typically housed in a carrier receptacle, such as a front opening unified pod (FOUP), while the substrate is held in a horizontal direction with its plated surface upward. Therefore, before the substrate is plated by the face-down type plating apparatus, the substrate needs to be turned over in the face-down type plating apparatus.

On the other hand, the dip-type plating apparatus puts the substrate vertically into the plating liquid in the plating bath to perform plating of the substrate held by the substrate holder. Therefore, it is necessary to keep the substrate holder horizontal when the substrate is to be held in the substrate holder, and it is necessary to hold the substrate holder vertically when the substrate is to be immersed in the plating liquid. As a result, the dip-type plating apparatus also includes a mechanism for converting the substrate from the vertical state to the horizontal state and a mechanism for converting the substrate from the horizontal state to the vertical state.

As shown in FIG. 33, for example, a conventional plating apparatus includes an arm 304 rotatably mounted on a transporter 300 by a motor 302. After the arm 304 clamps one end of the substrate holder 306, the motor 302 is operated to rotate the arm 304 in the vertical direction at 90 ° to vertically rotate the substrate holder 306. It will convert from state to horizontal state. The substrate holder 306 is then disposed in the horizontal direction on the table 308. As shown in FIG. 34, another conventional plating apparatus includes a rotary shaft 314 for clamping one end of the substrate holder 312 and rotating the substrate holder 312 and a table 310 rotatable in a vertical direction. Fixing station (316) comprising a. The rotary shaft 314 is rotated about its own axis to convert the substrate holder 312 from a vertical state to a horizontal state.

In recent years, as substrates have become larger in size, mechanisms for rotating arms or tables for use with these substrates have become larger, converting substrate holders from vertical to horizontal or also vertical to horizontal. The time required to convert to a state tends to be longer. The larger the mechanisms for rotating the arms or tables, the more space is needed to convert the arms or tables in the plating apparatus. As a result, the plating apparatus itself becomes larger in size and the manufacturing cost becomes more expensive.

The conventional plating apparatus also includes a substrate holder opening and closing mechanism, i.e., a fixing robot used to set the substrate on the substrate holder. The substrate holder opening and closing mechanism suffers from the following problems:

BACKGROUND ART A plating apparatus including a substrate holder for holding a substrate in a vertical direction to immerse the substrate in a plating liquid is known. In such a plating apparatus, the substrate holder holds the substrate by gripping the substrate between a fixed supporting member and a movable supporting member which can be opened and closed about a hinge. do. The movable support member has a rotational support member that is not removable. When the support member is rotated to slide the outer circumference portion into the clamper of the fixed support member, a seal ring of the movable support member is used to seal the outer edge of the substrate and predetermined regions of the fixed support member. Sealing, electric power feed contacts of the fixed support member make contact with the outer edge of the substrate (Japanese Patent No. 379847, Japanese Patent No. 378282, Japanese Patent No. 3940265, and Japanese Patent). No. 4422440).

According to the above-described plating apparatus, when the support member rotates, it causes its own wear and also rotates the movable support member to displace the substrate from positional alignment and to seal the sealing ability of the sealing ( sealing capability can be compromised. In order to avoid these disadvantages, a pressing rod is applied to press the movable supporting member, and the supporting member is rotated while reducing the wear on the supporting member by the pressing rod. However, in order to rotate the support member while reducing wear on the support member, the plating apparatus requires a complex mechanism that is movable and vertically rotatable along a vertical axis. The complex mechanism complicates the structure of the substrate holder opening and closing mechanism. The complicated substrate holder opening and closing mechanism takes a large space in the plating apparatus, which makes the plating apparatus large in size and increases the manufacturing cost.

Another problem with the conventional substrate holder opening and closing mechanism is that, if the thickness of the substrate holder is different, the distance at which the pressing rod presses the sealing ring against the substrate holder is easy to change. Specifically, if the substrate holder is thinner than its normal thickness, since the sealing is not sufficiently compressed, the support member is more likely to be worn during rotation. If the substrate holder is thicker than its normal thickness, the sealing is excessively compressed and damaged. As a result, substrate holders not properly manufactured to meet the thickness requirements will lower the sealing ability of the sealing.

Conventional substrate holder opening and closing mechanisms generally employ a positional displacement detecting measure for detecting the case where the substrate is displaced from the positional alignment at the time when the substrate is mounted on the substrate holder. According to such position displacement detecting means, a substrate guide is disposed on a fixed supporting member at a position near the outer edge of the substrate. A horizontal optical sensor such as a photosensor or a laser sensor measures the amount of light from a light beam applied horizontally over a substrate in a substrate holder. If the substrate is placed on a substrate guide, the substrate is tilted to block the light beam. Therefore, the amount of light detected by the horizontal optical sensor becomes smaller than when the substrate is properly set to the substrate holder without the substrate guide being disturbed. In this way, positional displacements of the substrate in the substrate holder are detected based on the reduction of the detected amount of light. When the substrate is displaced from the positional alignment in the substrate holder, the substrate guide holds the substrate thereon and holds the tilted substrate, thereby preventing the substrate from remaining in the horizontal plane while being displaced from the positional alignment. do.

However, the horizontal optical sensor is a table in which water droplets on a substrate, the substrate is warped by itself, the substrate holder is warped by itself, and the table on which the substrate holder is disposed is warped by itself, or the substrate holder is disposed. When the substrate holder is tilted by dust or dirty particles applied to the substrate, there is a problem in that the substrate may be misdetected as it is displaced from the positional alignment in the substrate holder. The horizontal optical sensor is detectable by the sensor due to smear-induced fogging on the surface of the sensor due to its substrate guide being limited in height to the size of the substrate holder and used over time. Since the amount of light decreases with time, there is a problem in its detection accuracy.

In the dip-type plating apparatus, the substrate holder is stored in a stocker since it is before operation. When the dip-type plating apparatus starts to operate, the substrate holder is taken out of the stocker, and the substrate to be processed is taken out of its storage and held by the substrate holder. The substrate holder holding the substrate is transported by the substrate holder transfer portion to the plating bath and other processing baths associated with the plating process when the substrate is thus processed.

It is found that the substrate holder suffers from a problem such as a failure in feeding, and when the service is required to solve the above problem, the conventional dip-type plating apparatus must be shut down, and thus its operational availability. Is lowered. Substrate holders found to be experiencing a power failure have been returned to the stocker and blocked from use until they are serviced. While the dip-type plating apparatus is operated in the plating process, access to the inside of the dip-type plating apparatus is limited for safety reasons. As a result, when the substrate holder is to be serviced, it is necessary to wait at least until the plating treatment disclosed immediately before the problem. Since the substrate holder which is impeded to use cannot be used in the plating process, the throughput of the dip-type plating apparatus per unit time is reduced.

In a conventional dip-type plating apparatus, a stocker for storing a substrate holder is inseparably integrated into the apparatus. If the substrate holder placed on the stocker needs to be serviced, the substrate holder is manually removed from the stocker or removed from the stocker by a dedicated hoist. Alternatively, the stocker may be provided in a delivery tank or service area accessible from the outside of the dip-type plating apparatus, in a dip-type plating apparatus, and then the substrate holder is manually removed from the stocker. Or is removed from the stocker by a dedicated hoist. This is tedious and time-consuming to remove the substrate holder from the dip-type plating apparatus and return the substrate holder to the dip-type plating apparatus. The tedious and time-consuming service process is further exacerbated as the size of the substrates to be handled increases, the required manual labor increases and the size of the hoist used becomes larger.

The present invention has been made in view of the above situation. Therefore, a first object of the present invention is to provide a plating apparatus and a plating method which ensures easy access to the substrate holder and allows the substrate holder to be easily serviced while the substrate is being processed in the plating apparatus.

A second object of the present invention is a plating apparatus capable of converting the attitude of a substrate holder for detachably holding a substrate from a horizontal state to a vertical state or from a vertical state to a horizontal state without the need for a large rotating mechanism. A method, a plating apparatus and a plating method for converting the attitude of a substrate holder for use in the present invention are provided.

The third object of the present invention is to provide a case in which the substrate can be placed in the substrate holder together with the substrate holder opening / closing mechanism without the need for a large composite device, and the substrate is displaced from the positional alignment at the time when the substrate is mounted on the substrate holder. On the other hand, it is to provide a plating apparatus capable of allowing the substrate holder to have a different thickness.

The present invention provides a plating unit for plating a substrate; A substrate holder for holding the substrate; A substrate holder transfer unit for holding and transferring the substrate holder; A stocker for storing the substrate holder; And a stocker setting unit for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into or from the stocker setting unit.

According to this structure, the substrate holder can be taken out of the stocker without interrupting the processing of the substrate in the plating apparatus. As a result, the throughput of the plating apparatus per unit time is not lowered, and the substrate holder can be easily and quickly serviced.

In a preferred aspect of the present invention, the moving mechanism includes a caster for moving and separating the stocker from the plating apparatus.

The stocker setting unit, the door selectively openable; And a shutter that is selectively openable and closed to insulate the atmosphere in the stocker setting unit and the atmosphere in the plating apparatus when the door is opened.

The substrate holder transfer part may include a sensor for detecting whether the substrate holder exists in the stocker or the position of the substrate holder in the stocker.

The plating apparatus may include a control unit for monitoring and controlling the states of the substrate holder transfer unit and the stocker setting unit, and an indicating section for displaying the movement of the stocker relative to the control unit.

The stocker includes a latch handle for locking the stocker in the stocker setting unit, and the stocker setting includes a latch receiver for engaging the latch handle. You may.

In a preferred embodiment of the present invention, the stocker setting unit includes a door switch for limiting the opening of the door and a shutter switch for limiting the opening of the shutter, wherein the door switch and the shutter switch operate together.

The present invention comprises the steps of removing the substrate holder from the stocker; Holding the substrate with the substrate holder; Transferring the substrate holder holding the substrate to the plating portion by a substrate holder transfer portion; Plating the substrate in the plating part; And a plating method for controlling the plating apparatus to automatically perform the step of transferring the substrate holder back to the stocker using the substrate holder transfer unit. The plating method includes the step of moving the stocker from the plating apparatus by using the moving mechanism of the stocker while the plating apparatus performs the steps automatically.

In a preferred aspect of the present invention, the moving mechanism includes a caster for moving and separating the stocker from the plating apparatus.

In a preferred aspect of the present invention, the plating method further comprises the steps of: the plating of the stocker from the plating apparatus to the control unit of the plating apparatus before the stocker is moved out of the plating apparatus while the plating apparatus automatically performs the steps. Indicating the movement.

In a preferred aspect of the present invention, the plating method includes the steps of closing the shutter to isolate the interior of the plating apparatus from ambient air before the stocker is moved from the plating apparatus, and the stocker is moved into the plating apparatus. Opening the shutter to allow the substrate holder transfer portion to approach the stocker after the operation is completed.

The present invention provides a stocker for storing a substrate holder for use in a plating apparatus, the substrate holder storage region for storing the substrate holder therein; And a moving mechanism. The stocker is moved and separated from the plating apparatus by the moving mechanism.

The stocker may include a drain pan disposed at the bottom thereof.

The substrate holder storage region may store an anode holder therein.

The present invention provides another stocker for storing an anode holder for use in a plating apparatus, the anode holder storage area for storing the anode holder therein; A drain pan disposed at the bottom thereof; And a moving mechanism. The stocker is moved and separated from the plating apparatus by the moving mechanism.

The present invention provides a substrate holder for detachably holding a substrate; A table for placing the substrate holder in a horizontal direction thereon; A plating portion having a plating bath for immersing the substrate on a vertical surface of a plating liquid to arrange the substrate held by the substrate holder; And a substrate holder transfer part for transferring the substrate holder between the table and the plating part. The substrate holder transfer part includes a holding part for holding the substrate holder. The table has a horizontal moving mechanism that is movable in a horizontal direction while supporting a lower end of the substrate holder. The substrate holder transfer portion moves the holding portion in a vertical direction along with a lower end of the substrate holder supported by the horizontal movement mechanism to move in the horizontal direction, thereby moving the attitude of the substrate holder vertically. A vertical movable arm for converting from the horizontal state to the horizontal state or from the horizontal state to the vertical state.

According to this structure, the substrate holder can be stably rotated without the need for a large rotating mechanism, and the plating apparatus can save space and reduce manufacturing costs. In particular, as the substrate holder transfer part for transferring the substrate holder to the plating part is used to rotate the substrate holder, there is no need for another power mechanism for rotating the substrate holder. As a result, the plating apparatus can be manufactured at a greatly reduced cost.

The plating apparatus may include a sensor for detecting whether the substrate holder transporter is holding the substrate holder or a distance to the substrate holder held by the substrate holder transporter.

In a preferred embodiment of the present invention, the vertical movable arm includes a case in which the substrate holder transfer part does not hold the substrate holder or a distance from the reference holder to the substrate holder held by the substrate holder transfer part is from a reference value. If the sensor detects a deviation, the operation is stopped.

The substrate holder may include a round handlebar, and the holding part may hold the round handlebar.

The holding part may be shaped to rotatably support the round handle bar.

Preferably, the lower end portion of the substrate holder to be supported by the horizontal moving mechanism includes a semi-circular portion that comes into contact with the horizontal moving mechanism.

The horizontal moving mechanism may be biased in a direction for lowering the holding part by a weight suspended from the horizontal moving mechanism.

The substrate holder transfer part may include a clamper for preventing the substrate holder from swinging while the substrate holder is transferred.

The present invention provides a method for converting an attitude of a substrate holder for detachably holding a substrate, the method comprising: holding one end of the substrate holder by using a holding portion of the substrate holder transfer portion; Moving the substrate holder held by the holding portion above a table; Lowering the holding portion to contact the other end of the substrate holder with the horizontal moving mechanism on the table; And lowering the holding part to move the horizontal moving mechanism in a horizontal direction to convert the attitude of the substrate holder from a vertical state to a horizontal state.

The method includes detecting, using a sensor, whether the substrate holder transporter is holding the substrate holder or a distance to the substrate holder held by the substrate holder transporter; And stopping the operation of the holding unit if the sensor detects that the substrate holder transfer unit is not holding the substrate holder or the distance to the substrate holder held by the substrate holder transfer unit deviates from a reference value. It may be made to include more.

The method may include moving the substrate holder transfer part in a horizontal direction to tilt the substrate holder at a predetermined angle after the other end of the substrate comes in contact with the horizontal moving mechanism.

The present invention comprises the steps of placing the substrate holder on the table; Mounting and holding a substrate using the substrate holder disposed on the table; Holding one end of the substrate holder by using a holding portion of the substrate holder transfer portion; Raising the substrate holder transfer part and moving a horizontal moving mechanism on the table in a horizontal direction to convert the attitude of the substrate holder from a horizontal state to a vertical state; Moving the substrate holder to a position above the plating bath holding the plating liquid by using the substrate holder transfer portion; And lowering the substrate holder by using the substrate holder transfer part to immerse the substrate in the plating solution of the plating bath.

The present invention provides a substrate holder for detachably holding a substrate; A table for placing the substrate holder in a horizontal direction thereon; A plating portion having a plating bath for immersing the substrate on a vertical surface of a plating liquid to arrange the substrate held by the substrate holder; Another plating apparatus including a substrate holder transfer part for transferring the substrate holder between the table and the plating part is provided. The substrate holder transfer part includes a holding part for holding the substrate holder and a substrate holder opening and closing mechanism for opening and closing the substrate holder disposed on the table. The substrate holder includes a movable support member having a rotation support member, and the fixed support member for gripping the substrate in cooperation with the movable support member removably fixed to the fixed support member. The substrate holder opening and closing mechanism includes at least a portion rotatable to fix the movable support member to the fixed support member and to release the movable support member from the fixed support member, and a head portion for pressing the movable support member. And a first actuator for vertically moving the head portion, and a second actuator for rotating at least a portion of the head portion, wherein the movable support member is removably held by the head portion.

This can simplify the mechanism for opening and closing the substrate holder in order to reduce the size of the plating apparatus, so that the cost of the plating apparatus can be reduced.

In a preferred aspect of the present invention, the head portion comprises a rotary plate and a pressing disk having a hanging hook for holding the movable support member for pressing the movable support member. Wherein the support member comprises a lobe, the fixed support member comprises a clamper, and the rotating plate is connected to the shaft and the support when the shaft is pushed by the second actuator. The member is rotated to rotate, the lobe rotates the support member to fix the movable support member to the fixed support member or to move the movable support member to a position for hanging by the hanging hook. In response to fitting with the clamper.

The head portion may include a substrate position detecting portion for checking the position of the substrate in the substrate holder.

Thus, regardless of deformations such as warping of the substrate and the substrate holder and droplets applied to it, the positional displacements of the substrate can be accurately detected at the time the substrate is placed in the substrate holder.

The presser disc may have a pressing block for pressing the movable support member, wherein the pressing block includes a pre-compressed spring disposed therein.

According to the present invention, the substrate holder can be taken out of the stocker without interrupting the processing of the substrate in the plating apparatus. As a result, the throughput of the plating apparatus per unit time is not lowered, and the substrate holder can be easily and quickly serviced.

In addition, according to the present invention, the substrate holder can be stably rotated without the need for a large rotating mechanism, the plating apparatus can save space and reduce the manufacturing cost. In particular, as the substrate holder transfer part for transferring the substrate holder to the plating part is used to rotate the substrate holder, there is no need for another power mechanism for rotating the substrate holder. As a result, the plating apparatus can be manufactured at a greatly reduced cost.

In addition, according to the present invention, the mechanism for opening and closing the substrate holder in order to reduce the size of the plating apparatus can be simplified, so that the cost of the plating apparatus can be reduced.

Also, according to the present invention, regardless of deformations such as warping of the substrate and the substrate holder and droplets applied thereto, the positional displacements of the substrate can be accurately detected at the time when the substrate is placed in the substrate holder. do.

In addition, according to the present invention, it is possible to reduce the frictional resistance applied to the components when the substrate holder is opened and closed, and to achieve a stable sealing ability for sealing the substrate holder even when the substrate holder has a different thickness. Make it possible.

1 is a side view schematically showing a plating apparatus according to an embodiment of the present invention;
2 is a plan view of the plating apparatus shown in FIG.
3 is a schematic view showing the structure of a substrate holder;
FIG. 4A is a schematic diagram showing the structure of the substrate holder transfer portion, FIG. 4B is a schematic diagram showing the manner in which the substrate holder is held by the substrate holder transfer portion shown in FIG. 4A, and FIG. 4C is along the line YY 'of FIG. 4B. Taken section;
5A to 5F are schematic views showing an operation sequence of an arm of the substrate holder transfer portion and a horizontal moving mechanism for moving the table in the horizontal direction, in order to arrange the substrate holder in the horizontal direction on the table;
6A to 6F detail the horizontal movement mechanism and the substrate holder in the sequence operation shown in FIGS. 5A to 5F;
7A to 7D show an operation sequence of the substrate holder transfer part for disposing a substrate holder on the horizontal moving mechanism;
8A to 8C show another operation sequence of the horizontal moving mechanism for moving the table in the horizontal direction and the arm of the substrate holder in order to arrange the substrate holder in the horizontal direction on the table;
9A to 9C show yet another sequence of operations of an arm of the substrate holder and a horizontal moving mechanism for moving the table in the horizontal direction, in order to arrange the substrate holder in the horizontal direction on the table;
10 is a schematic view showing the structure of another substrate holder;
FIG. 11A is a schematic view showing the fixed support member of the substrate holder shown in FIG. 10, and FIG. 11B is a schematic view showing the movable support member of the substrate holder shown in FIG.
12 is an enlarged cross-sectional view of a portion of the fixed support member and the movable support member of the substrate holder shown in FIG. 10;
Fig. 13 is a schematic view showing the structure of the substrate holder opening and closing mechanism;
Fig. 14A is a plan view showing the structure of a head portion of the substrate holder opening and closing mechanism, and Fig. 14B is a front view of the head portion shown in Fig. 14A;
15 is a cross-sectional view of the pressing block on the head portion;
16A and 16B illustrate a process of detecting positional displacement of a substrate using a sensor;
17 is a plan view of a substrate holder having recesses formed therein at substrate placement positions;
18A and 18B illustrate a process of detecting positional displacement of a substrate using a sensor;
19 is a perspective view showing the manner in which the substrate holder opening and closing mechanism operates;
20 is a perspective view showing the manner in which the substrate holder opening and closing mechanism operates;
21 is a perspective view showing the manner in which the substrate holder opening and closing mechanism operates;
22 is a perspective view showing the manner in which the substrate holder opening and closing mechanism is operated;
23 is a schematic diagram showing the structure of a wagon-type stocker;
24 is a perspective view showing the structure of another wagon-type stocker;
25 is a side view schematically showing a stocker setting portion and a wagon-type stocker in the plating apparatus;
FIG. 26 is a rear view schematically showing the stocker setting portion and the wagon-type stocker in the plating apparatus; FIG.
27 is a plan view of the guide roller of the vertical roller and the horizontal rollers and the stocker setting portion on the wagon-type stocker;
Fig. 28 is a front view of the guide roller of the vertical roller and the horizontal rollers and the stocker setting portion on the wagon-type stocker;
Fig. 29A is a schematic diagram showing the relationship between the latch handles on the wagon-type stocker and the latch guides on the door of the stocker setting portion, and Fig. 29B is a schematic diagram showing the relationship between the latch handles and the surface of the door on which the latch guides are mounted. 29C is a side view of a door with latch guides mounted thereon;
30 is a block diagram showing connections between the control unit, substrate holder transfer unit, stocker setting unit, stocker access indicator, and accessibility / inaccessibility display of the plating apparatus;
31A-31E are perspective views schematically showing a procedure for placing a wagon-type stocker in a stocker setting and removing the wagon-type stocker from the stocker setting;
32 is a flowchart of a procedure for placing a wagon-type stocker in the stocker setting portion and removing the wagon-type stocker from the stocker setting portion when the plating apparatus is in operation;
33 is a schematic diagram showing a mechanism for rotating a substrate holder provided in a conventional plating apparatus; And
Fig. 34 is a schematic diagram showing another mechanism for rotating the substrate holder provided in another conventional plating apparatus.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. 1 is a side view schematically showing a plating apparatus according to an embodiment of the present invention, Figure 2 is a plan view of the plating apparatus shown in FIG.

As shown in Figs. 1 and 2, the plating apparatus includes a device frame 100, substrate holders 110 for holding the substrates 500 (see Fig. 3), and a FOUP for storing the substrates 500. A pair of load ports 170, a substrate transfer robot 180, a spin rinse dryer (SRD) 190, a table 120, for placing a carrier receptacle thereon The plating unit 130, the substrate holder transfer unit 140, the wagon-type stocker 150, and an aligner 195 are included. The wagon-type stocker 150 is disposed in the stocker setting unit 160 in the apparatus frame 100. In this embodiment, the wagon-type stocker 150 is used as the stocker.

The substrate transfer robot 180 removes the substrate 500 from a carrier receptacle disposed on one of the load ports 170, and transfers the substrate 500 to the table 120. The substrate transfer robot 180 also transfers the processed substrate from the table 120 and stores the processed substrate in a carrier receptacle disposed on one of the load ports 170. The substrate transfer robot 180 is rotatable to transfer the substrates 500 between the load port 170, the table 120, the spin rinse dryer 190, and the aligner 195. The spin rinse dryer 190 rotates the plated substrate 500 while rinsing the plated substrate 500, and rotates the plated substrate 500 at a high speed to finally rotate the plated substrate 500. To dry.

The aligner 195 aligns the substrate 500 with a predetermined position in the circumferential direction thereof. Specifically, the aligner 195 detects the location of a notch or recess formed in the substrate 500, orients the notch to an alignment with the indicated angular position, thereby The substrate 500 is turned to the indicated angular position. The aligner 195 also aligns the central position of the substrate 500 with a predetermined position while turning the substrate 500.

The plating apparatus also includes a control unit 200 including a transfer shaft 101, a substrate holder opening and closing mechanism 102, and a substrate holder transfer unit control unit for moving the substrate holder transfer unit 140 along.

When the substrate 500 is plated, the substrate holder 110 holds the substrate 500 while sealing an end portion and a reverse surface thereof and exposing the plated surface. The substrate holder 110 also has electrical contacts for electrically contacting a peripheral edge of the plated surface of the substrate 500 and for supplying power from an external power source. The substrate holder 110 is stored in the wagon-type stocker 150 prior to the plating process. In the plating process, the substrate holder 110 is moved between the table 120 and the plating part 130 by the substrate holder transfer part 140. After the plating process, the substrate holder 110 is stored in the wagon-type stocker 150 again.

The substrate holder 110 may be disposed in the horizontal direction on the table 120. The substrate transfer robot 180 arranges the substrate 500 in the substrate holder 110 arranged in the horizontal direction on the table 120 or removes the substrate 500 from the substrate holder 110.

The plating apparatus uses two plating solutions in its plating process. The plating unit 130 is a pre-clean bath 130a, a pre-treatment tank 130b, a rinsing tank 130c, a first plating tank 130d, a rinsing tank 130e, a second plating tank 130f, A rinsing tank 130g and a blowing tank 130h are included, which are continuously arranged in the sequence of the above plating process. The treatment baths 130a to 130h are preferably arranged successively in the sequence of the plating treatment along the direction from X to X 'to remove any extra transport paths. The type of jaws, the number of jaws, and the layout of the jaws in the plating apparatus can be freely selected according to the purpose for the substrates to be processed.

In the plating apparatus shown in FIGS. 1 and 2, the substrate 500 held by the substrate holder 110 is processed by treating fluids in the treatment tanks 130a to 130h of the plating portion 130. . In particular, the substrate 500 held by the substrate holder 110 is immersed in the plating liquid in the vertical direction to be plated in the plating liquid in the plating bath 130f, while the plating liquid is introduced into the plating bath 130f from below. It has flowed over the plating bath 130f. In the above embodiment, the plating bath 130f is divided into a plurality of zones, and one substrate 500 held by one substrate holder 110 is perpendicular to the plating liquid in each of the zones. It is immersed in and plated. Each region of the plating bath 130f includes an insertion slot for inserting the substrate holder 110 therethrough, a power unit for supplying power to the substrate holder 110, an anode, and a paddlester ( a paddle stirrer, and a shield plate. The anode is mounted on an anode holder and has an exposed surface facing the substrate 500 concentrically therewith.

The substrate holder transfer part 140 may include the transfer shaft between the table 120, the plating part 130, and the wagon-type stocker 150 by a transfer mechanism not shown, such as a linear motor. Move along 101). The substrate holder transfer part 140 transfers the substrate holder 110 while holding the substrate holder 110 in a vertical attitude.

The wagon-type stocker 150 may store a plurality of substrate holders 110 extending in a vertical plane, respectively. In Fig. 1, the wagon-type stocker 150 is disposed adjacent to the backside of the plating apparatus. However, the wagon-type stocker 150 may be disposed between other locations, such as the table 120 and the plating 130.

Hereinafter, the operation sequence of the plating apparatus will be briefly described by way of example. The operation sequence comprises the following series of steps (a) to (h).

(a) The substrate holder transfer part 140 moves to a position above the wagon-type stocker 150 and holds and removes the substrate holder 110 stored in the wagon-type stocker 150.

(b) Thereafter, the substrate holder transfer part 140 moves to the position above the table 120 while holding the substrate holder 110, and the substrate holder 110 in a horizontal direction on the table 120. Place it.

(c) The substrate 500 is set in the substrate holder 110.

(d) The substrate holder transfer part 140 holds the substrate holder 110 in the vertical direction and moves to the pre-clean bath 130a of the plating part 130. Subsequently, the substrate holder transfer part 140 may process the substrate 500 held by the substrate holder 110 in the processing tanks 130a to 130h and at the same time the plating part (X) in the X 'direction. 130 are continuously moved through the processing tanks 130a to 130h.

(e) After the processing of the substrate 500 is completed in the plating part 130, the substrate holder transfer part 140 moves to the table 120 while holding the substrate holder 110 in a vertical direction. The substrate holder 110 is disposed in the horizontal direction on the table 120.

(f) The substrate 500 is removed from the substrate holder 110.

(g) If the substrates 500 are to be processed continuously, an unprocessed substrate 500 is set in the substrate holder 110, and the sequence is repeated from step (d) to step (f).

(h) When the entire plating process is completed, the substrate holder transfer part 140 holds the substrate holder 110 from which the substrate 500 has been removed in the vertical direction and moves to the wagon-type stocker 150. The substrate holder 110 is vertically stored in the wagon-type stocker 150.

In the operation sequence, after setting the substrate 500 to the substrate holder 110, the substrate holder transfer part 140 is a substrate holder 110 holding the substrate 500, the plating portion ( Go to pre-clean bath 130a. However, after setting the substrate 500 to the substrate holder 110, the substrate holder transfer part 140 may transfer the substrate holder 110 to the wagon-type stocker 150, or the wagon. The substrate holder 110 may be temporarily disposed on the -type stocker 150.

Hereinafter, the structural details of the substrate holder 110 will be described. 3 is a schematic diagram illustrating a structure of the substrate holder 110.

As shown in FIG. 3, the substrate holder 110 has a handle bar 111 on one end thereof. The handle bar 111 is held by the substrate holder transfer part 140. The handle bar 111 is in the form of a round bar rotatable about its own axis to convert the attitude of the substrate holder 110 from a vertical state to a horizontal state and from a horizontal state to a vertical state. have.

The handle bar 111 is preferably made of stainless steel that is corrosion resistant for self protection against plating liquids that may be applied thereto. If the handlebar 111 made of stainless steel is still susceptible to corrosion due to contact with the plating solution, the surface of the handlebar 111 is coated with a layer of titanium carbide (TiC) or a plating layer of chromium for improved corrosion resistance. It is preferred to be coated. The handle bar 111 may be made of titanium having high corrosion resistance. In this case, since the level of the surface frictional resistance is generally high, it must be finished for smooth rotational sliding contact with the lifter 142 described later of the substrate holder transfer part 140.

The substrate holder 110 has a pair of hangers 112 facing the upper ends thereof, respectively. Each hanger 112 is in the form of a cube or cube. The hangers 112 are respectively disposed on hanger receivers, and the substrate holder 110 is disposed at the time when the substrate holder 110 is disposed in the processing tanks 130a to 130h of the plating unit 130. It serves as a support for hanging 110. One of the hangers 112 has feed contacts 114. If the plating baths 130d and 130f are electroplating baths, the feed contacts 114 on the hanger 112 are electrically connected to a corresponding hanger receiver for supplying current from an external power source to the plated surface of the substrate 500. It is kept in contact with the contacts. The feed contacts 114 are located out of contact with the plating liquid of the plating bath at the time when the substrate holder 110 is hanged from the hangers 112 disposed on the hang receivers. The hangers 112 are supported on the hanger receivers 152 described below of the wagon-type stocker 150 when the substrate holder 110 is stored in the wagon-type stocker 150.

Each of the cuboid or cube-shaped hangers 112, when the substrate holder 110 is moved against the forces applied to the substrate holder transfer portion 140 in the direction indicated by the arrow A shown in FIG. It is designed to prevent the holder 110 from swinging. When the substrate holder 110 is in a vertical state with its lower end 113 facing downward, the hangers 112 have their upper surfaces placed in a horizontal direction.

The lower end 113 of the substrate holder 110 has a semi-circular cross-sectional shape (see FIGS. 6A to 6F) for smooth rotational sliding contact with the horizontal moving mechanism 121 described later of the table 120.

4A is a schematic diagram showing the structure of the substrate holder transfer part 140. FIG. 4B is a schematic diagram showing how the substrate holder 110 is held by the substrate holder transfer part 140 shown in FIG. 4A. 4C is a cross-sectional view taken along the line Y-Y 'of FIG. 4B.

The substrate holder transfer part 140 includes a lifting and lowering mechanism (not shown) integrated into a vertical support column 145. The elevating mechanism operates in the vertical direction to raise and lower the substrate holder 110. The lifting mechanism includes a horizontal arm 141 for hanging the substrate holder 110. The arm 141 includes a lifter 142 as a holding part for supporting the handle bar 111 from the bottom to hang and hold the substrate holder 110. In order to support the handlebar 111 from below, the lifter or holding portion 142 is provided with a pair of semi-circular fingers (142a) for engaging the handlebar 111. The semicircular fingers 142a have an inner diameter slightly larger than the outer diameter of the handle bar 111. The lifter 142 has a space between the semi-circular fingers 142a and also for detecting whether the handlebar 111 exists in the space and up to the handlebar 111 in the space. The sensor 144 is included as a substrate holder detector for detecting a distance. If the sensor or substrate holder detection unit 144 detects an abnormal state, or if it does not detect the handlebar 111, ie, the substrate holder 110, or the distance to the handlebar 111 is a reference value. If it detects a deviation from the, that is, the case that the substrate holder 110 is displaced out of the position with respect to the arm 141, the sensor 144 is not shown to stop the rise and fall of the arm 141 The abnormal state is displayed on the elevator mechanism control unit. The sensor 144 may also detect another abnormal condition in which the fingers 142a of the lifter 142 do not adequately support the handlebar 111 because the fingers 142a This is because the substrate holder 110 is displaced locally when the handle bar 111 is to be supported from the substrate.

The fingers 142a are in contact with a synthetic resin layer, such as PTFE, or the handlebar 111 to reduce the coefficient of friction for the handlebar 111 to smoothly turn against the fingers 142a. It is desirable to incorporate a layer of aluminum coated with PEEK or treated with TUFRAM at those surfaces that are retained.

The substrate holder transfer part 140 includes a pair of clampers 143 to prevent the substrate holder 110 from swinging. When the substrate holder transfer part 140 moves in the horizontal direction, the clampers 143 apply downward force to the upper horizontal planes of the hangers 112 of the substrate holder 110, and thus the substrate holder transfer part 140. The substrate holder 110 is prevented from swinging in the direction in which the substrate moves. In order to more effectively prevent the substrate holder 110 from swinging, the hangers 112 may be designed in a shape for fitting with the clampers 143.

In this embodiment, the clampers 143 are used to apply downward force to the upper horizontal planes of the hangers 112 of the substrate holder 110 and to prevent the substrate holder 110 from swinging. It is a downwardly open C shape for supporting the opposing vertical surfaces of the hangers 112. If the force applied from the clampers 143 to the upper horizontal planes of the hangers 112 in the vertical direction can be set at a level higher than the force tending to swing the substrate holder 110, the clamper 143 ) Do not need to support opposite vertical surfaces of the hangers 112. However, in general, since the upper horizontal planes of the hangers 112 are not large in area, the clampers 143 preferably support opposite vertical planes of the hangers 112.

When the substrate holder 110 needs to be changed from a vertical state to a horizontal state, the clampers 143 are moved upward to release the substrate holder 110. The clampers 143 are moved vertically by respective actuators 146 such as air cylinders, electric actuators, etc. mounted on the arm 141. In this embodiment two actuators 146 are used to move the clampers 143 supporting the hangers 112 on opposite ends of the substrate holder 110. However, only one actuator 146 may be mounted on the arm 141 aligned with the center of the substrate holder 110, and an attachment (not shown) may be mounted on the movable member of the actuator 146. It may be mounted on or connected to the two clampers 146.

The table 120 is used to arrange the substrate holder 110 thereon in a horizontal direction by changing from a vertical state to a horizontal state. The table 120 includes a horizontal moving mechanism 121 (see FIGS. 5A to 5F) for supporting the lower end 113 of the substrate holder 110. The horizontal moving mechanism 121 is the substrate holder transfer part 140 along a guide, not shown, such as a linear motion (LM) guide for guiding the lower end 113 of the substrate holder 110 for linear motion, for example. It is slidable in the direction along the conveying shaft 101 of.

An external force applied by the weight 123 through the wire 122 in the embodiment is applied to the horizontal movement mechanism 121 so that the horizontal movement mechanism 121 is always placed at an initial position, that is, the substrate holder transfer portion. When 140 is lowered toward the table 120, the lower end 113 of the substrate holder 110 tends to return to the position where the horizontal moving mechanism 121 is in contact. The weight 123 may be replaced with a helical spring. The horizontal moving mechanism 121 is preferably made of a shape and material suitable for making sliding contact with the lower end 113 of the substrate holder 110.

Hereinafter, an operation sequence for changing the attitude of the substrate holder 110 from the vertical state to the horizontal state and for arranging the substrate holder 110 on the table 120 in the horizontal direction will be described with reference to FIGS. 5A through 5F. This will be described with reference to FIGS. 6A to 6F and FIGS. 7A to 7D.

5A to 5F illustrate a horizontal moving mechanism 121 and the substrate holder transfer part for moving the table 120 in a horizontal direction to arrange the substrate holder 110 in a horizontal direction on the table 120. Schematic diagrams showing the operation sequence of the arm 141 of the lifting mechanism 140. 6A to 6F are detailed views illustrating the substrate holder 110 and the horizontal moving mechanism 121 in the sequence operation shown in FIGS. 5A to 5F. 7A to 7D illustrate an operation sequence of the substrate holder transfer part 140 for disposing the substrate holder 110 on the horizontal moving mechanism 121.

According to the clampers 143 for clamping the substrate holder 110 against the swing movement, and the lifter 142 of the arm 141 for hanging the substrate holder 110, the substrate holder transfer part 140 may be configured to be used as the lifter 142. The table 120 moves to an upper position. The positional relationship between the substrate holder 110 and the horizontal moving mechanism 121 at this point is shown in FIGS. 7A and 7B. The table 120 includes a horizontal moving mechanism 121 that is movable in a horizontal direction while supporting the lower end 113 of the substrate holder 110. When the substrate holder transfer part 140 moves to the upper position of the table 120, the arm 141 holding the substrate holder 110 in the vertical direction starts to descend. 5A illustrates a state in which the lower end 113 of the substrate holder 110 is lowered to a position slightly higher than the horizontal moving mechanism 121. The positional relationship between the substrate holder 110 and the horizontal moving mechanism 121 at this point is shown in FIGS. 6A and 7B.

As shown in FIG. 7C, the clampers 143 release the substrate holder 110. As shown in FIGS. 5B, 6B and 7D, the arm 141 is then lowered until the lower end 113 of the substrate holder 110 touches the horizontal movement mechanism 121.

As shown in FIGS. 5A and 5B, when the substrate holder 110 moves downward, the arm 141 has a lower end 113 of the substrate holder 110 slightly higher than the horizontal moving mechanism 121. Until the position is reached, the clampers 143 are preferably lowered at high speed while holding the substrate holder 110 against swing movement. The arm 141 is lowered at a low speed until the lower end 113 of the substrate holder 110 touches the horizontal moving mechanism 121, and the substrate holder 110 is moved from the clampers 143. It is preferable to release. In this manner, the substrate holder 110 is stably lowered within a short time.

When the lower end 113 of the substrate holder 110 just touches the horizontal moving mechanism 121, the substrate holder 110 may be smoothly rotated at the bottom dead center of the rotation cycle. none. Therefore, after the lower end 113 of the substrate holder 110 touches the horizontal moving mechanism 121, as shown in FIG. 5C, the arm 141 is slightly lowered toward the plating part 130. And moved slightly horizontally. Thus, as shown in FIG. 6C, the substrate holder 110 is now tilted and starts to rotate smoothly.

After the substrate holder 110 is tilted at a predetermined angle, preferably about 15 °, the arm 141 is lowered, and as shown in FIG. 6D, the lower end 113 of the substrate holder 110 is shown. Pushes the horizontal moving mechanism 121 under the weight of the substrate holder 110. When the lower portion 113 of the substrate holder 110 is lowered, the arm 141 may be slightly moved toward the substrate transfer robot 180. The lowering of the arm 141 is such that the substrate holder 110 whose lower end 113 is supported by the horizontal moving mechanism 121 is moved from a vertical state to a horizontal state as shown in FIGS. 5D and 5E. Allow it to rotate and tilt. Specifically, as shown in FIG. 6E, when the arm 141 is lowered from the position shown in FIG. 6D, the substrate holder 110 is tilted in a horizontal state while being supported at the point A. FIG.

When the arm 141 is further lowered, the substrate holder 110 is placed in the horizontal direction as shown in FIGS. 5F and 6F, and the downward movement of the substrate holder transfer part 140 and the horizontal movement mechanism are performed. The horizontal movement of 121 is completed. The weight of the horizontal substrate holder 110 is tolerated by the table 120 as a whole. After the arm 141 is further lowered, it is withdrawn toward the plating 130 and then raised.

As described above, the substrate holder 110 may be converted from a vertical attitude to a horizontal attitude without the need for a large rotating mechanism having a large torque for the rotating substrate holder 110. According to the present invention, the distance that the substrate holder transfer part 140 initially moves to tilt the substrate holder 110, the speed at which the arm 141 descends, and the horizontal movement mechanism 121 to their initial positions. A force applied to return, a sliding resistance between the fingers 142a of the lifter 142 and the handlebar 111, and a sliding between the horizontal moving mechanism 121 and the lower end 113 of the substrate holder 110. It is important to design the shapes of the resistors optimally.

According to the present invention, the attitude of the substrate holder 110 is converted along with the horizontal movement of the horizontal moving mechanism 121. According to another attitude conversion method, as shown in FIGS. 8A to 8C, the lower end 113 of the substrate holder 110 may be held in contact with the left end of the table 120, and the arm ( 141 may be moved in a bow shape to make the substrate holder 110 a horizontal attitude. However, as shown in FIG. 1, when the substrate transfer robot 180 transfers the substrate 500 to the substrate holder 110 or receives the substrate 500 from the substrate holder 110. Since the substrate holder opening mechanism 102, in which the substrate holder 110 can release the substrate 500, is disposed above the table 120, the substrate holder transfer part 140 and the substrate holder opening mechanism 102 tends to interfere with each other.

According to another attitude conversion method, as shown in FIGS. 9A to 9C, the lower end 113 of the substrate holder 110 may be held in contact with the right end of the table 120, and the arm ( 141 may tilt the substrate holder 110 toward the plating unit 130 until the substrate holder 110 is placed in the horizontal direction. Finally, the arm 141 may be rotated to the substrate holder 110. ) Is moved onto the table 120. However, as shown in FIG. 9B, since the substrate holder transfer part 140 protrudes a large distance from the table 120 toward the plating part 130, the processing operation in the plating part 130 is performed. There is also the possibility of interference.

According to the process for changing the attitude of the substrate holder 110 according to the present invention, unlike the other attitude conversion methods, when the substrate holder transfer unit 140 converts the attitude of the substrate holder 110, the substrate holder transfer unit 140 does not interfere with processing operations in the substrate holder opening mechanism 102 and the plating section 130. As a result, it is not necessary to consider the distance between the substrate holder transfer part 140 and the substrate holder opening mechanism 102 and the plating part 130. The process of changing the attitude of the substrate holder 110 according to the present invention is very effective in constructing the plating apparatus since space is saved.

The horizontal moving mechanism 121 may include a mechanism for moving in the horizontal direction by itself rather than under the weight of the substrate holder 110. However, this mechanism requires its own power source and must operate in cooperation with the arm 141 for converting the attitude of the substrate holder 110, resulting in complicated control processing. Accordingly, the horizontal movement mechanism 121 is made to be slidable, and the horizontal movement mechanism 121 is horizontal in the horizontal direction under an external force applied from the helical spring or the weight 123 for returning the horizontal movement mechanism 121 to its initial position. It is preferable to control the mechanism to move the moving mechanism 121.

In the above embodiment, as the substrate holder 110 is changed from the vertical state to the horizontal state, the fingers 142a of the handlebar 111 and the lifter 142 and the lower end of the substrate holder 110. 113 and the horizontal movement mechanism 121 is sliding relative to each other. If it is not desirable for them to slide with each other, opposite ends of the handlebar 111 may be supported by bearings and a roller may be mounted on the lower end 113 of the substrate holder 110. However, since the substrate holder 110 is immersed in the plating liquid, the bearings and the rollers are disposed near the surface of the plating liquid or in the plating liquid. It may not be desirable for the bearings and the rollers to be affected by the plating solution. Therefore, in order to avoid sliding movement of the parts, rollers may be mounted on the horizontal movement mechanism 121 or the fingers 142a of the lifter 142, so that the lower end 113 of the substrate holder 110 or The handle bar 111 is made rotatable.

After the processed substrate 500 is removed from the substrate holder 110 disposed on the table 120 or the next substrate 500 to be processed is held by the substrate holder 110, the substrate holder 110 converts the attitude from the horizontal state to the vertical state. In this attitude change, the fingers 142a of the lifter 142 enter the lower portion of the handlebar 111 to engage the handlebar 111, and the lifter 142 is raised when the arm 141 is raised. Hanging the substrate holder 110. The horizontal moving mechanism 121 is not disengaged from the lower end 113 of the substrate holder 110 and returns to its initial position such that the substrate holder 110 becomes a vertical attitude. The arm 141 is further raised. While the arm 141 is being raised, the clampers 143 operate as described above to prevent the substrate holder 110 from swinging.

In this embodiment, the power only raises and lowers the arm 141 in order to move the horizontal moving mechanism 140 in the horizontal direction and to convert the attitude of the substrate holder 110 between the vertical and horizontal attitudes. Only need Mechanisms of the substrate holder transfer part 140 for generating horizontal and vertical movements move the substrate holder 110 to the processing tanks and immerse the substrate 500 in the processing liquids of the processing tanks. Required. Therefore, dedicated power is not necessary to change the attitude of the substrate holder 110.

The present invention is applicable to a wide range of devices for holding a substrate with a substrate holder, transferring the substrate holder, and placing the substrate. In the above embodiment, the principles of the present invention are applied to the plating apparatus by way of example. However, the principles of the present invention are also applicable to etching apparatuses, electroless plating apparatuses, and the like. The principles of the present invention include a processing vessel of a type that completely immerses the substrate holder in the processing tank, as well as a processing tank having an opening formed in its vertical sidewall and closed horizontally by the substrate held by the substrate holder. It is also applicable to a processing apparatus. In the above embodiment, the plating apparatus includes a single substrate holder transfer part which is commonly used to change the attitude of the substrate holder and to transfer the substrate holder to the processing tanks including the plating baths. However, the principles of the present invention are applicable to a plating apparatus including a plurality of substrate holder transfer portions, for example, for changing the attitude of the substrate holder and another for transferring the substrate holder to the plating portion 130.

According to the present invention, as described above, since the substrate holder can be stably rotated without the need for a large rotating mechanism, the plating apparatus can be manufactured at a reduced cost and a reduced cost. In particular, as the substrate holder transfer part used to transfer the substrate holder to the plating baths is used to rotate the substrate holder, there is no need for a separate power mechanism for rotating the substrate holder, and the plating apparatus is greatly reduced. Can be manufactured at a cost.

Hereinafter, the operation sequence of the substrate holder opening and closing mechanism 102 will be described. The substrate holder opening and closing mechanism 102 removes the substrate 500 from the substrate holder 110 disposed in the horizontal direction on the table 120 and mounts the substrate 500 in the substrate holder 110. To this end, the lid (lid) of the substrate holder 110, that is to be described later serves to install and remove the support member (11).

FIG. 10 is a plan view showing the structure of the substrate holder 110 on which the movable support member 11 is mounted on the fixed support member 15 on which the lobes 13 are held in engagement with the respective clampers 16. . 11A is a plan view illustrating the fixed support member 15 of the substrate holder 110. 11B is a plan view illustrating the movable support member 11 of the substrate holder 110. 12 is an enlarged cross-sectional view of a portion of the movable support member 11 and the fixed support member 15 of the substrate holder 110.

10 to 12, the substrate holder 110 includes a fixed support member 15 to be disposed on the table 120 and a movable support member 11 as a lead. The movable support member 11 and the fixed support member 15 grip the substrate 500 therebetween. The movable support member 11 is in the form of a substantially circular ring and includes a support member 12 and a plurality of lobes protruding from the outside of the support member 12 integrally with the support member 12. And (13). The movable support member 11 may be fixed to the fixed support member 15 and may be removed from the movable support member 11. As shown in FIG. 10, the movable support member 11 is fixed to an upper surface of the fixed support member 15. The fixed support member 15 has a plurality of clampers 16 that correspond to the lobes 13 in position. The clampers 16 are inverted L-shaped and the tip is bent inward. When the lobes 13 are fitted to the tips bent inwardly of the clampers 16, the clampers 16 fix the movable support member 11 to the fixed support member 15. The lobes 13 and the clampers 16 preferably have tapered surfaces to allow them to fit smoothly to each other.

The support member 12 is held rotatably with respect to the movable support member 11 and not separated by a dislodgment prevention member 12b and is substantially free of the movable support member 11 in a horizontal plane. It is rotatable with the lobes 13 about the center R. The support member 12 is, for example, substantially in the form of a circular ring. The support member 12 is disposed on the circumferential surface of the support member 12 and includes a protrusion 12a protruding toward the head portion 1100 of the substrate holder opening and closing mechanism described later. The support member 12 is prevented from being removed from the movable support member 11 by the removal prevention member 12b.

The movable support member 11 and the fixed support member 15 grip the substrate 500 therebetween, and the support member 12 is rotated so that the lobes 13 are connected to the clampers 16. When fitted, they are held together. In order to mount and remove the substrate 500, the support member 12 is rotated so that the lobes 13 are out of engagement with the clampers 16. The substrate 500 is disposed on the substrate arrangement region 14 of the fixed support member 15.

The movable supporting member 11 may include, for example, a first sealing ring 18a and a second sealing ring for sealing portions of the substrate 500 that do not need to be plated, such as their edges and reverse surfaces, from the plating liquid. 18b). The first seal ring 18a is held in contact with the outer circumferential edge of the substrate 500, and the second seal ring 18b is held in contact with the surface of the fixed support member 15. The substrate holder 110 is used in an electroplating apparatus. Therefore, the substrate holder 110 contacts the edge region of the substrate 500 which is sealed by the first sealing ring 18a to provide an electrical contact 20 for supplying power to the substrate 500. To have. The electrical contact 20 is electrically connected to an external power source while the movable support member 11 and the fixed support member 15 are gripping the substrate 500 therebetween. The first sealing ring 18a and the second sealing ring 18b are held by a sealing holder 19. For clarity, the first seal ring 18a and the second seal ring 18b may be collectively referred to as a seal ring 18.

In order to remove the substrate 500 from the substrate holder 110, the movable support member 11 is moved away from the fixed support member 13. At this time, the first sealing ring 18a and the substrate 500 may be fixed together, and the substrate 500 may be fixed to the movable support member 11 or raised with it. In order to prevent the substrate 500 from being fixed to the movable support member 11, the movable support member 11 may be moved when the substrate 500 is moved away from the first sealing ring 18a. It is preferable to provide peel springs for biasing the substrate 500 toward the fixed support member 15 and for peeling the substrate 500 from the first sealing ring 18a. The coil springs are disclosed in Japanese Patent No. 492440.

However, even when the movable support member 11 includes spring members, the substrate 500 may be formed according to properties and properties such as a material and a thickness of a resist layer applied to the substrate 500. The position may be displaced from the substrate arrangement region 14 because the sealing ring 18a and the substrate 500 are fixed to each other when the movable support member 11 is removed. In particular, a portion of the edge of the substrate 500 may be fixed to the first sealing ring 18a, the substrate 500 is raised obliquely, and then the misaligned position on the fixed support member 15 ( may be dropped to a misaligned position.

As will be described later, the problem is that the plating apparatus continues to operate on the displaced substrate 500 when the sensors 1140 of the substrate holder opening mechanism 102 detect a positional misalignment of the substrate 500. It is solved by preventing.

13 is a schematic view showing the structure of the substrate holder opening and closing mechanism 102. As shown in FIG. 13, the substrate holder opening and closing mechanism 102 includes a head 1100, a first actuator 1200, and a second actuator 1300.

The head 1100 positioned above the table 120 may hold the movable support member 11 of the substrate holder 110 disposed on the table 120. The head portion 1100 may rotate the support member 12 of the movable support member 11 to rotate the lobes 13, thereby moving the movable support member 11 to the fixed support member 15. Or the movable support member 11 is released from the fixed support member 15, and the movable support member 11 is held.

The first actuator 1200 is connected to the head portion 1100 by a connecting boss 1170 of the head portion 1100. In operation, the first actuator 1200 moves the head portion 1100 in the vertical direction. In the above embodiment, the first actuator 1200 includes a shaft 1220 and an actuator unit 1210 having one end connected to the head portion 1100. The first actuator 1200 moves the head portion 1100 in the vertical direction as the shaft 1220 extends and contracts.

The second actuator 1300 includes an actuator unit 1310 which is uniaxially movable and a shaft hook 1330 fixed to a movable plate 1320 of the actuator unit 1310. . The two rollers 1340 are rotatably on the shaft hooks 1330 at positions spaced therebetween by roller shafts 1350 for sliding when the shaft 1130, described below, is pushed. Mounted. When the second actuator 1300 is operated, the shaft hook 1330 is moved horizontally in a reciprocating manner to push the shaft 1130, which extends from the head portion 1100, the head portion Rotating the rotating plate 1150 of (1100). The second actuator 1300 may include a ball screw.

14A and 14B show structural details of the head portion 1100. As shown in FIGS. 14A and 14B, the head portion 1100 includes a presser disc 1110 and a rotating plate 1150 mounted on the presser disc 1110. The presser disc 1110 includes a hanging hook 1111, a rotating plate guide 1112, a guide roller 1113, and a pressure block 1114. Sensors 1140 are firmly supported on the presser disk 1110 at intervals spaced along its circumferential edge.

The rotating plate 1150 has fastening hooks 1151 and is connected to one end of the shaft 1130. The rotating plate 1150 is in the form of a substantially circular ring gripped by the rotating plate guides 1112 on the presser disc 1110. The rotating plate 1150 is rolled engaged with the guide rollers 1113 and is rotatable about its central axis in a substantially horizontal plane.

The shaft 1130 comprises, for example, a bar. When the second actuator 1300 operates to move the shaft hook 1330 in the horizontal direction, the shaft 1130 is also moved in the horizontal direction to rotate the rotating plate 1150. Specifically, the rotation of the rotating plate 1150 may be controlled by controlling the operation of the second actuator 1300. The sensor 1131 is mounted on the presser disk 1110 to detect the position of the shaft 1130.

When the rotating plate 1150 rotates about its central axis, it rotates the support member 12 and the lobes 13. In this embodiment, the two fastening hooks 1151 extend downward from the swivel plate 1150 at two respective circumferential positions. When the rotating plate 1150 is rotated by the second actuator 1300, one of the fastening hooks 1151 pushes the protrusion 12a of the support member 12, thereby supporting the support member 12. Rotate

The pressing block 1114 is mounted on the bottom surface of the presser disk 1110. When the first actuator 1120 lowers the head portion 1100, the pressing blocks 1114 are pressed at the points P shown in FIG. 12, for example, pressing the movable supporting member 11 downward. Contact with (11). When the movable support member 11 is pressed downward in this way, the seal rings 18 are deformed by the distance at which the movable support member 11 is pressed downward. As the movable support member 11 is lowered, it creates a gap between the lobes 13 and the clampers 16. Accordingly, the force applied to rotate the support member 12, that is, the driving power generated by the second actuator 1300 may be relatively small, so that the clampers 16 and the lobe 13 may be relatively small. Minimize wear on the pads).

The distance that the pressing blocks 1114 press the movable support member 11 downward is determined by the position where the head portion 1100 is lowered. When the substrate holder 110 has a different thickness, the distance at which the sealing rings 18 are deformed or compressed is different. Specifically, if the substrate holder 110 is thinner than its normal thickness, since the sealing rings 18 are not sufficiently compressed, the support member 12 is more likely to be worn during rotation. If the substrate holder 110 is thicker than its normal thickness, the sealing rings 18 may be excessively compressed and damaged, and the sealing ability may be adversely affected.

This problem can be solved by using a plunger having a resilient member 30, such as a spring, housed therein as each of the pressure blocks 1114, as shown in FIG. have. The plunger also houses a pin 31 which is held against the elastic member 30 while protruding from the plunger. Since the elastic member 30 having a predetermined elastic force is pre-compressed to a predetermined scale and is housed in the plunger, the elastic member 30 typically biases the pin 31 so that the substrate holder 110 has a predetermined elasticity. ) And protrudes from the plunger. The pressure blocks 1114 configured as described above may reduce the difference in the distance that the seal rings 18 are compressed due to the individual dimensional characteristics of the substrate holder 110. As a result, the thickness difference of the substrate holder 110 is tolerated, thereby stably reducing the frictional resistance formed between the components at the time when the substrate holder 110 is opened and closed, and the sealing ( Stabilize the sealing ability of 18).

The presser disc 1110 has a plurality of hanging hooks 1111 on its outer edge. When the lobes 13 of the movable support member 11 are rotated to be positioned directly above the hangers of the hanging hooks 1111, the head portion 1100 is raised. The lobes 13 of the movable support member 11 are now hanged by the hanging hooks 1111 to raise the movable support member 11 together with the head portion 1100. In this case, a clearance is generated between the movable support member 11 and the fixed support member 15 so that the substrate 500 is disposed on the fixed support member 15 or the fixed support is supported. To be removed from the member 15.

As described above, the support member 12 of the movable support member 11 is rotated to fix the movable support member 11 to the fixed support member 15, and the movable support member 11 is separate. Raised and lowered by actuators, each operating in a single stroke through the head portion 1100. As a result, the reciprocating and rotatable composite mechanism required for the conventional plating apparatus is not necessary, and the plating apparatus is relatively small in size, its structure is simple, and can be manufactured at low cost. The conventional substrate holder including the movable support member 11 and the fixed support member 15 coupled to each other by a hinge requires a mechanism for raising the movable support member 11 to be positioned below the table. The substrate holder 110 according to the present invention does not need a dedicated actuator for opening and closing the substrate holder 110.

The sensors 1140 may serve as a positional detector for positionally detecting the substrate 500 in the substrate holder 110 disposed on the table 120. Mounted on the edge. Hereinafter, the process of detecting the position of the substrate 500 will be described with reference to FIGS. 16A and 16B.

As shown in FIGS. 16A and 16B, the sensors 1140 of the substrate holder opening and closing mechanism 102 are positioned above the substrate holder 110. The sensor 1140 may be, for example, a laser sensor, but is not limited thereto. The plurality of sensors 1140 of the substrate holder opening and closing mechanism 102 may accurately detect misalignment of the substrate 500. The fixed support member 15 of the substrate holder 110 has a recess 17 formed at an outer circumferential edge thereof aligned with a position where the sensor 1140 applies a laser beam. For example, the substrate holder opening and closing mechanism 102 includes three sensors 1140, and as shown in FIG. 17, the fixed support member 15 is disposed at an outer peripheral edge of the substrate arrangement region 14. Three recesses 17 are provided. Each recess 17 has an inclined bottom surface which lies substantially perpendicular to the axis of the laser beam from the sensor 1140 and causes the plating liquid to flow out of the recess 17. It is desirable to maintain a constant distance between the inclined bottom surface of (17) and the sensor 1140.

The sensor 1140 measures a distance to an object and determines whether the measured distance is within a predetermined range. For example, a sensor 1140 located at a predetermined height is spaced apart from the inclined bottom surface of the recess 17 by a distance A, and as shown in FIG. 16A, the sensor 1140 is inclined. If the distance A is detected as the distance to the bottom surface, the sensor 1140 measures the exact distance to the inclined bottom surface instead of the distance to the substrate 500 on the fixed support member 15. It is determined that. Therefore, it will be found that the substrate 500 is not located between the sensor 1140 and the inclined bottom surface, that is, the recess 17.

On the other hand, if the sensor 1140 detects a distance W ₁ shorter than the distance A, as shown in FIG. 16B, the sensor 1140 measures the distance to the substrate 500, and the substrate ( It is determined that 500 is experiencing location misalignment.

If the exact distances to the inclined bottom surfaces of the plurality of recesses 17 are measured by the corresponding sensors 1140, the substrate 500 is in the directions of any of the recesses 17. It is found to have no positional misalignment. Therefore, positional misalignment of the substrate 500 can be detected more accurately.

The threshold value D for determining the positional misalignment of the substrate 500 may be set to an appropriate value by adjusting the gradient R and the distance A of the sensor 1140 from a direction perpendicular to the substrate 500. Can be. The threshold value D is preferably in the range of 0.5 mm to 1.5 mm.

If the substrate 500 is found not to be located between the sensors 1140 and the recesses 17, the substrate 500 may not be present on the fixed support member 15. For example, the substrate 500 may be fixed to the movable support member 11 or may be raised together with the movable support member 11. In order to prepare for such a situation, as shown in FIGS. 18A and 18B, the sensor 1140 may rise as the head portion 1100 is raised, and the sensor 1140 may raise the recess 17. The distance to the inclined bottom surface of the recess 17 may be measured again from the position higher than the height previously measured in advance.

Specifically, as shown in FIG. 18A, the sensor 1140 is raised from the height in which the sensor 1140 has previously measured the distance to the inclined bottom surface of the recess 17 from the height H. The sensor 1140 is spaced apart from the substrate 500 by a distance W ₂ . If the sensor 1140 measures the distance W ₂ to the substrate 500, it is determined that the sensor 1140 measures the exact distance to the substrate 500, and the substrate 500 is fixed It is found to be located on the support member 15.

On the other hand, as shown in FIG. 18B, if the sensor 1140 measures a distance B shorter than the distance W ₂ , the sensor 1140 is the distance to the inclined bottom surface of the recess 17. Is determined, and it is found that the substrate 500 does not exist on the fixed support member 15.

Hereinafter, an operation sequence of the substrate holder opening and closing mechanism 102 for disposing the substrate 500 to the substrate holder 110 and for removing the substrate 500 from the substrate holder 110 will be described with reference to FIGS. 19 to 22. Let's explain.

19 is a perspective view illustrating the substrate holder 110 disposed in the horizontal direction on the table 120 by the substrate holder transfer part 140. In this state, the head portion 1100 connected to the first actuator 1200 by the connecting boss 1170 is spaced upwardly from the substrate holder 110. The shaft 1130 extends from the head portion 1100 to a position above the second actuator 1300. The substrate holder 110 does not hold the substrate 500, but the movable support member 11 is engaged with the clampers 16 and is fixed by the lobes 13 which are slightly held. It is temporarily fixed to (15).

The head 1100 is lowered by the first actuator 1200 such that the shaft 1130 is in a position between two rollers 1340.

Then, as shown in FIG. 20, the second actuator 1300 releases the movable support member 11 from the fixed support member 15, that is, the lobe from the clampers 16. 13) is activated to release them. In FIG. 20, the shaft hook 1330 is displaced in the direction indicated by the arrow X 'by the second actuator 1300 to rotate the rotating plate 1150 counterclockwise. Thus, one of the fastening hooks 1151 pushes the protrusion 12a of the support member 12 to move the lobes 13 to the hanging hooks 1111 as described above.

The second actuator 1300 is moved to its initial position to return the shaft hook 1330 in the directions indicated by arrows X and X 'from the position shown in FIG. 20 to its intermediate position. In addition, the first actuator 1200 is operated to raise the head portion 1100, thereby raising the movable support member 11. The substrate transfer robot 180 then places the substrate 500 on the substrate placement region 14 of the fixed support member 15, as shown in FIG.

Then, the first actuator 1200 is operated to lower the head portion 1100 from the position shown in FIG. When the pressing blocks 1114 on the lower surface of the presser disk 1110 press the movable supporting member 11, as described above, the pressing blocks 1114 may be formed by pressing the respective elastic members 30 therein. By including them, they can reduce the difference in the distance that the sealing rings 18 are compressed due to the different thickness of the substrate holder 110.

When the first actuator 1200 lowers the head portion 1100, and the second actuator 1300 moves the shaft hook 1330 in the direction indicated by the arrow X from the position shown in FIG. 21, the The shaft hook 1330 pushes the shaft 1130 in the direction indicated by the arrow X to rotate the rotating plate 1150 clockwise as shown in FIG. 22. The fastening hooks 1151 push the protrusion 12a of the support member 12 which is also rotated in the clockwise direction. The lobes 13 are now fitted with the clampers 16. The movable support member 11 is now fixed to the fixed support member 15 to grip the substrate 500 therebetween.

FIG. 22 shows the lobes 13 and clampers 16 that are held in contact with each other while the substrate 500 is gripped between the movable support member 11 and the fixed support member 15. If the movable support member 11 is to be temporarily fixed to the fixed support member 15 without the substrate 500 being gripped therebetween, the shaft hook 1330 is more than the position shown in FIG. It may be stopped in a slightly earlier position.

In FIG. 22, after the lobes 13 and the clampers 16 remain fitted to each other, the second actuator 1300 is moved to its initial position, thereby moving the shaft hook 1330 to its intermediate position. Returns to the directions indicated by arrows X and X '. The substrate holder 110 holding the substrate 500 is then transferred by the substrate holder transfer part 140 to the plating part 130 where the substrate 500 is properly processed.

After the substrate 500 is processed, the substrate holder 110 holding the processed substrate 500 is disposed on the table 120, and the substrate 500 is the substrate holder opening mechanism 102. ) And the substrate transfer robot 180 are removed from the substrate holder 110. The process of separating the movable support member 11 from the fixed support member 15 to remove the substrate 500 from the substrate holder 110 is carried out in the same manner as described above in the first actuator 1200. ) And the second actuator 1300.

21 also shows the movable support member 11 lifted by the head portion 1100 after the substrate holder 110 holding the processed substrate 500 is placed on the table 120. . The substrate 500 is fixedly raised to the first sealing ring 18a and then lowered into a misaligned position on the fixed support member 15, or the substrate 500 is moved to the movable support member 11. If it remains stationary, this difficulty is caused by the sensors 1140 as described above, when they measure the distances to the substrate 500 and the fixed support member 15. It is detected on the part 1100.

As described above, the substrate holder opening and closing mechanism 102 is made of a combination of simple components, so that its size is relatively small and the price is low. Since the substrate holder opening and closing mechanism 102 of the embodiment includes the sensors 1140 on the head portion 1100 movable vertically to detect positional misalignments of the substrate 500, the substrate holder opening and closing mechanism 102 The position of the substrate 500 is more accurate than ever, regardless of whether the substrate 500 and the substrate holder 110 are deformed or whether water droplets are applied to the substrate 500. Red misalignments can be detected. In addition, since the pressing blocks 1114 for pressing the substrate holder 1100 include respective elastic members 30 therein, they allow the sealing rings 18 to be individually dimensioned to the substrate holder 110. Due to the specific characteristics, it is possible to reduce the difference in the compression distance, thereby stabilizing the sealing ability of the sealing ring 18 with respect to the substrate 500.

In the above embodiment, the second actuator 1300 is disposed next to the table 120. However, since the second actuator 1300 serves to rotate the rotating plate 1150 with respect to the presser disc 1110, the second actuator 1300 is used to rotate the rotating plate 1150. It may be mounted on the presser disc 1110. In this embodiment, the pressing blocks 1114 including the respective elastic members 30 reduce the difference in the distance that the sealing rings 18 are compressed due to the different thickness of the substrate holder 110. However, the first actuator 1200 for moving the head unit 1100 in the vertical direction may include a servomotor having a torque monitoring capability, and the servomotor of the head unit 1100 may be formed. It may be controlled to control the lowering, making the force for compressing the sealing rings 18 constant. In this way, the distance that the sealing rings 18 are compressed may be made constant regardless of the different thicknesses of the substrate holder 110.

The wagon-type stocker 150 (see FIGS. 1 and 2) of this embodiment is a stocker for storing substrate holders 110 extending in a vertical plane, respectively. The wagon-type stocker 150 may store therein at least as many substrate holders 110 as the number of compartments in the plating bath 130f of the plating part 130. The wagon-type stocker 150 stores an additional group of substrate holders 110 for use as backups to the substrate holders 110 that are found to be defective due to a power failure. desirable.

The wagon-type stocker 150 is disposed in the stocker setting unit 160. As shown in FIG. 1, the stocker setting unit 160 is disposed adjacent to the rear surface of the plating apparatus having the load ports 170 on the front surface of the plating apparatus. The stocker setting unit 160 and thus the wagon-type stocker 150 may be disposed at other positions, for example, between the table 120 and the plating unit 130. However, the table 120, the plating unit 130, and the stocker setting unit 160 should be arranged continuously as shown in FIG. 1 in the order for higher efficiency, because the layout is more This is because it is suitable for high throughput per unit time. Specifically, when the plating apparatus is in continuous operation, after the substrate holder 110 transfers the substrate 500 processed by the plating unit 130, the substrate holder 110 is processed to the next substrate 500. ) Therefore, if the substrate holder 110 does not suffer difficulties such as power failure, the corresponding compartment in the wagon-type stocker 150 is left empty, and the transfer time of the substrate holder 110 is maintained. Loss may pass over the empty wagon-type stocker 150. In other words, when the plating apparatus is in continuous operation, the substrate holder 110 is not transferred to the right beyond the point marked X in FIG. 1.

If the wagon-type stocker 150 and the corresponding stocker setting unit 160 are disposed between the table 120 and the plating unit 130, the sidewall of the plating apparatus facing the viewer of FIG. 1 has an opening. And the wagon-type stocker 150 must be taken through the opening into the stocker setting 160 and from the stocker setting 160. However, the plating apparatus is generally spaced apart by a distance of approximately 1 m from an adjacent apparatus such that an operator takes the wagon-type stocker 150 into the stocker setting unit 160 and from the stocker setting unit 160 so that the wagon It will provide limited space to work on the -type stocker 150. It is difficult to produce wagon-type stockers that are movable in this limited space and can store a plurality of substrate holders. According to the above embodiment, the stocker setting unit 160 is disposed adjacent to the rear surface of the plating apparatus, because a relatively large space obtains free access to the stocker setting unit 160. This is because it can be used behind the plating apparatus.

Next, the structural details of the wagon-type stocker 150 will be described later. When the plating apparatus is shut down, that is, when the substrates 500 are not processed, the wagon-type stocker 150 stores all the substrate holders 110 therein. When the plating apparatus is in operation, i.e., when the substrates 500 are processed, the substrate holders 110 or substrate holders that are not in use may suffer from difficulties such as feeding failures stored in the wagon-type stocker 150. The necessary substrate holders 110 are removed from the 110 and wagon-type stockers 150.

23 is a schematic diagram illustrating the structure of a wagon-type stocker 150. As shown in FIG. 23, the wagon-type stocker 150 is a mechanism for moving the wagon-type stocker 150 as a plurality of casters 151 and the substrate holder 110 to hang the substrate holders 110. A plurality of hang receivers 152 for supporting the hangers 112 of the 110, and a substrate holder swing preventing member for preventing the substrate holders 110 hanging by the hang receivers 152 from swinging. 153. The wagon-type stocker 150 also includes a pair of stocker locks 159, a frame 155, such as a latch, to lock the wagon-type stocker 150 in the stocker setting section 160; Vertical roller 156, horizontal roller 157, drain pan 158, and handle 154. Details of these components will be described later. The wagon-type stocker 150 has a substrate holder storage area formed in the frame 155 as a space for storing the plurality of substrate holders 110 therein.

Since the wagon-type stocker 150 has casters 151 as a moving mechanism, the wagon-type stocker 150 is into the stocker setting section 160 and from the stocker setting section 160, i.e. the It can be moved into and out of the plating apparatus. In this embodiment, the casters 151 are used as the moving mechanism. However, the wagon-type stocker 150 may have another moving mechanism instead of the casters 151. For example, rails may be provided to slidably guide the wagon-type stocker 150 into and out of the stocker setter 160. The wagon-type stocker 150 may be pulled from the stocker setting unit 160 in the plating apparatus, and the substrate holders 110 may be brought into the wagon-type stocker 150 and the wagon from the outside of the plating apparatus. The substrate holders 110 may be taken out into the wagon-type stocker 150 and from the wagon-type stocker 150 manually or by a hoist in the plating apparatus, since it may be taken out of the -type stocker 150. Less burden on the operator than in the case.

Since the wagon-type stocker 150 is movable due to the casters 151, the wagon-type stocker 150 may be completely separated from the plating apparatus. After the wagon-type stocker 150 is completely separated from the plating apparatus, the wagon-type stocker 150 moves to a serving area in the plating factory where the substrate holders 110 can be serviced. Can be. Relatively heavy substrate holders 110 may be pulled from the wagon-type stocker 150 by a fixed-hoist in the service area. If the wagon-type stocker 150 cannot be separated from the plating apparatus, a movable hoist needs to be pulled into the plating apparatus, which makes the service processing for the wagon-type stocker 150 tedious and time-consuming. However, the detachable wagon-type stocker 150 according to the embodiment can be easily serviced.

24 is a perspective view showing the structure of another wagon-type stocker 150. As shown in FIG. 24, the frame 155 of the wagon-type stocker 150 has a recess 155a formed in its sidewall. The substrate holder 110 hanging from the hanger receiver 152 can be easily removed from the wagon-type stocker 150 through the recess 155a, and the substrate holder 110 can be removed from the wagon-type stocker (15). It can be easily introduced into 150, and can be easily hanged from the hang receiver 152 through the recess (155a). The recess 155a passes through the substrate holders 110 into the wagon-type stocker 150 and through the wagon-type stocker 150 without having to lift the substrate holders 110 from the wagon-type stocker 150. Makes it easy to take from stocker 150.

25 is a schematic side view of the wagon-type stocker 150 and stocker setting unit 160 in the plating apparatus. Fig. 26 is a schematic rear view of the wagon-type stocker 150 and the stocker setting unit 160 in the plating apparatus.

The stocker setting unit 160 is preferably disposed at a position adjacent to the rear surface of the plating apparatus in a direction in which the transfer shaft 101 of the substrate holder transfer unit 140 extends, for the reason described above. As described above, since the substrate holder 110 does not pass over the empty wagon-type stocker 150, the tact time is reduced, so there is no loss of the transfer time. The stocker setting unit 160 may be disposed between the blower tank 130h and the table 120 shown in FIGS. 1 and 2, rather than adjacent to the backside of the plating apparatus, for example. However, when the wagon-type stocker 150 is pulled from the stocker setting unit 160 between the table 120 and the blower tank 130h, the wagon-type stocker 150 may be formed of the plating apparatus. Located on the side. Since the space on the side of the plating apparatus is limited by an adjacent apparatus and does not provide free access to the wagon-type stocker 150, the stocker setting unit 160 is adjacent to the backside of the plating apparatus. Preferably located.

As shown in FIGS. 25 and 26, the stocker setting unit 160 passes through the wagon-type stocker 150 to be taken out of the stocker setting unit 160 and out of the stocker setting unit 160. And a door 161 disposed in an opening formed on the rear surface of the plating apparatus, and an opening and closing apparatus for minimizing any gap into which ambient air flows into the plating apparatus when the door 161 is opened. A shutter 162. In this embodiment, the door 161 includes a lock mechanism operated with the shutter 162. The locking mechanism locks the door 161 in the closed position when the shutter 162 is opened.

The locking mechanism of the embodiment includes a shutter switch 165a for locking the shutter 162 and a door switch 165b for locking the door 161. The shutter switch 165a and the door switch 165b are disposed in the stocker setting unit 160. Each of the shutter switch 165a and the door switch 165b is preferably an actuator coupling switch. When the actuator mounted on the shutter 162 or the door 161 is inserted into the shutter switch 165a or the door switch 165b, the shutter switch 165a or the door switch 165b is the shutter. 162 or the door 161 is detected to be closed and the actuator is locked to prevent removal. When an unlock signal is supplied to the shutter switch 165a or the door switch 165b, the shutter switch 165a or the door switch 165b unlocks the actuator. The shutter 162 cannot be opened when the shutter switch 165a is locking the actuator, and the door 162 cannot be opened when the door switch 165b is locking the actuator. The shutter switch 165a or the door switch 165b are operated together, so that the door switch 165b cannot be unlocked unless the shutter switch 165a is locked, and the door switch 165b If is not locked, the shutter switch 165a cannot be unlocked. Accordingly, either one of the shutter switch 165a and the door switch 165b is opened, and the other is essentially closed, so that the periphery within the same area as the plating part 130 and the substrate holder transfer part 140 is opened. Minimize the ingress of air.

The shutter switch 165a and the door switch 165b may each include a solenoid-operated safety switch. The rear panel of the plating apparatus may be used as an integrated door of the wagon-type stocker 150 instead of the door 161 of the stocker setting unit 160. The shutter 162 includes a pivoted shutter movable at an angle between an open position and a closed position by the shutter rotation mechanism 162a to save space. The stocker setting unit 160 detects the shutter switch 165a when the shutter 162 is opened or closed.

In the above embodiment, the stocker lock or latches 159 each include a latch handle 159a for firmly fixing the wagon-type stocker 150 to the stocker setting unit 160. When the wagon-type stocker 150 is disposed in the stocker setting unit 160, the stocker lock or latches 159 may not move the wagon-type stocker 150 to the stocker setting unit 160. To keep. A resilient block 167 made of rubber or the like is mounted on one end of the wagon-type stocker 150, which leads when the wagon-type stocker 150 moves into the stocker setting unit 160. It serves as a leading end, or the backside of the stocker setting portion 160, which the wagon-type stocker 150 abuts, enters the stocker setting portion 160. The elastic block 167 serves to reduce shock when the back surface of the wagon-type stocker 150 and the stocker setting unit 160 come into contact with each other. When the wagon-type stocker 150 is to be introduced into the stocker setting unit 160, the operator pushes the wagon-type stocker 150 to the stocker setting unit 160 until the elastic block 167 is pressed. ), And then the wagon-type stocker 150 is fixed in place in the stocker setting unit 160 by using the stocker lock or latches 159.

In the above embodiment, the stocker setting unit 160 includes the wagon-type stocker at a time when the wagon-type stocker 150 is taken into the stocker setting unit 160 and from the stocker setting unit 160. In order to adjust the position and height of the 150 is provided with a horizontal guide plate 163 disposed therein. FIG. 27 is a plan view of the vertical roller 156 and the horizontal rollers 157 on the wagon-type stocker 150 and the guide plate 163 disposed on the stocker setting unit 160. 28 is a side view of the vertical roller 156 and the horizontal rollers 157 on the wagon-type stocker 150 and the guide plate 163 disposed on the stocker setting portion 160.

27 and 28, the wagon-type stocker 150 includes the vertical rollers 156 in addition to the casters 150, and the stocker setting unit 160 includes the guide plate ( 163). When the wagon-type stocker 150 is pushed into the stocker setting unit 160, the vertical rollers 156 ride on the guide plate 163. At this time, the casters 151 are lifted from the floor.

Individual plating devices usually have different heights from the floor. If the stocker setting unit 160 does not have a guide plate and the wagon-type stocker 150 is pushed into the stocker setting unit 160, the casters 151 remain in contact with the floor. The wagon-type stocker 150 may not be properly positioned in the vertical direction with respect to the different plating apparatus. The wagon-type stocker 150 adjusted vertically relative to one plating apparatus may not be properly positioned vertically relative to another plating apparatus. This disadvantage is avoided by the guide plate 163 located vertically as a reference for providing common heights for the components in different plating apparatus. Since the wagon-type stocker 150 is supported on the guide plate 163 when it is disposed in the stocker setting unit 160, the wagon-type stocker 150 may be commonly used in different plating apparatuses. have. Unless specifically mentioned, a plurality of wagon-type stockers 150 may be used in one plating apparatus.

In the above embodiment, in order to smoothly bring the wagon-type stocker 150 into the stocker setting unit 160, the guide plate 163 includes a central vertical guide rail 163a, and the stocker. Upon movement of the wagon-type stocker 150 into the setter 160, horizontal rollers 157 on the wagon-type stocker 150 are kept in rolling contact with the sides of the guide rail 163a. . When the horizontal rollers 157 are kept in rolling contact with the side surfaces of the guide rails 163a, the horizontal rollers 157 restrict the movement of the casters 151 to the side, so that the casters 151 Position them.

In this embodiment, the guide plate 163 comprises: a slope on its upper surface near its front end to allow the vertical rollers 156 to ride smoothly onto the guide plate 163; 163b). The guide rail 163a draws a pair of slopes 163c on its opposite sides near its front end in order to allow the horizontal rollers 157 to ride smoothly onto the guide rail 163a. Equipped. The guide rail 163a may have a progressively larger width in a direction away from the slopes 163c, thereby gradually reducing clearance between the horizontal rollers 157 and the guide rail 163a. Let's go. The horizontal rollers 157 are thus moved in smooth rolling contact with the guide rails 163a to adjust the wagon-type stocker 150 to a more accurate position in the stocker setting unit 160.

Instead of the vertical rollers 156 on the wagon-type stocker 150, ball casters may be mounted on the guide plate 163 such that the wagon-type stocker 150 may be mounted on the stocker. When pushed into the setter 160, the wagon-type stocker 150 may move on ball casters on the guide plate 163. The wagon-type stocker 150 may include rollers, and the stocker setting unit 160 may include a guide for positionally adjusting the wagon-type stocker 150 at the stocker setting unit 160. You may.

In this embodiment, support columns 164 are mounted on the bottom surface of the guide plate 163 to withstand the weight of the wagon-type stocker 150. The support columns 164 have a height adjustment function. The height of the entire plating apparatus from the floor is adjusted by adjusters 168 (see FIG. 25) on the bottom surface of the plating apparatus. In FIG. 25, the guide plate 163 has a left end fixed to the plating apparatus, and is adjusted to lie parallel to the floor by the height adjustment function of the support columns 164.

The stocker setting unit 160 determines whether the wagon-type stocker 150 is in the stocker setting unit 160 and the wagon-type stocker 150 at an appropriate position in the stocker setting unit 160. An unillustrated stocker detector, such as an infrared sensor or camera, for determining whether it is fixed may be provided. The stocker setting unit 160 may also include an indicator such as a lamp for indicating to the operator whether the wagon-type stocker 150 is in the stocker setting unit 160.

If the stocker detection unit does not detect the case where the wagon-type stocker 150 is fixed at an appropriate position in the stocker setting unit 160, and if the door switch 165b does not lock the door 161, The unlocking signal is not transmitted to the shutter switch 165a that locks the shutter 162. That is, the shutter 162 is kept closed. This may prevent the substrate holder 110 from experiencing a transfer difficulty caused when the wagon-type stocker 150 is installed at the wrong position in the stocker setting unit 160, or the plating unit 130. And the ambient air introduced into the substrate holder transfer part 140 can be prevented.

As shown in FIGS. 29A-29C, the latch handles 159a are mounted on sidewalls of the wagon-type stocker 150 facing the door 161. The stocker setting unit 160 includes latch receivers 159b for accommodating the respective latch handles 159a. The latch handles 159a and the latch receivers 159b together make up a latch or stocker lock 159 for locking the wagon-type stocker 150 to the stocker setting unit 160. . The door 161 has latch guides 169 on its surface facing the wagon-type stocker 150 for guiding the respective latch handles 159a.

FIG. 29A is a schematic diagram illustrating the relationship between the latch guides 169 on the door 161 of the stocker setting unit 160 and the latch handles 159a on the wagon-type stocker 150. FIG. 29B is a side view illustrating a relationship between the surface of the door 161 on which the latch guides 169 are mounted and the latch handles 159a. 29C is an end view of the door 161 with the latch guides 169 mounted thereon.

When the latch handles 159a are engaged with the latch receivers 159b, the wagon-type stocker 150 is locked at a position in the stocker setting unit 160. The latch handles 159a engage the latch receivers 159b while the latch handles 159a are being pushed by the latch receivers 159b under reaction forces from the compressed elastic block 167. .

The latch guides 169 are disposed on an inner side of the door 161 facing the wagon-type stocker 150 when the wagon-type stocker 150 is disposed in the stocker setting unit 160. . As shown in FIG. 29C, the latch guides 169 are in the form of ledges protruding from the door 161 and extending in a substantially horizontal direction, and the latch handles 159a are closed. It is molded to hold | maintain in between. In order to install the wagon-type stocker 150 in the stocker setting unit 160 and to close the door 161, the latch handles 159a are substantially horizontal so as to be held between the latch guides 169. It needs to be directed in the direction.

In order to direct the latch handles 159a in a substantially horizontal direction, the wagon-type stocker 150 needs to be pushed into a predetermined position in the stocker setting unit 160. When the wagon-type stocker 150 is at a predetermined position in the stocker setting unit 160, the wagon-type stocker 150 includes the latch handles 159a and the latch receiver 159b. The latch 159 is locked to the stocker setting unit 160. If the latch handles 159a are not oriented substantially in the horizontal direction, the latch handles 159a and the latch receiver 159b interfere with each other, thereby preventing the door 161 from being closed. Therefore, the door 161 cannot be closed unless the wagon-type stocker 150 is pushed into a predetermined position in the stocker setting unit 160.

In this manner, the wagon-type stocker 150 may be installed and locked at a predetermined position in the stocker setting unit 160. The wagon-type stocker 150 is adapted to counteract an unshown switch and excessive movement to detect when the latch handles 159a engage the latch receivers 159b at an appropriate position. It may be provided with an actuator, not shown, for securing the latch handles 159a.

As shown in FIGS. 23, 25, and 26, the drain pan 158 is disposed below or below the wagon-type stocker 150. As shown in FIG. 25, the stocker setting section is adapted to take the substrate holder 110 held by the substrate holder transport section 140 through and into the stocker setting section 160 and from the stocker setting section 160. An opening 166 is formed above the 160. The opening 166 is set smaller than the drain pan 158 in the wagon-type stocker 150. Accordingly, when the shutter 162 is opened and liquid droplets fall through the opening 166, the liquid droplets are received by the drain pan 158 in the wagon-type stocker 150 and drop on the floor. It does not become dirty.

The stocker setting unit 160 may have a size large enough to place the wagon-type stocker 150 therein. However, when the wagon-type stocker 150 is disposed in the stocker setting unit 160 so that excessive amount of ambient air is not introduced into the plating unit 130 when the shutter 162 is opened, the wagon It is preferable not to leave a large space between the type stocker 150 and the stocker setting unit 160. Regardless of whether the wagon-type stocker 150 is disposed in the stocker setting section 160, the change in the area of the openings through which ambient air is drawn into the plating apparatus is minimized, and also the internal air and liquid droplets are minimized. In order to prevent them from exiting the plating apparatus, partitions not shown may be provided around the wagon-type stocker 150.

According to the plating apparatus of the embodiment, even when the plating apparatus is in operation, the wagon-type stocker 150 is removed from the plating apparatus, i.e., the plating apparatus of the plating apparatus, without interrupting the operation of the plating apparatus. It can be pulled from the outside of the outer panel. Accordingly, the wagon-type stocker 150 may be taken out of the plating apparatus, and the substrate holders 110 may be serviced without degrading the operation utility of the plating apparatus. In order to take the wagon-type stocker 150 from or into the plating apparatus while the plating apparatus is in operation, taking into account the operating safety of the plating apparatus and also accessing the wagon-type stocker 150. Due to this, it is desirable to make efforts to minimize air stream disturbances in the plating apparatus. If the wagon-type stocker 150 is approaching while the plating apparatus is not in operation, these requirements for operating safety of the plating apparatus and minimizing airflow disturbances must be met, and while the plating apparatus is in operation, More rigorous must be met.

While the substrate holder transfer part 140 places the substrate holder 110 into the wagon-type stocker 150 or removes the substrate holder 110 from the wagon-type stocker 150, the plating apparatus Preferably, the wagon-type stocker 150 is controlled to lock against removal from the plating apparatus. Therefore, the plating apparatus includes a substrate holder transfer part control unit 210 (see FIG. 30) for identifying and controlling operating states of the substrate holder transfer part 140.

30 is a block showing connections between the control unit 200, the substrate holder transfer unit 140, the stocker setting unit 160, the stocker access indicator 250, and the accessible / inaccessible display 260 of the plating apparatus. It is also. As shown in FIG. 30, the plating apparatus includes the substrate holder transfer unit control unit 210, the stocker setting unit control unit 220, an indication controller 230, and a display control unit 240 therein. It includes a control unit 200.

The substrate holder transfer part control unit 210 monitors and controls the substrate holder transfer part 140 and receives a signal detected from a sensor 144 (see FIGS. 4A to 4C) mounted on the substrate holder transfer part 140. Receive. The stocker setting unit controller 220 may include the door 161, a door switch 165b for locking the door 161, the shutter 162, and a shutter 165a for locking the shutter 162. Monitor and control the various components of the stocker setting unit 160, including.

The display controller 230 receives an access indication from the stocker access indicator 250. The display control unit 240 is received from the stocker setting unit control unit 220 and the substrate holder transfer unit control unit 210, the stocker setting unit based on the information on whether the stocker setting unit 160 is accessible. Control the accessible / inaccessible display 260 to indicate accessible or inaccessible to 160.

The stocker access indicator (hereinafter referred to as “indicator”) 250 starts the process of taking the wagon-type stocker 150 from the stocker setting unit 160 and the wagon-type stocker 150. The display holder 230 displays the end of the process of returning the signal to the stocker setting unit 160 and restricts access to the stocker setting unit 160 by the substrate holder transfer unit 140. Send control unit 210 is controlled. The indicator 250 may be in the form of a dedicated button provided near the rear surface of the plating apparatus or a touch-panel button for inputting a processing command. The indicator 250 displays the approach to the wagon-type stocker 150 in the display control unit 230 which transfers the display to the substrate holder transfer unit control unit 210. The substrate holder transfer part control unit 210 restricts access to the stocker setting unit 160 by the substrate holder transfer part 140.

When the indicator 250 displays the impending access to the wagon-type stocker 150 to the display controller 230, the display controller 230 transmits the display to the stocker setting controller 220. do. The stocker setting unit control unit 220 is based on the state of the stocker setting unit 160 and the operation state of the substrate holder transfer unit 140 as grasped by the substrate holder transfer unit control unit 210. Decide whether or not to be accessible. The accessible / inaccessible display 260 displays the determined accessible or inaccessible to the operator.

The accessible / inaccessible display 260 may comprise a lamp, a GUI screen image, or a buzzer to indicate accessible or inaccessible to the operator or device user. The accessible / non-accessible display 260 may allow the operator to easily recognize whether the stocker setting unit 160 is accessible and the state of the stocker setting unit 160 so that the wagon-type stocker ( 150 may display information about whether the stocker setting unit 160 is installed.

While the substrate holder transfer part 140 is in operation to store the substrate holder 110 in the wagon-type stocker 150, access to the wagon-type stocker 150 is prohibited, and the stocker setting part controller 220 determines inaccessibility to the wagon-type stocker 150. When the stocker setting unit controller 220 determines that the wagon-type stocker 150 is inaccessible, the door 161 is reliably locked against an accidental opening.

The door 161 is locked by a switch 165 composed of a combination of a shutter switch 165a for locking the shutter 162 and a door switch 165b for locking the door 161.

Even when the shutter 162 is opened, in order to cope with a situation in which the door 161 is opened for some reason such as a failure of the door switch 165b for locking the door 161, the door is opened. 161 may include an opening / closing sensor (not shown), and an interlock mechanism may be used to generate an error signal based on the signal from the opening / closing sensor, and detect a case in which the door 161 is opened. have.

In this embodiment, the sensor 144 (see FIGS. 4A-4C) mounted on the substrate holder transfer part 140 also includes the number and positions of substrate holders 110 stored in the wagon-type stocker 150. It is used as a sensor for detecting them. When the plating apparatus is enlarged and initialized, the sensor 144 detects the number and positions of the substrate holders 110 stored in the wagon-type stocker 150. Subsequently, according to an instruction for starting the plating process, the substrate holder transfer part 140 removes the substrate holder 110 from the wagon-type stocker 150. The control unit 200 of the plating apparatus grasps each time the substrate holder 110 is taken from the wagon-type stocker 150. Accordingly, just before the wagon-type stocker 150 is removed from the stocker setting unit 160, how many substrate holders 110 are stored in the wagon-type stocker 150 of the plating apparatus. The control unit 200 can recognize. In addition, the substrate holders 110 may be detected and checked again just before the wagon-type stocker 150 is removed from the stocker setting unit 160.

The wagon-type stocker 150 is removed from the plating apparatus, the substrate holders 110 stored therein are serviced, and the wagon-type stocker 150 is returned to the plating apparatus. When the wagon-type stocker 150 returns to the stocker setting unit 160, the sensor 144 detects the substrate holders 110 in the wagon-type stocker 150. At this time, the sensor 144, the wagon-type stocker 150 is detected after the wagon-type stocker 150 is returned to the stocker setting unit 160, the wagon-type stocker 150 is the stocker If the number is greater than the number of substrate holders 110 detected before being taken from the setting unit 160, a warning signal may be issued. The sensor 144 warns because the increased number of substrate holders 110 means that the wagon-type stocker 150 does not have a space for the substrate holder 101 used in the plating apparatus to return. Issue a signal.

When the wagon-type stocker 150 is removed from the plating apparatus, the substrate holder 110 stored therein is serviced, and then the serviced substrate holder 110 is returned to the wagon-type stocker 150. In addition, the serviced substrate holder 110 may be stored in the wagon-type stocker 150 at a location different from the original location from which it was removed. At this time, if the serviced substrate holder 110 is returned to the wagon-type stocker 150, the substrate holders 110 are detected as described above, and the Location information of the substrate holders 110 is updated. Therefore, when the substrate holder transporter 140 returns the substrate holder 110 to the wagon-type stocker 150, the substrate holder 110 should be stored at a position already occupied by another substrate holder 110. If so, the sensor 144 detects the substrate holder 110 that has already occupied the position, and generates a signal to stop the substrate holder transporter 140 from returning the substrate holder 110. The sensor 144 is not necessarily installed in the substrate holder transfer part 140, but any position capable of detecting the number and positions of the substrate holders 110 stored in the wagon-type stocker 150. It can also be installed in.

In order to ensure that the wagon-type stocker 150 is taken into and out of the stocker setting section 160, the wagon-type stocker 150 is brought into the stocker setting section 160 and into the stocker. When taken from the setting section 160, the substrate holder transfer section 140 is prevented from moving to the position above the stocker setting section 160. The substrate holder transfer part 140 is prevented from moving to the position above the stocker setting part 160 by, for example, a servo motor driver for moving the substrate holder transfer part 140.

Hereinafter, a procedure for placing the wagon-type stocker 150 into the stocker setting unit 160 or removing the wagon-type stocker 150 from the stocker setting unit 160 will be described with reference to FIGS. 31A to 31E. This will be described. 31A-31E schematically illustrate a procedure for placing the wagon-type stocker 150 into the stocker setting unit 160 or removing the wagon-type stocker 150 from the stocker setting unit 160. A perspective view.

First, as shown in FIG. 31A, the wagon-type stocker 150 is moved to a position near the door 161 of the stocker setting unit 160. And, as shown in Figure 31b, the door 161 is opened. The door 161 may be opened manually or may automatically open when the sensor detects an approaching wagon-type stocker 150. And, as shown in Figure 31c, the wagon-type stocker 150 is moved to a predetermined position in the stocker setting unit 160. As shown in FIG. 31D, it is confirmed that the wagon-type stocker 150 is disposed at a predetermined position in the stocker setting unit 160, and then the door 161 is closed. As shown in FIG. 31E, the wagon-type stocker 150 is disposed at a predetermined position in the stocker setting unit 160, and after confirming that the door 161 is closed, the stocker setting unit The shutter 162 in 160 is opened. The stocker setting unit 160 may include a display for indicating that the shutter 162 is opened and the wagon-type stocker 150 is ready for plating.

The wagon-type stocker 150 is removed from the stocker setting unit 160 as follows.

First, as shown in FIG. 31D, after confirming that the door 161 is closed, the shutter 162 is closed. And, as shown in Figure 31c, the door 161 is opened. The wagon-type stocker 150 now begins to move from the stocker setting unit 160. As shown in FIG. 31B, the wagon-type stocker 150 is moved from the stocker setting unit 160 until the wagon-type stocker 150 is completely separated from the stocker setting unit 160. . As shown in FIG. 31A, after confirming that the wagon-type stocker 150 is completely separated from the stocker setting unit 160, the door 161 is closed.

Hereinafter, a process for disposing the wagon-type stocker 150 in the stocker setting unit 160 or removing the wagon-type stocker 150 from the stocker setting unit 160 will be described later with reference to FIG. 32. Shall be. 32 is a flowchart of the above procedure, in which successive steps are indicated with reference numerals using the prefix "S".

When the plating apparatus is in normal operation, the wagon-type stocker 150 is disposed in the stocker setting unit 160, the door 161 is closed and locked, and the shutter 162 is opened (step) S101).

When the wagon-type stocker 150 needs to be removed from the stocker setting unit 160 in order to service the substrate holders 110 in the wagon-type stocker 150, for example, the indicator 250. Transmits the start indication of the process of taking the wagon-type stocker 150 from the stocker setting section 160, the display control section 230 receives the display from the indicator 250 (step S102). ). When the display controller 230 receives the display from the indicator 250, the substrate holder transfer unit 210 checks the state of the substrate holder transfer unit 140. The stocker setting unit control unit 220 is based on the state of the substrate holder transfer unit 140 confirmed by the substrate holder transfer unit control unit 210, for example, the substrate holder transfer unit 140 is a substrate holder 110 to the The wagon-type stocker based on whether it is being removed from the wagon-type stocker 150 or whether the substrate holder conveyance unit 140 has placed the substrate holder 110 in the wagon-type stocker 150. It is determined whether 150 is accessible or inaccessible (step S103).

When the stocker setting unit controller 220 determines that the wagon-type stocker 150 is inaccessible, the display control unit 240 displays the access to indicate that the wagon-type stocker 150 is inaccessible. Enable / disable display 260 is controlled (step S104). At this time, the door 161 cannot be opened while being locked. If the stocker setting part controller 220 determines that the state of the substrate holder transfer part 140 is subsequently changed after a while and the wagon-type stocker 150 is accessible, control proceeds to step S105.

If the stocker setting unit controller 220 determines that the wagon-type stocker 150 is accessible, the display controller 240 displays the accessible / access to indicate that the wagon-type stocker 150 is accessible. The impossible display 260 is controlled (step S105). The shutter 162 is closed and locked by the switch 165a, and the door 161 is released by the switch 165b to release the interlock mechanism. The stocker setting unit control unit 220 now allows the door 161 to be opened (step S106).

When the door 161 is opened to allow access to the wagon-type stocker 150, the stocker lock or latches 159 may be manually released. Removal of the wagon-type stocker 150 from the stocker setting unit 160 is detected by the stocker setting unit control unit 220 through a sensor mounted on the stocker setting unit 160 (step S107). .

After the wagon-type stocker 150 is removed from the stocker setting unit 160, the door 161 is closed, and the closing of the door 161 is detected by the stocker setting unit controller 220. (Step S108). Substrate holders 110 in the wagon-type stocker 150 removed from the stocker setting unit 160 are taken out of the wagon-type stocker 150 and serviced (step S109). When the service of the substrate holders 110 is completed, the door 161 is opened so that the wagon-type stocker 150 returns to the stocker setting unit 160. Opening of the door 161 is detected by the stocker setting unit control unit 220 (step S110).

The wagon-type stocker 150 is disposed in the stocker setting unit 160 and then locked by the stocker lock or latches 159. Locking of the wagon-type stocker 150 in the stocker setting section 160 by the stocker lock or latches 159 is detected by the stocker setting section controller 220 (step S111). After the wagon-type stocker 150 is disposed in the stocker setting unit 160 and locked therein by the stocker lock or latches 159, the door 161 is closed. Closing of the door 161 is detected by the stocker setting unit controller 220 (step S112).

When the indicator 250 transmits the completion indication of the installation of the wagon-type stocker 150, the display control unit 230 receives the indication from the indicator 250 (step S113). The stocker setting unit controller 220 controls the switch 165b to lock the door 161, and also controls the switch 165a to release and open the shutter 162 (step S114). After the shutter 162 is closed in step S105, the shutter 162 is kept closed to block the ambient air introduced to step S114.

In the embodiment, the wagon-type stocker 150 stores the substrate holders 110 therein. When the plating apparatus is an electroplating apparatus for performing electroplating, the wagon-type stocker 150 may store anode holders to be used in the plating baths therein, or the substrate holders 110 and the anodes. Both holders may be stored. When substrate holders 110 and anode holders are stored in the wagon-type stocker 150, the substrate holder storage area for storing the substrate holders 110 in the wagon-type stocker 150 also includes anode holders. Functions as an anode holder storage area for storage.

The anode holder holding the anode is disposed in the plating liquid of the plating bath. In the plating bath, the anode held by the anode holder and the substrate 500 held by the substrate holder 110 are disposed in such a manner that their surfaces face each other in parallel with each other. When a plating power supply supplies current between the anode and the substrate 500, the plated surface of the substrate 500 exposed from the substrate holder 110 is electroplated. A similar anode holder in the outer profile for the substrate holder 110 shown in FIG. 3 comprises a body, a hanger, and a handlebar, for example holding an anode on the body. The anode held by the anode holder is electrically connected to power feeder contacts on the hanger in substantially the same manner as shown in FIG. 3.

The anode holder is disposed in the wagon-type stocker 150 as follows: First, the anode holder is pulled upward from the plating bath. The anode holder usually has an anode back to prevent the scattering of the anode slime. Therefore, when the anode holder is pulled upward from the plating bath, the plating liquid drips continuously from the anode bag for several minutes. After the plating liquid drops drip at sufficiently spaced intervals, the anode holder is rinsed in a rinse bath. When most of the rinse water is removed from the anode holder, the anode holder is moved back to the wagon-type stocker 150. The plating liquid is still drained from the anode holder after the anode holder is stored in the wagon-type stocker 150, so that the drain pan 158 on or under the bottom of the wagon-type stocker 150 ) Accepts and holds the dipped plating liquid.

The wagon-type stocker 150 storing anode holders provides the same advantages as those of the wagon-type stocker 150 storing substrate holders 110. Specifically, the wagon-type stocker 150 may be pulled from the plating apparatus, and anode holders may be taken out of the wagon-type stocker 150 and from the wagon-type stocker 150 outside the plating apparatus. As such, less burden is placed on the operator than if anode holders were taken into and out of the wagon-type stocker manually or by hoist in the plating apparatus.

In this embodiment, the wagon-type stocker 150 is used as the stocker. For example, a stocker configured to move into and out of the stocker setting portion along rails may be used in place of the wagon-type stocker 150.

While certain preferred embodiments of the present invention have been shown and described in detail, it is evident that various changes and modifications are possible without departing from the scope of the appended claims.

Claims (31)

As plating device,
A plating unit for plating a substrate;
A substrate holder for holding the substrate;
A substrate holder transfer unit for holding and transferring the substrate holder;
A stocker for storing the substrate holder; And
It comprises a stocker setting unit for storing the stocker therein,
And the stocker comprises a moving mechanism for moving the stocker into or from the stocker setting unit. The method of claim 1,
And the moving mechanism includes a caster for moving and separating the stocker from the plating apparatus. The method of claim 1,
The stocker setting unit,
An optionally openable door; And
And a shutter that is selectively openable and closed to isolate the atmosphere in the stocker setting portion and the atmosphere in the plating apparatus when the door is opened. The method of claim 1,
And the substrate holder transfer part includes a sensor for detecting whether the substrate holder exists in the stocker or the position of the substrate holder in the stocker. The method of claim 1,
A control unit for monitoring and controlling the states of the substrate holder transfer unit and the stocker setting unit; And
Plating apparatus further comprises a display unit for displaying the movement of the stocker relative to the control unit. The method of claim 1,
And the stocker includes a latch handle for locking the stocker in the stocker setting unit, and the stocker setting unit includes a latch receiver for engaging the latch handle. The method of claim 1,
The stocker setting unit includes a door switch for limiting the opening of the door and a shutter switch for limiting the opening of the shutter, wherein the door switch and the shutter switch operate together. Removing the substrate holder from the stocker;
Holding the substrate with the substrate holder;
Transferring the substrate holder holding the substrate to the plating portion by a substrate holder transfer portion;
Plating the substrate in the plating part; And
A plating method for controlling a plating apparatus to automatically perform the step of transferring the substrate holder back to the stocker using the substrate holder transfer unit.
The plating method includes the step of moving the stocker from the plating apparatus by using the moving mechanism of the stocker while the plating apparatus automatically performs the steps. 9. The method of claim 8,
And the moving mechanism includes a caster for moving and separating the stocker from the plating apparatus. 9. The method of claim 8,
And displaying the movement of the stocker from the plating apparatus with respect to the control unit of the plating apparatus before the stocker is moved out of the plating apparatus while the plating apparatus performs the steps automatically. 9. The method of claim 8,
Closing the shutter to isolate the interior of the plating apparatus from ambient air before the stocker is moved from the plating apparatus; And
And opening the shutter to allow the substrate holder transfer part to approach the stocker after the stocker is moved into the plating apparatus. A stocker for storing a substrate holder for use in a plating apparatus,
A substrate holder storage area for storing the substrate holder therein; And
Including a moving mechanism,
The stocker is moved and separated from the plating apparatus by the moving mechanism. The method of claim 12,
The stocker includes a drain pan disposed at the bottom thereof. The method of claim 12,
The substrate holder storage area is a stocker capable of storing an anode holder therein. A stocker for storing an anode holder for use in a plating apparatus,
An anode holder storage area for storing the anode holder therein;
A drain pan disposed at the bottom thereof; And
Including a moving mechanism,
The stocker is moved and separated from the plating apparatus by the moving mechanism. As plating device,
A substrate holder for detachably holding a substrate;
A table for placing the substrate holder in a horizontal direction thereon;
A plating portion having a plating bath for immersing the substrate on a vertical surface of a plating liquid to arrange the substrate held by the substrate holder; And
And a substrate holder transfer part for transferring the substrate holder between the table and the plating part, including a holding part for holding the substrate holder.
The table has a horizontal moving mechanism that is movable in the horizontal direction while supporting the lower end of the substrate holder,
The substrate holder transfer portion moves the holding portion in a vertical direction along with a lower end of the substrate holder supported by the horizontal movement mechanism to move in the horizontal direction, thereby moving the attitude of the substrate holder vertically. Plating apparatus comprising a vertical movable arm for converting from the horizontal state to the vertical state from the horizontal state. 17. The method of claim 16,
And a sensor for detecting whether the substrate holder transporter is holding the substrate holder or a distance to the substrate holder held by the substrate holder transporter. 18. The method of claim 17,
The vertical movable arm stops operation if the sensor detects that the substrate holder transfer part is not holding the substrate holder or the distance to the substrate holder held by the substrate holder transfer part deviates from a reference value. Plating equipment. 17. The method of claim 16,
The substrate holder includes a round handle bar, the holding unit is a plating apparatus for holding the round handle bar. 20. The method of claim 19,
The holding unit is a plating apparatus having a shape for rotatably supporting the round handle bar. 17. The method of claim 16,
The lower end of the substrate holder to be supported by the horizontal moving mechanism, the plating apparatus having a semi-circular portion in contact with the horizontal moving mechanism. 17. The method of claim 16,
And the horizontal moving mechanism is biased in a direction for lowering the holding part by a weight suspended from the horizontal moving mechanism. 17. The method of claim 16,
The substrate holder transfer unit, the plating apparatus including a clamper for preventing the substrate holder from swinging while the substrate holder is transferred. A method of converting the attitude of a substrate holder for detachably holding a substrate,
Holding one end of the substrate holder by using a holding portion of the substrate holder transfer portion;
Moving the substrate holder held by the holding portion above a table;
Lowering the holding portion to contact the other end of the substrate holder with the horizontal moving mechanism on the table; And
And lowering the holding portion to move the horizontal moving mechanism in a horizontal direction to convert the attitude of the substrate holder from a vertical state to a horizontal state. 25. The method of claim 24,
Detecting whether the substrate holder transfer part is holding the substrate holder or a distance to the substrate holder held by the substrate holder transfer part using a sensor; And
Stopping the operation of the holding unit if the sensor detects that the substrate holder transfer unit is not holding the substrate holder or the distance to the substrate holder held by the substrate holder transfer unit deviates from a reference value. It further comprises a method. 25. The method of claim 24,
Moving the substrate holder transfer part in a horizontal direction to tilt the substrate holder at a predetermined angle after the other end of the substrate comes in contact with the horizontal moving mechanism. As the plating method,
Disposing a substrate holder on the table;
Mounting and holding a substrate using the substrate holder disposed on the table;
Holding one end of the substrate holder by using a holding portion of the substrate holder transfer portion;
Raising the substrate holder transfer part and moving a horizontal moving mechanism on the table in a horizontal direction to convert the attitude of the substrate holder from a horizontal state to a vertical state;
Moving the substrate holder to a position above the plating bath holding the plating liquid by using the substrate holder transfer portion; And
And lowering the substrate holder by using the substrate holder transfer part to immerse the substrate in the plating solution of the plating bath. As plating device,
A substrate holder for detachably holding a substrate;
A table for placing the substrate holder in a horizontal direction thereon;
A plating portion having a plating bath for immersing the substrate on a vertical surface of a plating liquid to arrange the substrate held by the substrate holder;
A substrate holder transfer part for transferring the substrate holder between the table and the plating part, including a holding part for holding the substrate holder; And
It comprises a substrate holder opening and closing mechanism for opening and closing the substrate holder disposed on the table,
The substrate holder,
A movable support member having a rotation support member, and
A fixed support member for gripping the substrate in cooperation with the movable support member removably fixed to the fixed support member,
The substrate holder opening and closing mechanism,
A head portion provided with at least a portion rotatable to fix the movable support member to the fixed support member and to release the movable support member from the fixed support member;
A first actuator for vertically moving the head portion, and
And a second actuator for rotating at least a portion of the head portion, wherein the movable support member is removably held by the head portion. 29. The method of claim 28,
The head portion includes a presser disc having a rotating plate and a hanging hook for holding the movable support member to press the movable support member.
The support member includes a lobe,
The fixed support member includes a clamper,
The rotating plate is connected to the shaft and rotated to rotate the support member when the shaft is pushed by the second actuator,
The lobe is fitted with the clamper in response to the rotation of the support member to fix the movable support member to the fixed support member or to move the movable support member to a position for hanging by the hanging hook. Plating equipment. 30. The method of claim 29,
And the head portion includes a substrate position detecting portion for checking a position of the substrate in the substrate holder. 30. The method of claim 29,
The presser disc has a pressing block for pressing the movable support member, wherein the pressing block includes a preload spring disposed therein.

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