GB975964A - Chemical metal plating - Google Patents
Chemical metal platingInfo
- Publication number
- GB975964A GB975964A GB46327/61A GB4632761A GB975964A GB 975964 A GB975964 A GB 975964A GB 46327/61 A GB46327/61 A GB 46327/61A GB 4632761 A GB4632761 A GB 4632761A GB 975964 A GB975964 A GB 975964A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal
- hcl
- wetting agent
- specified
- cellulose
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Coatings of metal on metal or plastics are formed by immersing the surface in an aqueous bath containing a salt of the metal to be deposited, e.g. Ni, Co, Fe and Zn, a metal boron hydride as reducing agent, and at least one additional compound of one or more of the following elements: Ni, Co, Fe, Zn, Ge, As, Sb, Bi, Tl, Sn, Cd, Pb, Te or Se. Such element may be present as a cation or anion, e.g. an arsenate. Molar ratios between the constituents are specified. The additions are said to increase the reduction and plating rates. The bath may also contain buffer compounds, e.g. sodium acetate, citrate, or tartrate, and complexing agents, e.g. ethanol amine, ethylene diamine, or ammonia. Surfaces treated include nickel, copper alloys, aluminium, iron; acetyl cellulose, cellulose-acetobutyrate, P.V.C., and polyethylene. Plastic surfaces are pre-treated with (1) alkali and wetting agent, (2) AuCl2, HCl and wetting agent, (3) PdCl2 and HCl. In examples, metal plating salts specified are NiCl2, to which sodium borohydride is added and one or more of TlNO3, SnCl2, As2O3, SbCl3, PbCl2, SeO2, TeO2, CdCl2, and Tl2HAsO4.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEF32879A DE1254935B (en) | 1960-12-31 | 1960-12-31 | Aqueous bath for chemical deposition of boron-containing metal coatings |
Publications (1)
Publication Number | Publication Date |
---|---|
GB975964A true GB975964A (en) | 1964-11-25 |
Family
ID=7094838
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB46327/61A Expired GB975964A (en) | 1960-12-31 | 1961-12-27 | Chemical metal plating |
GB17054/61A Expired GB999497A (en) | 1960-12-31 | 1961-12-27 | Chemical metal plating |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB17054/61A Expired GB999497A (en) | 1960-12-31 | 1961-12-27 | Chemical metal plating |
Country Status (5)
Country | Link |
---|---|
US (1) | US3295999A (en) |
BE (1) | BE612123A (en) |
CH (1) | CH411512A (en) |
DE (1) | DE1254935B (en) |
GB (2) | GB975964A (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3483029A (en) * | 1966-07-15 | 1969-12-09 | Ibm | Method and composition for depositing nickel-iron-boron magnetic films |
DE1621206B2 (en) * | 1967-01-18 | 1971-12-16 | Friedr. Blasberg Gmbh & Co, Kg, 5650 Solingen | PROCESS FOR COATING WITH SLIDING FRICTION ON WORKPIECES STRESSED BY WEAR |
US3532541A (en) * | 1967-06-19 | 1970-10-06 | Ibm | Boron containing composite metallic films and plating baths for their electroless deposition |
US3650748A (en) * | 1968-11-22 | 1972-03-21 | Eastman Kodak Co | Photographic reproduction using novel physical developers |
US3622367A (en) * | 1970-03-24 | 1971-11-23 | Mobil Oil Corp | Contact deposition of platinum and other metals |
US3635761A (en) * | 1970-05-05 | 1972-01-18 | Mobil Oil Corp | Electroless deposition of metals |
US3649308A (en) * | 1970-05-21 | 1972-03-14 | Shipley Co | Stabilized electroless plating solutions |
DE2028950B2 (en) * | 1970-06-12 | 1976-05-13 | Shipley Co., Inc., Newton, Mass. (V.SLA.) | Aqueous solution for the electroless cutting of nickel, cobalt or its alloys |
US3859130A (en) * | 1971-04-15 | 1975-01-07 | Ibm | Magnetic alloy particle compositions and method of manufacture |
US3964914A (en) * | 1974-08-16 | 1976-06-22 | The United States Of America As Represented By The United States Energy Research And Development Administration | Electromarking solution |
US4082898A (en) * | 1975-06-23 | 1978-04-04 | Ppg Industries, Inc. | Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates |
IT1070268B (en) * | 1976-10-19 | 1985-03-29 | Alfachimici Spa | COMPOSITION FOR THE ANELECTRIC DEPOSITION OF NICKEL-BASED ALLOYS |
US4189324A (en) * | 1978-06-02 | 1980-02-19 | Michael Gulla | Stabilized electroless plating solutions |
EP0092971B1 (en) * | 1982-04-27 | 1989-08-16 | Richardson Chemical Company | Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby |
US4833041A (en) * | 1986-12-08 | 1989-05-23 | Mccomas C Edward | Corrosion/wear-resistant metal alloy coating compositions |
DE3622090C1 (en) * | 1986-07-02 | 1990-02-15 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | |
US5019163A (en) * | 1986-12-08 | 1991-05-28 | Mccomas C Edward | Corrosion/wear-resistant metal alloy coating compositions |
US4983428A (en) * | 1988-06-09 | 1991-01-08 | United Technologies Corporation | Ethylenethiourea wear resistant electroless nickel-boron coating compositions |
US5141778A (en) * | 1989-10-12 | 1992-08-25 | Enthone, Incorporated | Method of preparing aluminum memory disks having a smooth metal plated finish |
ES2027496A6 (en) * | 1989-10-12 | 1992-06-01 | Enthone | Plating aluminium |
US5147692A (en) * | 1990-05-08 | 1992-09-15 | Macdermid, Incorporated | Electroless plating of nickel onto surfaces such as copper or fused tungston |
US5213907A (en) * | 1990-10-09 | 1993-05-25 | Diamond Technologies Company | Nickel-cobalt-boron-alloy deposited on a substrate |
US5431804A (en) * | 1990-10-09 | 1995-07-11 | Diamond Technologies Company | Nickel-cobalt-boron alloy deposited on a substrate |
US5576053A (en) * | 1993-05-11 | 1996-11-19 | Murata Manufacturing Co., Ltd. | Method for forming an electrode on an electronic part |
US6183546B1 (en) | 1998-11-02 | 2001-02-06 | Mccomas Industries International | Coating compositions containing nickel and boron |
US6790364B2 (en) * | 2002-09-27 | 2004-09-14 | The Boc Group, Inc. | Process for stripping amine borane complex from an electroless plating solution |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA626999A (en) * | 1961-09-05 | G. Mcleod Henry | Amine-boranes in plating of nickel-boron and cobalt-boron alloys | |
AT190766B (en) * | 1954-05-18 | 1957-07-25 | Gen Am Transport | Process for chemical nickel plating |
DE1137918B (en) * | 1957-01-15 | 1962-10-11 | Du Pont | Bath and process for the chemical deposition of nickel-boron or cobalt-boron alloy coatings |
GB836480A (en) * | 1957-01-15 | 1960-06-01 | Du Pont | Improvements in or relating to alloy plate |
DE1068970B (en) * | 1957-02-15 | 1959-11-12 | Mond Nickel Co Ltd | Electroplating of black nickel coatings and pretreatment of the workpieces to be coated |
US2898379A (en) * | 1957-06-18 | 1959-08-04 | Callery Chemical Co | Reduction of compounds with amine boranes |
US2884344A (en) * | 1957-10-07 | 1959-04-28 | Reynolds Metals Co | Nickel plating |
GB842826A (en) * | 1957-11-15 | 1960-07-27 | Du Pont | Improvements in or relating to chemical plating |
US2990296A (en) * | 1958-08-05 | 1961-06-27 | Callery Chemical Co | Chemical plating of metal-boron alloys |
US3096182A (en) * | 1958-10-01 | 1963-07-02 | Du Pont | Chemical plating solution and process for plating therewith |
US3062666A (en) * | 1958-11-26 | 1962-11-06 | Du Pont | Bath compositions for the chemical reductive plating of nickel-boron and cobalt-boron alloys |
US2994369A (en) * | 1959-04-02 | 1961-08-01 | Pittsburgh Plate Glass Co | Nickel plating chemical composition |
-
1960
- 1960-12-31 DE DEF32879A patent/DE1254935B/en active Pending
-
1961
- 1961-12-04 CH CH1407661A patent/CH411512A/en unknown
- 1961-12-12 US US158873A patent/US3295999A/en not_active Expired - Lifetime
- 1961-12-27 GB GB46327/61A patent/GB975964A/en not_active Expired
- 1961-12-27 GB GB17054/61A patent/GB999497A/en not_active Expired
- 1961-12-29 BE BE612123A patent/BE612123A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CH411512A (en) | 1966-04-15 |
DE1254935B (en) | 1967-11-23 |
GB999497A (en) | 1965-07-28 |
US3295999A (en) | 1967-01-03 |
BE612123A (en) | 1962-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB975964A (en) | Chemical metal plating | |
US3338726A (en) | Chemical reduction plating process and bath | |
US4337091A (en) | Electroless gold plating | |
US3096182A (en) | Chemical plating solution and process for plating therewith | |
GB1386375A (en) | Nickel-plating of metals | |
GB808104A (en) | Electrodeposition of copper from aqueous alkaline cyanide solutions | |
GB718574A (en) | Bath for the deposit of gold alloys by electroplating | |
CA1188458A (en) | Electroless gold plating | |
US3148072A (en) | Electroless deposition of nickel | |
GB1310610A (en) | Electro-less nickel plating compositions | |
US3285754A (en) | Deposition of palladium | |
US3216835A (en) | Synergistic chelate combinations in dilute immersion zincate solutions for treatment of aluminum and aluminum alloys | |
GB1014271A (en) | Deposition of nickel-cobalt alloy on aluminium substrates | |
GB1272536A (en) | Electroplating solutions and process for electroplating using such solutions | |
GB1194625A (en) | Boron Containing Composite Metallic Films and Plating Baths for their Electroless Deposition | |
GB1315548A (en) | Stabilized nickel plating compositions | |
US3738849A (en) | Chemical plating solutions | |
US3150994A (en) | Chemical plating of metal-boron alloys | |
US2883288A (en) | Silver plating bath | |
US4838937A (en) | Stabilized alkaline gold bath for the electro-less deposition of gold | |
GB1198193A (en) | Prevention of Skip Plating in an Electroless Nickel Bath | |
GB1232245A (en) | ||
GB1219201A (en) | Stabilized chemical coppering liquids | |
GB1304424A (en) | ||
JPH0413434B2 (en) |