GB1386375A - Nickel-plating of metals - Google Patents
Nickel-plating of metalsInfo
- Publication number
- GB1386375A GB1386375A GB1274672A GB1274672A GB1386375A GB 1386375 A GB1386375 A GB 1386375A GB 1274672 A GB1274672 A GB 1274672A GB 1274672 A GB1274672 A GB 1274672A GB 1386375 A GB1386375 A GB 1386375A
- Authority
- GB
- United Kingdom
- Prior art keywords
- salt
- mil
- acid
- march
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 title abstract 4
- 239000002184 metal Substances 0.000 title abstract 4
- 150000002739 metals Chemical class 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 6
- 150000003839 salts Chemical class 0.000 abstract 4
- 239000000243 solution Substances 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 abstract 2
- DLLMHEDYJQACRM-UHFFFAOYSA-N 2-(carboxymethyldisulfanyl)acetic acid Chemical compound OC(=O)CSSCC(O)=O DLLMHEDYJQACRM-UHFFFAOYSA-N 0.000 abstract 1
- IGWFHAFFBQEUIX-UHFFFAOYSA-N 2-sulfanyl-1,2-benzothiazine Chemical compound C1=CC=C2C=CN(S)SC2=C1 IGWFHAFFBQEUIX-UHFFFAOYSA-N 0.000 abstract 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 230000001464 adherent effect Effects 0.000 abstract 1
- 229910001515 alkali metal fluoride Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 229910000085 borane Inorganic materials 0.000 abstract 1
- 230000003197 catalytic effect Effects 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 229910052500 inorganic mineral Inorganic materials 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 239000011707 mineral Substances 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 230000001235 sensitizing effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 125000004434 sulfur atom Chemical group 0.000 abstract 1
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 abstract 1
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
Abstract
1386375 Sensitizing; coating with Ni; electroplating E I DU PONT DE NEMOURS & CO 17 March 1972 [17 March 1971] 12746/72 Headings C7B and C7F Al, Mg, or Zn, or alloys therebetween are contacted with aqueous solution containing HF and a soluble metal salt or oxide, said metal being Ni, Fe, Ag, Mn, Pd or Co, and being displaceable by Al, Mg and/or Zn to provide a catalytic surface on the substrate, and then electrolessly Ni-plated from a solution containing an organic S compound having one or two organic groups attached to the S atom, the HF concentration and contact time in step 1 being such that in step 2 a continuous adherent Ni coating is obtained. The HF solution may contain 1-25 wt per cent HF, or may contain an HF source such as NH 4 HF 2 or alkali metal fluoride, and is used at 25-45C; the concentration of metal salt or oxide may be 5-50%; the salt may be a mineral acid salt or an acetate; contact with this solution in the absence of electric current for 0.5-10 minutes or 1-10 seconds if an electric current is used. The Ni bath may be an amine-borane bath of pH 6-7; the S compound (0.001-5 g/l) may be thiodiglycolic acid, mercaptoacetic acid, dithiodiglycolic acid, or 2-mercapto-benzothiazine, and the Ni layer may be more than 0.1 mil thick, e.g. 0.2 to 1 mil if electro-nickel from NaBH 4 or NaH 2 PO 2 -type baths is to follow, or 0.2-2 mil if no overcoat is to follow. The coated body may be heat-treated at 150-300C
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12533471A | 1971-03-17 | 1971-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1386375A true GB1386375A (en) | 1975-03-05 |
Family
ID=22419260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1274672A Expired GB1386375A (en) | 1971-03-17 | 1972-03-17 | Nickel-plating of metals |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3672964A (en) |
| CA (1) | CA962538A (en) |
| GB (1) | GB1386375A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3123826A1 (en) * | 1981-06-16 | 1983-01-05 | Robert Bosch Gmbh, 7000 Stuttgart | Process for applying a well-adhering, solderable metal layer to rapidly oxidising metals |
| DE3315062A1 (en) * | 1982-04-26 | 1983-10-27 | Mitsubishi Denki K.K., Tokyo | METHOD FOR DEPOSITING SOLDER ON ALUMINUM METAL MATERIAL |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2354911A1 (en) * | 1972-11-06 | 1974-05-16 | Metallgesellschaft Ag | PROCESS FOR SURFACE TREATMENT OF ZINC OR ZINC ALLOYS |
| US3932685A (en) * | 1973-11-09 | 1976-01-13 | Motorola, Inc. | Aluminum stabilization process and stabilization solution therefor |
| US4197359A (en) * | 1975-10-21 | 1980-04-08 | Rager Edgar A | Hub for a disk storage medium |
| DE2650873A1 (en) * | 1976-11-06 | 1978-05-11 | Philips Patentverwaltung | METHOD OF MANUFACTURING AN ELECTROMAGNET |
| US4122215A (en) * | 1976-12-27 | 1978-10-24 | Bell Telephone Laboratories, Incorporated | Electroless deposition of nickel on a masked aluminum surface |
| US4196061A (en) * | 1978-08-21 | 1980-04-01 | Chemray Corporation | Direct nickel-plating of aluminum |
| US4235648A (en) * | 1979-04-05 | 1980-11-25 | Motorola, Inc. | Method for immersion plating very thin films of aluminum |
| US4371430A (en) * | 1979-04-27 | 1983-02-01 | Printing Developments, Inc. | Electrodeposition of chromium on metal base lithographic sheet |
| US4545867A (en) * | 1979-04-27 | 1985-10-08 | Ballarini John A | Process for the direct electrodeposition of gray chromium on aluminum base substrates such as aluminum base lithographic sheets |
| GB2074189A (en) * | 1980-04-16 | 1981-10-28 | Rolls Royce | Treating a titanium or titanium base alloy surface prior to electroplating |
| US4282266A (en) * | 1980-05-29 | 1981-08-04 | Rca Corporation | Method for determining silicon content in layers of aluminum and silicon |
| JPS5980531A (en) * | 1982-07-06 | 1984-05-10 | Honda Motor Co Ltd | Centrifugal clutch |
| US4552787A (en) * | 1984-02-29 | 1985-11-12 | International Business Machines Corporation | Deposition of a metal from an electroless plating composition |
| US4670312A (en) * | 1985-02-07 | 1987-06-02 | John Raymond | Method for preparing aluminum for plating |
| GB8515532D0 (en) * | 1985-06-19 | 1985-07-24 | Standard Telephones Cables Ltd | Surface alloys treatment |
| US4655884A (en) * | 1985-08-19 | 1987-04-07 | General Electric Company | Nickel plating of refractory metals |
| US5753304A (en) * | 1997-06-23 | 1998-05-19 | The Metal Arts Company, Inc. | Activation bath for electroless nickel plating |
| DE19855666A1 (en) * | 1998-12-01 | 2000-06-08 | Studiengesellschaft Kohle Mbh | Organoaluminum electrolytes and processes for electrolytic coating with aluminum or aluminum-magnesium alloys |
| US6669997B2 (en) | 2002-03-26 | 2003-12-30 | National Research Council Of Canada | Acousto-immersion coating and process for magnesium and its alloy |
| US7407689B2 (en) * | 2003-06-26 | 2008-08-05 | Atotech Deutschland Gmbh | Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
| CN101074479A (en) * | 2006-05-19 | 2007-11-21 | 何靖 | Method for treating magnesium-alloy workpiece, workpiece therefrom and composition therewith |
-
1971
- 1971-03-17 US US125334A patent/US3672964A/en not_active Expired - Lifetime
-
1972
- 1972-02-24 CA CA135,519A patent/CA962538A/en not_active Expired
- 1972-03-17 GB GB1274672A patent/GB1386375A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3123826A1 (en) * | 1981-06-16 | 1983-01-05 | Robert Bosch Gmbh, 7000 Stuttgart | Process for applying a well-adhering, solderable metal layer to rapidly oxidising metals |
| DE3315062A1 (en) * | 1982-04-26 | 1983-10-27 | Mitsubishi Denki K.K., Tokyo | METHOD FOR DEPOSITING SOLDER ON ALUMINUM METAL MATERIAL |
| US4848646A (en) * | 1982-04-26 | 1989-07-18 | Mitsubishi Denki Kabushiki Kaisha | Method for depositing solder onto aluminum metal material |
Also Published As
| Publication number | Publication date |
|---|---|
| CA962538A (en) | 1975-02-11 |
| US3672964A (en) | 1972-06-27 |
| DE2213161B2 (en) | 1975-09-18 |
| DE2213161A1 (en) | 1972-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] |