GB1310610A - Electro-less nickel plating compositions - Google Patents

Electro-less nickel plating compositions

Info

Publication number
GB1310610A
GB1310610A GB1744470A GB1744470A GB1310610A GB 1310610 A GB1310610 A GB 1310610A GB 1744470 A GB1744470 A GB 1744470A GB 1744470 A GB1744470 A GB 1744470A GB 1310610 A GB1310610 A GB 1310610A
Authority
GB
United Kingdom
Prior art keywords
salt
litre
mole
bath
april
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1744470A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691920152 external-priority patent/DE1920152C3/en
Application filed by Schering AG filed Critical Schering AG
Publication of GB1310610A publication Critical patent/GB1310610A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1310610 Ni plating bath SCHERING AG 13 April 1970 [17 April 1969] 17444/70 Heading C7F An aqueous Ni plating bath has pH> 11 and contains a Ni salt, a complex former, N 2 H 4 or a salt thereof, and at least 0À05 mole/litre of a water-soluble salt of phosphoric or carbonic acid. Preferred concentrations are: Ni salt (e.g. NiCl 2 , NiSO 4 , Ni acetate) 0À01 to 0À5 mole/litre; complex former, (e.g. ammonia, an alkanolamine such as ethanolamine or a pyrophosphate) 0À01 to 4À0 mole/ litre; N 2 H 4 or salt, e.g. the sulphate, 0À01 to 4À0 mole/litre and water-soluble salt (e.g. the phosphate or carbonate of Na, K, NH 4 , or N 2 H 5 ) 0À05 to 1 mole/litre. The pH may be established with an alkali metal hydroxide, e.g. up to 3m/l of NaOH, and there may be added to the bath 0À002 to 0À1 m/l of NaH 2 PO 2 , a stabilizer which is a salt of Pb, Cd, Bi, Tl, Sn or a cyanide, e.g. of an alkali metal, in an amount of 10<SP>-6</SP> to 10<SP>-3</SP> m/l or a salt of Co, Ge, Sn, or Tl, 10<SP>-4</SP> to 10<SP>-2</SP> m/l. The bath may be covered with an inert liquid, e. g. an aliphatic or aromatic hydrocarbon such as decahydro naphthalene, or a sparingly volatile ether such as di-n-butyl ether to reduce evaporation loss, in preferably used above 50‹ C, and steel or plastics or ceramics, suitably sensitized with PdCl 2 and then mixed in hydrazine, may be coated.
GB1744470A 1969-04-17 1970-04-13 Electro-less nickel plating compositions Expired GB1310610A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691920152 DE1920152C3 (en) 1969-04-12 Chemical nickel bath

Publications (1)

Publication Number Publication Date
GB1310610A true GB1310610A (en) 1973-03-21

Family

ID=5731818

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1744470A Expired GB1310610A (en) 1969-04-17 1970-04-13 Electro-less nickel plating compositions

Country Status (3)

Country Link
US (1) US3915716A (en)
FR (1) FR2045398A5 (en)
GB (1) GB1310610A (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1070268B (en) * 1976-10-19 1985-03-29 Alfachimici Spa COMPOSITION FOR THE ANELECTRIC DEPOSITION OF NICKEL-BASED ALLOYS
US4189324A (en) * 1978-06-02 1980-02-19 Michael Gulla Stabilized electroless plating solutions
US4695489A (en) * 1986-07-28 1987-09-22 General Electric Company Electroless nickel plating composition and method
US4780342A (en) * 1987-07-20 1988-10-25 General Electric Company Electroless nickel plating composition and method for its preparation and use
US5622877A (en) * 1993-03-02 1997-04-22 Ramot University Authority For Applied Research & Industrial Development Ltd. Method for making high-voltage high-speed gallium arsenide power Schottky diode
US5614477A (en) * 1995-09-07 1997-03-25 Kompan; Vladimir Anti-friction additive and method for using same
US6080447A (en) * 1998-05-14 2000-06-27 Enthone-Omi, Inc. Low etch alkaline zincate composition and process for zincating aluminum
US6183546B1 (en) * 1998-11-02 2001-02-06 Mccomas Industries International Coating compositions containing nickel and boron
WO2001066825A1 (en) * 2000-03-08 2001-09-13 Mccomas, Edward Coating compositions containing nickel and boron
US7976692B2 (en) * 2008-07-25 2011-07-12 Xerox Corporation Metallization process for making fuser members
EP2347413B1 (en) 2008-10-16 2016-06-22 ATOTECH Deutschland GmbH Metal plating additive, and method for plating substrates and products therefrom
EP2671969A1 (en) 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plating bath for electroless deposition of nickel layers
KR101487890B1 (en) * 2013-07-16 2015-02-03 한국생산기술연구원 Electroless plating solution, method of electroless nickel plating using the same, and flexible nickel plating layer using the same
EP3026143A1 (en) 2014-11-26 2016-06-01 ATOTECH Deutschland GmbH Plating bath and method for electroless deposition of nickel layers
EP3190208B1 (en) 2016-01-06 2018-09-12 ATOTECH Deutschland GmbH Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys
EP3190209B1 (en) 2016-01-06 2018-06-06 ATOTECH Deutschland GmbH 1-acylguanidine compounds and the use of said compounds in electroless deposition of nickel and nickel alloy coatings
CN115323363B (en) * 2022-07-27 2023-11-28 惠州市安泰普表面处理科技有限公司 Chemical nickel plating solution for aluminum alloy and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2430581A (en) * 1944-11-29 1947-11-11 Rca Corp Metallizing nonmetallic bodies
US3024134A (en) * 1953-07-24 1962-03-06 Gen Motors Corp Nickel chemical reduction plating bath and method of using same
US2822294A (en) * 1954-12-31 1958-02-04 Gen Am Transport Chemical nickel plating processes and baths therefor
US2916401A (en) * 1958-02-10 1959-12-08 Gen Motors Corp Chemical reduction nickel plating bath
US3198659A (en) * 1962-04-09 1965-08-03 Lockheed Aircraft Corp Thin nickel coatings
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3438798A (en) * 1965-08-23 1969-04-15 Arp Inc Electroless plating process
US3370974A (en) * 1965-10-20 1968-02-27 Ivan C. Hepfer Electroless plating on non-conductive materials

Also Published As

Publication number Publication date
FR2045398A5 (en) 1971-02-26
US3915716A (en) 1975-10-28
DE1920152A1 (en) 1970-10-22
DE1920152B2 (en) 1975-08-14

Similar Documents

Publication Publication Date Title
GB1310610A (en) Electro-less nickel plating compositions
GB808104A (en) Electrodeposition of copper from aqueous alkaline cyanide solutions
GB975964A (en) Chemical metal plating
GB771943A (en) Compositions for inhibiting corrosion of both cuprous and ferrous metals by aqueous solutions
GB718574A (en) Bath for the deposit of gold alloys by electroplating
GB2080835B (en) Prevention of sludge in phosphating baths
GB1286941A (en) Chemical reduction copper plating
GB939007A (en) Bright gold electroplating
GB840870A (en) Improvements in or relating to insulin preparations
GB1054359A (en)
GB1315548A (en) Stabilized nickel plating compositions
GB1414896A (en) Electroless copper plating
US3583867A (en) Compositions for and method of dissolving nickel
GB1386718A (en) Use of phosphorus compounds in controlling corrosion of metal parts
GB1305468A (en)
GB1304424A (en)
GB1214429A (en) Surface-pretreatment of articles made from polyethylene or polypropylene or ethylene-propylene copolymers for chemical nickel-plating
GB1051383A (en)
US4036651A (en) Electroless copper plating bath
GB718573A (en) Process for the deposition of gold or gold alloys by electroplating and bath for carrying out said process
GB1383285A (en) Phosphate coatings on iron and steel
GB1260390A (en) Method of electrolessly nickel plating a substrate
GB905020A (en) Chemical copper plating
GB844358A (en) Improvements in palladium plating
GB928088A (en) Bright gold plating

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee