GB1310610A - Electro-less nickel plating compositions - Google Patents
Electro-less nickel plating compositionsInfo
- Publication number
- GB1310610A GB1310610A GB1744470A GB1744470A GB1310610A GB 1310610 A GB1310610 A GB 1310610A GB 1744470 A GB1744470 A GB 1744470A GB 1744470 A GB1744470 A GB 1744470A GB 1310610 A GB1310610 A GB 1310610A
- Authority
- GB
- United Kingdom
- Prior art keywords
- salt
- litre
- mole
- bath
- april
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
Abstract
1310610 Ni plating bath SCHERING AG 13 April 1970 [17 April 1969] 17444/70 Heading C7F An aqueous Ni plating bath has pH> 11 and contains a Ni salt, a complex former, N 2 H 4 or a salt thereof, and at least 0À05 mole/litre of a water-soluble salt of phosphoric or carbonic acid. Preferred concentrations are: Ni salt (e.g. NiCl 2 , NiSO 4 , Ni acetate) 0À01 to 0À5 mole/litre; complex former, (e.g. ammonia, an alkanolamine such as ethanolamine or a pyrophosphate) 0À01 to 4À0 mole/ litre; N 2 H 4 or salt, e.g. the sulphate, 0À01 to 4À0 mole/litre and water-soluble salt (e.g. the phosphate or carbonate of Na, K, NH 4 , or N 2 H 5 ) 0À05 to 1 mole/litre. The pH may be established with an alkali metal hydroxide, e.g. up to 3m/l of NaOH, and there may be added to the bath 0À002 to 0À1 m/l of NaH 2 PO 2 , a stabilizer which is a salt of Pb, Cd, Bi, Tl, Sn or a cyanide, e.g. of an alkali metal, in an amount of 10<SP>-6</SP> to 10<SP>-3</SP> m/l or a salt of Co, Ge, Sn, or Tl, 10<SP>-4</SP> to 10<SP>-2</SP> m/l. The bath may be covered with an inert liquid, e. g. an aliphatic or aromatic hydrocarbon such as decahydro naphthalene, or a sparingly volatile ether such as di-n-butyl ether to reduce evaporation loss, in preferably used above 50 C, and steel or plastics or ceramics, suitably sensitized with PdCl 2 and then mixed in hydrazine, may be coated.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19691920152 DE1920152C3 (en) | 1969-04-12 | Chemical nickel bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1310610A true GB1310610A (en) | 1973-03-21 |
Family
ID=5731818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1744470A Expired GB1310610A (en) | 1969-04-17 | 1970-04-13 | Electro-less nickel plating compositions |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3915716A (en) |
| FR (1) | FR2045398A5 (en) |
| GB (1) | GB1310610A (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1070268B (en) * | 1976-10-19 | 1985-03-29 | Alfachimici Spa | COMPOSITION FOR THE ANELECTRIC DEPOSITION OF NICKEL-BASED ALLOYS |
| US4189324A (en) * | 1978-06-02 | 1980-02-19 | Michael Gulla | Stabilized electroless plating solutions |
| US4695489A (en) * | 1986-07-28 | 1987-09-22 | General Electric Company | Electroless nickel plating composition and method |
| US4780342A (en) * | 1987-07-20 | 1988-10-25 | General Electric Company | Electroless nickel plating composition and method for its preparation and use |
| US5622877A (en) * | 1993-03-02 | 1997-04-22 | Ramot University Authority For Applied Research & Industrial Development Ltd. | Method for making high-voltage high-speed gallium arsenide power Schottky diode |
| US5614477A (en) * | 1995-09-07 | 1997-03-25 | Kompan; Vladimir | Anti-friction additive and method for using same |
| US6080447A (en) * | 1998-05-14 | 2000-06-27 | Enthone-Omi, Inc. | Low etch alkaline zincate composition and process for zincating aluminum |
| US6183546B1 (en) * | 1998-11-02 | 2001-02-06 | Mccomas Industries International | Coating compositions containing nickel and boron |
| AU2000235165A1 (en) * | 2000-03-08 | 2001-09-17 | Mccomas, Edward | Coating compositions containing nickel and boron |
| US7976692B2 (en) * | 2008-07-25 | 2011-07-12 | Xerox Corporation | Metallization process for making fuser members |
| JP2012505970A (en) | 2008-10-16 | 2012-03-08 | アトテック・ドイチュラント・ゲーエムベーハー | Metal plating additive, substrate plating method and product obtained by this method |
| EP2671969A1 (en) | 2012-06-04 | 2013-12-11 | ATOTECH Deutschland GmbH | Plating bath for electroless deposition of nickel layers |
| KR101487890B1 (en) * | 2013-07-16 | 2015-02-03 | 한국생산기술연구원 | Electroless plating solution, method of electroless nickel plating using the same, and flexible nickel plating layer using the same |
| EP3026143A1 (en) | 2014-11-26 | 2016-06-01 | ATOTECH Deutschland GmbH | Plating bath and method for electroless deposition of nickel layers |
| EP3190208B1 (en) | 2016-01-06 | 2018-09-12 | ATOTECH Deutschland GmbH | Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys |
| EP3190209B1 (en) | 2016-01-06 | 2018-06-06 | ATOTECH Deutschland GmbH | 1-acylguanidine compounds and the use of said compounds in electroless deposition of nickel and nickel alloy coatings |
| CN115323363B (en) * | 2022-07-27 | 2023-11-28 | 惠州市安泰普表面处理科技有限公司 | Chemical nickel plating solution for aluminum alloy and preparation method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2430581A (en) * | 1944-11-29 | 1947-11-11 | Rca Corp | Metallizing nonmetallic bodies |
| US3024134A (en) * | 1953-07-24 | 1962-03-06 | Gen Motors Corp | Nickel chemical reduction plating bath and method of using same |
| US2822294A (en) * | 1954-12-31 | 1958-02-04 | Gen Am Transport | Chemical nickel plating processes and baths therefor |
| US2916401A (en) * | 1958-02-10 | 1959-12-08 | Gen Motors Corp | Chemical reduction nickel plating bath |
| US3198659A (en) * | 1962-04-09 | 1965-08-03 | Lockheed Aircraft Corp | Thin nickel coatings |
| US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
| US3438798A (en) * | 1965-08-23 | 1969-04-15 | Arp Inc | Electroless plating process |
| US3370974A (en) * | 1965-10-20 | 1968-02-27 | Ivan C. Hepfer | Electroless plating on non-conductive materials |
-
1970
- 1970-03-18 US US020828A patent/US3915716A/en not_active Expired - Lifetime
- 1970-04-13 GB GB1744470A patent/GB1310610A/en not_active Expired
- 1970-04-17 FR FR7013968A patent/FR2045398A5/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1920152B2 (en) | 1975-08-14 |
| FR2045398A5 (en) | 1971-02-26 |
| DE1920152A1 (en) | 1970-10-22 |
| US3915716A (en) | 1975-10-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |